SFH4600-Z

Engwinklige LED im MIDLED-Gehäuse Narrow beam LED in MIDLED package Lead (Pb) Free Product - RoHS Compliant SFH 4600 SFH 4605 SFH 4600 SFH 4605 Nicht für Neuentwicklungen / Not for new designs Wesentliche Merkmale Features • Leistungsstarke GaAs-LED (35 mW) mit typischer Emissionswellenlänge 950 nm • Enger Abstrahlwinkel (± 20°) • Geringe Bauhöhe • Als Toplooker und Sidelooker einsetzbar • SFH 4600: Gurtung als Toplooker SFH 4605: Gurtung als Sidelooker • High Power GaAs-LED (35 mW) with typical peak wavelength of 950 nm • Narrow halfangle (± 20°) • Low profile component • Usable as top-looking and side-looking device • SFH 4600: Taping as Toplooker SFH 4605: Taping as Sidelooker Anwendungen Applications • Lichtschranken, Lichtvorhänge • Sensorik • IR Scheinwerfer • Interrupters, Lightcurtains • Sensors • IR floodlight Sicherheitshinweise Safety Advices Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefährlich für das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, müssen gemäß den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Typ Type Bestellnummer Ordering Code Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) SFH 4600 SFH 4605 Q65110A1575 Q65110A1576 ≥ 16 (typ. 30) ≥ 16 (typ. 30) 1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr 2008-01-14 1 SFH 4600, SFH 4605 ATTENTION - Observe Precautions For Handling - Electrostatic Sensitive Device Grenzwerte Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top , Tstg – 40 … + 100 °C Sperrspannung Reverse voltage VR 5 V Vorwärtsgleichstrom, TA ≤ 60 °C Forward current IF 100 mA Stoßstrom, tp = 300 µs, D = 0, TA ≤ 60 °C Surge current IFSM 1 A Verlustleistung TA = 25 °C Power dissipation Ptot 180 mW 340 K/W 180 K/W Wärmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgröße je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Wärmewiderstand Sperrschicht - Lötstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength at peak emission IF = 100 mA λpeak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA ∆λ 40 nm 2008-01-14 2 SFH 4600, SFH 4605 Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Abstrahlwinkel Half angle ϕ ± 20 Grad deg. Aktive Chipfläche Active chip area A 0.09 mm2 Abmessungen der aktiven Chipfläche Dimension of the active chip area L×B L×W 0.3 × 0.3 mm² Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Ω tr , tf 10 ns VF VF 1.5 (< 1.8) 3.2 (< 4.3) V V Sperrstrom Reverse current VR = 5 V IR not designed for µA reverse operation Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms Φe typ 35 mW Temperaturkoeffizient von Ie bzw. Φe, TCI IF = 100 mA Temperature coefficient of Ie or Φe, IF = 100 mA – 0.44 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV – 1.5 mV/K Temperaturkoeffizient von λ, IF = 100 mA Temperature coefficient of λ, IF = 100 mA TCλ + 0.2 nm/K Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 µs 2008-01-14 3 SFH 4600, SFH 4605 Strahlstärke Ie in Achsrichtung1) gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Symbol Werte Values -S Einheit Unit -T -U Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie max 16 32 25 50 40 80 mW/sr mW/sr Strahlstärke Radiant intensity IF = 1 A, tp = 100 µs Ie typ 160 220 280 mW/sr 1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one group in one packing unit (variation lower 2:1) Abstrahlcharakteristik Radiation