TPH3206PD
Not recommended for new
designs—see TPH3206PSB
600V GaN FET in TO-220 (drain tab)
Description
Features
The TPH3206PD 600V, 150mΩ Gallium Nitride (GaN) FET is
a normally-off device. It combines state-of-the-art high
voltage GaN HEMT and low voltage silicon MOSFET
technologies—offering superior reliability and performance.
Transphorm GaN offers improved efficiency over silicon,
through lower gate charge, lower crossover loss, and smaller
reverse recovery charge.
Related Literature
AN0009: Recommended External Circuitry for GaN FETs
AN0003: Printed Circuit Board Layout and Probing
AN0010: Paralleling GaN FETs
Ordering Information
Package
Package
Configuration
3 lead TO-220
Drain
Part Number
TPH3206PD
TPH3206PD
TO-220
(top view)
D
JEDEC qualified GaN technology
Dynamic RDS(on)eff production tested
Robust design, defined by
— Intrinsic lifetime tests
— Wide gate safety margin
— Transient over-voltage capability
Very low QRR
Reduced crossover loss
RoHS compliant and Halogen-free packaging
Benefits
Enables AC-DC bridgeless totem-pole PFC designs
— Increased power density
— Reduced system size and weight
— Overall lower system cost
Achieves increased efficiency in both hard- and softswitched circuits
Easy to drive with commonly-used gate drivers
GSD pin layout improves high speed design
Applications
Datacom
Broad industrial
PV inverter
Servo motor
Key Specifications
G
S
D
VDS (V) min
600
V(TR)DSS (V) max
750
RDS(on)eff (mΩ) max*
180
QRR (nC) typ
52
QG (nC) typ
6
* Dynamic on-resistance; see Figures 19 and 20
Common Topology Power Recommendations
Cascode Schematic Symbol
March 27, 2018
tph3206pd.7
Cascode Device Structure
CCM bridgeless totem-pole*
1519W max
Hard-switched inverter**
1717W max
Conditions: FSW=45kHz; TJ=115°C; THEATSINK=90°C; insulator between
device and heatsink (6 mil Sil-Pad® K-10); power de-rates at lower
voltages with constant current
*
VIN=230VAC; VOUT=390VDC
** VIN=380VDC; VOUT=240VAC
© 2018 Transphorm Inc. Subject to change without notice.
1
TPH3206PD
Absolute Maximum Ratings (Tc=25°C unless otherwise stated.)
Symbol
VDSS
V(TR)DSS
VGSS
PD
ID
IDM
Parameter
Limit Value
Unit
Drain to source voltage (TJ = -55°C to 150°C)
600
Transient drain to source voltage a
750
Gate to source voltage
±18
Maximum power dissipation @TC=25°C
96
W
Continuous drain current @TC=25°C b
17
A
Continuous drain current @TC=100°C b
12
A
Pulsed drain current (pulse width: 10µs)
60
A
V
(di/dt)RDMC
Reverse diode di/dt, repetitive c
1200
A/µs
(di/dt)RDMT
Reverse diode di/dt, transient d
2400
A/µs
Case
-55 to +150
°C
Junction
-55 to +175
°C
-55 to +150
°C
260
°C
Typical
Unit
TC
TJ
TS
TSOLD
Operating temperature
Storage temperature
Soldering peak temperature e
Notes:
a. In off-state, spike duty cycle D
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