MBRF10200CT

SANGDEST MICROELECTRONICS MBRF10200CT Technical Data Data Sheet N0079, Rev. A Green Products MBRF10200CT SCHOTTKY RECTIFIER Applications: • • • • Switching power supply Converters Free-Wheeling diodes Reverse battery protection Features: • • • • • • • • • 150°C TJ operation Center tap configuration Low forward voltage drop High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance High frequency operation Guard ring for enhanced ruggedness and long term reliability This is a Pb − Free Device All SMC parts are traceable to the wafer lot Additional testing can be offered upon request OUTLINE DRAWING Mechanical Dimensions: In mm / Inches OPTION 1(CJ) OPTION 2(HD) Dim Min Max Min Max A 4.35 4.65 4.30 4.70 b 0.50 0.75 0.50 0.75 b1 1.15 1.402 1.20 1.45 b2 1.55 1.802 1.60 1.85 b3 1.55 1.65 1.50 1.75 b4 1.10 1.35 1.10 1.35 C 0.50 0.75 0.55 0.75 D 14.8 15.2 14.80 15.20 E 10.06 10.26 9.96 10.36 e 2.46 2.62 F 2.85 3.15 2.80 3.20 G 6.50 6.90 6.50 6.90 L 12.70 13.70 12.70 13.70 L1 3.40 3.80 3.40 4.00 L2 2.60 3.00 - - Q 2.60 2.80 2.50 2.90 Q1 2.50 2.90 2.50 2.90 ØR 3.40 3.60 3.30 3.70 2.55TYP • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113  (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • SANGDEST MICROELECTRONICS MBRF10200CT Technical Data Data Sheet N0079, Rev. A Green Products OPTION 3 OPTION 4 Dim Min Max Min Max A 4.53 4.93 4.50 4.90 b 0.71 0.91 0.70 0.90 b1 1.15 1.39 1.33 1.47 C 0.36 0.53 0.45 0.60 D 15.67 16.07 15.67 16.07 E 9.96 10.36 9.96 10.36 e 2.54TYP 2.54 BSC F 2.34 2.76 2.34 2.74 G 6.50 6.90 6.48 6.88 L 12.37 12.77 12.78 13.18 L1 2.23 2.63 3.03 3.43 Q 2.56 2.96 2.56 2.96 Q1 3.10 3.50 3.10 3.50 ØR 2.98 3.38 3.08 3.28 • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113  (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • SANGDEST MICROELECTRONICS MBRF10200CT Technical Data Data Sheet N0079, Rev. A Green Products OPTION 5(SR) ITO-220AB • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113  (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • SANGDEST MICROELECTRONICS MBRF10200CT Technical Data Data Sheet N0079, Rev. A Green Products Marking Diagram: Where XXXXX is YYWWL MBR F 10 200 CT SSG YY WW L = Device Type = Package type = Forward Current (10A) = Reverse Voltage (200V) = Configuration = SSG = Year = Week = Lot Number Cautions：Molding resin Epoxy resin UL:94V-0 Ordering Information: Device Package ITO-220AB (Pb-Free) MBRF10200CT Shipping 50pcs / tube For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification. Maximum Ratings: Characteristics Peak Inverse Voltage Symbol VRWM Condition - Max. 200 Units V Average Forward Current IF(AV) 50% duty cycle @TC =105 °C rectangular wave form 10 A Peak One Cycle NonRepetitive Surge Current (per leg) IFSM 8.3 ms, half Sine pulse 128 A • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113  (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • SANGDEST MICROELECTRONICS MBRF10200CT Technical Data Data Sheet N0079, Rev. A Green Products Electrical Characteristics: Characteristics Forward Voltage Drop (per leg) * Reverse Current at DC condition (per leg) Reverse Current (per leg) * Junction Capacitance (per leg) Typical Series Inductance (per leg) Max. Voltage Rate of Change RSM Isolation Voltage (t = 1.0 second, R. H. < =30%, TA = 25 °C) * Symbol VF1 VF2 IR1 IR2 CT LS dv/dt VISO Condition @ 5A, Pulse, TJ = 25 °C @ 5A, Pulse, TJ = 125 °C @VR = rated VR TJ = 25 °C @VR = rated VR TJ = 125 °C @VR = 5V, TC = 25 °C fSIG = 1MHz Measured lead to lead 5 mm from package body Clip mounting, the epoxy body away from the heatsink edge by more than 0.110" along the lead direction. Clip mounting, the epoxy body is inside the heatsink. Screw mounting, the epoxy body is inside the heatsink. Max. 0.98 0.78 Units V V 1.0 mA 7 mA 150 pF 8.0 nH 10,000 V/μs 4500 V 3500 1500 Pulse Width < 300µs, Duty Cycle