Characteristics Irel = f (ϕ) 40˚ 30˚ 20˚ 10˚ ϕ 0˚ OHF02432 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 2008-01-14 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 4 100˚ 120˚ SFH 4600, SFH 4605 Relative Spectral Emission Irel = f (λ) Single pulse, tp = 20 µs OHF00777 100 Ie = f (IF) Ie 100 mA Radiant Intensity 10 Ι erel OHF02533 110 mA OHF00809 2 I F 90 Ιe Ι e (100 mA) 80 Max. Permissible Forward Current IF = f (TA), RthJA = 340 K/W 80 70 10 0 40 10 -1 20 10 -2 60 60 50 40 30 20 10 0 10 800 850 900 950 1000 nm 1100 -3 10 0 10 1 10 2 λ Forward Current IF = f (VF) Single pulse, tp = 20 µs ΙF 10 IF 3 1.2 A OHF02532 t 1.0 10 2 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 1 0.6 10 0 10 -1 0.4 10 -2 0.2 10 -3 IF T D= 0.8 10 tP D = TP 0 0.5 1 1.5 2 2.5 3 3.5 V 4.5 VF 2008-01-14 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp 5 0 20 40 60 80 ˚C 100 TA Permissible Pulse Handling Capability IF = f (τ), TA ≤ 60 °C, duty cycle D = parameter OHF00784 10 4 mA 0 10 3 mA 10 4 ΙF SFH 4600, SFH 4605 Maßzeichnung Package Outlines 1.7 1.5 0.55 0.42 0.55 0.42 0.53 0.83 0.53 2.35 2.15 Isolating area 0.75 0.83 Silicone area (1.2) 1) 3.3 2.9 0.75 1) (0.8) Pad 2 metallisation Pad 1 metallisation Backside metallisation Device casted with silicone. Avoid mechanical stress on silicone surface. OHF02956 Maße in mm / Dimensions in mm. Gehäuse / Package MID mit klarem Silikonverguss / MID casted with clear Silicone Anschlussbelegung Pin configuration Pad 1 = Anode / anode Pad 2 = Kathode / cathode Packing unit 2000/reel, ø180 mm or 9000/reel, ø330 mm 1.7 (0.067) ±0.05 (0.002) 0.3 (0.012) ±0.02 (0.001) Optical axis/viewing direction 3.25 (0.128) ±0.05 (0.002) 4 (0.157) 2 (0.079) ±0.05 (0.002) 2˚ 1.5 (0.059) +0.1 (0.004) 8 (0.315) Pad 1 Orientation 1.75 (0.069) ±0.05 (0.002) Method of Taping / Polarity and Orientation 3.5 (0.138) ±0.05 (0.002) Verpackungseinheit 2000/Rolle, ø180 mm oder 9000/Rolle, ø330 mm 2.3 (0.091) ±0.15 (0.006) Gurtung / Polarität und Lage 2.45 (0.096) ±0.05 (0.002) 3.3 (0.130) ±0.15 (0.006) OHAY2430 Maße in mm (inch) / Dimensions in mm (inch). 2008-01-14 6 SFH 4600, SFH 4605 Empfohlenes Lötpaddesign Recommended Solder Pad Design SFH 4600 2.4 1.35 Padgeometrie für verbesserte Wärmeableitung 4.0 Paddesign for improved heat dissipation Cu-Fläche > 16 mm 2 Cu-area Lötstopplack Solder resist OHF02422 SFH 4605 1.7 1.25 Padgeometrie für verbesserte Wärmeableitung 4.5 Paddesign for improved heat dissipation Cu-Fläche > 16 mm 2 Cu-area Lötstopplack Solder resist OHF02421 Maße in mm / Dimensions in mm. Verarbeitungshinweis: Das Gehäuse ist mit Silikon vergossen. Mechanischer Stress auf der Bauteiloberfläche sollte so gering wie möglich gehalten werden. Handling indication: 2008-01-14 The package is casted with silicone. Mechanical stress at the surface of the unit should be as low as possible. 7 SFH 4600, SFH 4605 Lötbedingungen Soldering Conditions Reflow Lötprofil für bleifreies Löten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020C) (acc. to J-STD-020C) OHLA0687 300 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile ˚C 255 ˚C 240 ˚C T 250 ˚C 260 ˚C +0 -5 ˚C 245 ˚C ±5 ˚C ˚C 235 ˚C +5 -0 ˚C 217 ˚C 10 s min 200 30 s max Ramp Down 6 K/s (max) 150 100 s max 120 s max 100 Ramp Up 3 K/s (max) 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2008-01-14 8