4259EE51K00220

EMI CATALOG www.lairdtech.com ABOUT LAIRD Laird is a global technology business focused on enabling wireless communication and smart systems, and providing components and systems that protect electronics. Laird operates through two divisions, Wireless Systems and Performance Materials. Wireless Systems solutions include antenna systems, embedded wireless modules, telematics products and wireless automation and control solutions. Performance Materials solutions include electromagnetic interference shielding, thermal management and signal integrity products. As a leader in the design, supply and support of innovative technology, our products allow people, organisations, machines and applications to connect effectively, helping to build a world where smart technology transforms the way of life. Custom products are supplied to major sectors of the electronics industry including the handset, telecommunications, IT, automotive, public safety, consumer, medical, rail, mining and industrial markets. Providing value and differentiation to our customers though innovation, reliable fulfilment and speed, Laird PLC is listed and headquartered in London, and employs over 9,000 people in more than 58 facilities located in 18 countries. . TABLE OF CONTENTS EMI INTRODUCTION 2 EMI SUMMARY 3 BOARD LEVEL SHIELDS 6 Product Selection Guide 6 Introduction 8 Standard Design Shields 9 EZ Peel™ 11 Rigid Corner 11 ReCovr™ 12 ReMovl 12 Overview 13 FINGERSTOCK Product Selection Guide Introduction Mounting Methods Ordering Information UltraSoft® Series Recyclable Clean Copper Slot Mount Series Dual Slot Series Teardrop Series Compact PCI Symmetrical Mount Alternate Slot Series Variable Slot Mount Symmetrical (S3) Slotted Shielding Solid Top (S3) Symmetrical Slotted Shielding Clip-On Symmetrical Shielding No Snag Gasket All-Purpose Series Clip-On Series Low Profile Hook-On Gasket Low Profile Gasket Large Enclosure Series Double-Sided Contact Series Foldover Series Stainless Steel I/O Shielding Flexible Low Compression Series Clip-On Twist Series Twist Series Divider Edge Shielding Card Guide Clip-On Clip-On Perpendicular Shielding Clip-On Perpendicular Grounding Strip Clip-On Longitudinal Grounding Strip Mini-Longitudinal Grounding Gasket Longitudinal Grounding Series Custom Stamping Contact Strips / Contact Rings IEEE 1394 Horizontal Connector Gasket DIN Connector Series USB Connector www.lairdtech.com 14 14 15 16 17 18 18 19 21 21 22 22 23 24 25 26 27 28 29 31 31 32 32 33 33 34 34 35 35 36 36 37 37 38 38 39 39 39 39 40 Fiber Optic Shield 40 GBIC Fiber Optic Shield 40 "D" Connector Shielding / Slotted "D" 41 Precision Stamped Metals 42 Contacts 42 Custom Design 44 Metals Galvanic Compatibility Chart 46 VENT PANELS 48 MaxAir™ 49 Elecro-Air™ 50 Electrovent™ 51 FABRIC-OVER FOAM 52 Product Selection Guide 52 Introduction 54 EcoGreen™ 56 I/O / Gasket Selection Guide 57 Profile Selection Guide 58 I/O Selection Guide 62 Knitted Conductive Gaskets 65 Visual Part Reference Guide 66 Part Number Cross Reference 67 Ultraflex® 68 All Mesh 69 Elastomer Core 70 Electroground® EMI Washers 72 Electromesh® Tape 75 Conductive Fabric 76 MRI "A" Fabric 77 Conductive Tape 78 ELECTRICALLY CONDUCTIVE ELASTOMERS 79 Introduction 79 Product Selection Guide 80 Case Study 81 Visual Part Reference Guide 85 Electroseal™ Conductive Elastomer 86 Extrusions Guide 87 Gemini™ Coextrusions 93 Fabricated Components Guide 95 Metal Impregnated Materials 99 Specialty Products 102 Automated Form-In-Place Gaskets 103 MICROWAVE ABSORBERS Product Selection Guide Design Guide Q-Zorb® 2000 HF Q-Zorb® 3000 HP RFRET 4000 RFLS 5000 Analysis, Test and Prototype Development 105 105 106 109 110 111 112 113 TABLE OF CONTENTS EMI INTRODUCTION 2 EMI SUMMARY 3 BOARD LEVEL SHIELDS 6 Product Selection Guide 6 Introduction 8 Standard Design Shields 9 EZ Peel™ 11 Rigid Corner 11 ReCovr™ 12 ReMovl 12 Overview 13 FINGERSTOCK Product Selection Guide Introduction Mounting Methods Ordering Information UltraSoft® Series Recyclable Clean Copper Slot Mount Series Dual Slot Series Teardrop Series Compact PCI Symmetrical Mount Alternate Slot Series Variable Slot Mount Symmetrical (S3) Slotted Shielding Solid Top (S3) Symmetrical Slotted Shielding Clip-On Symmetrical Shielding No Snag Gasket All-Purpose Series Clip-On Series Low Profile Hook-On Gasket Low Profile Gasket Large Enclosure Series Double-Sided Contact Series Foldover Series Stainless Steel I/O Shielding Flexible Low Compression Series Clip-On Twist Series Twist Series Divider Edge Shielding Card Guide Clip-On Clip-On Perpendicular Shielding Clip-On Perpendicular Grounding Strip Clip-On Longitudinal Grounding Strip Mini-Longitudinal Grounding Gasket Longitudinal Grounding Series Custom Stamping Contact Strips / Contact Rings IEEE 1394 Horizontal Connector Gasket DIN Connector Series USB Connector www.lairdtech.com 14 14 15 16 17 18 18 19 21 21 22 22 23 24 25 26 27 28 29 31 31 32 32 33 33 34 34 35 35 36 36 37 37 38 38 39 39 39 39 40 Fiber Optic Shield 40 GBIC Fiber Optic Shield 40 "D" Connector Shielding / Slotted "D" 41 Precision Stamped Metals 42 Contacts 42 Custom Design 44 Metals Galvanic Compatibility Chart 46 VENT PANELS 48 MaxAir™ 49 Elecro-Air™ 50 Electrovent™ 51 FABRIC-OVER FOAM 52 Product Selection Guide 52 Introduction 54 EcoGreen™ 56 I/O / Gasket Selection Guide 57 Profile Selection Guide 58 I/O Selection Guide 62 Knitted Conductive Gaskets 65 Visual Part Reference Guide 66 Part Number Cross Reference 67 Ultraflex® 68 All Mesh 69 Elastomer Core 70 Electroground® EMI Washers 72 Electromesh® Tape 75 Conductive Fabric 76 MRI "A" Fabric 77 Conductive Tape 78 ELECTRICALLY CONDUCTIVE ELASTOMERS 79 Introduction 79 Product Selection Guide 80 Case Study 81 Visual Part Reference Guide 85 Electroseal™ Conductive Elastomer 86 Extrusions Guide 87 Gemini™ Coextrusions 93 Fabricated Components Guide 95 Metal Impregnated Materials 99 Specialty Products 102 Automated Form-In-Place Gaskets 103 MICROWAVE ABSORBERS Product Selection Guide Design Guide Q-Zorb® 2000 HF Q-Zorb® 3000 HP RFRET 4000 RFLS 5000 Analysis, Test and Prototype Development 105 105 106 109 110 111 112 113 EMI ESSENTIALS EMI INTRODUCTION Overview of EMC/RFI Issues The phenomenon of electromagnetic interference (EMI) is familiar to virtually everyone, even if they do not understand the underlying principles. Most people have witnessed firsthand the effects of interference. To control EMI, government organizations, such as the FCC, CSA, and EEC, mandate that manufacturers may not design, produce or sell electronic equipment that jams the public broadcast services. In other instances, however, EMI can constitute more than a mere nuisance. The military and medical communities, for example, require trouble-free operation of their electronic equipment in adverse electromagnetic environments since malfunctions could jeopardize missions and personnel. The European Union’s EMC directive also mandates that “the apparatus has an adequate level of intrinsic immunity to electromagnetic disturbance to enable it to operate as intended”. EMC Design of High Speed Systems The interference and susceptibility (immunity) effects of electronic apparatus are created by time-variant electromagnetic fields which may be propagated along a conducting medium or by radiation through space. Because the source of the conducted and radiated interference energy levels may be related, a coordinated systems design effort is required to reduce these effects. A design program for an equipment item that must meet both an emission and an immunity requirement consists of: • Suppression: Reducing the interference at its source. • Isolation: Isolating the offending circuits by filtering, grounding and shielding. • Desensitization: Increasing the immunity of any susceptible circuits. These three steps should be carried on throughout the entire equipment design and implemented as early as possible within the design program. Effects of Logic Speed The trend in today’s electronic devices is faster, smaller, and digital rather than analog. Most equipment (95%) of today contains digital circuits. Today’s digital designer must create a circuit board that has the lowest possible EMI, combined with the highest possible operating/processing speeds. Design of the PCB is the most critical EMC influencing factor for any system, since virtually all active devices are located on the board. It is the changing current (accelerated electron movement) produced by the active devices that result in EMI. Design Approaches There are two approaches that can be used to reduce the emission from the PC board. The first approach is to operate the circuit at the slowest speeds consistent with the functionality of the system, lay out the PCB with the smallest possible loop areas (especially the high speed devices), and insert suppression components such as filters, ferrite beads, and bypass capacitors into the circuit to reduce its bandwidth. These techniques will result in a desired decrease in the high frequency harmonic amplitudes and circuit bandwidth and a corresponding undesired decrease in both the operating speed and system reliability. The use of slower speeds with reduced bandwidth will help to desensitize the circuit to external susceptibility fields. The second is to use shielding. Shielding is the only non-invasive suppression technique. Since the shielding is not inserted into the circuit, it does not affect the high frequency operating speed of the system, nor does it affect the operation of the system should changes be made to the design in the future. In addition, shielding does not create timing problems and waveform distortion; it does not decrease system reliability; and it reduces crosstalk. Plus, shielding works for both emission suppression as well as susceptibility (immunity) problems. 2 Even with the overall advantages of shielding, the most cost-effective approach is to use a combination of circuit suppression/hardening and shielding. www.lairdtech.com Fabric-Over-Foam and Conductive Foam Wire Mesh Tape Applications • Shielding or grounding of computer and telecommunication equipment seams and apertures • Covers opened infrequently for servicing (6-12 times per year) • Long lasting resiliency is ideal for highly sensitive components in permanent or semi-permanent enclosures • Consistent point-to-point contact for high shielding effectiveness over the life of the gasket • Design flexibility provides grounding and shielding solutions for I/O shielding panels, disk drive insulators, ground planes or circuit boards, electromedical devices, keyboard devices • Mask-and-peel tape for painted electronic enclosures • Cable and wire harness wrapping Features and Benefits Product Highlights • UL 94VO and HB flame retardant • Ideal for applications requiring low pressure force • Self-terminating cut-to lengths • High conductivity and shielding attenuation • Galvanically-compatible with most mating surfaces • High abrasion and shear resistance • Most economical gasket for low-cycling applications • High shielding effectiveness over broad frequency range • Available in wide variety of sizes and shapes • Knit construction for long lasting resiliency • Versatile mounting options • Available with elastomer gasket for moisture and dust sealing • Simple installation • Ideally suited for thin or low-profile applications • Conductive foil tape with release mask for painted enclosures • Tin copper cloth and nickel copper cloth versions provide easy-to-handle alternatives to foils Electrical Shielding Effectiveness Transfer Impedance (500 MHz) >85 dB 90 - 105 dB — H-field (200 MHz) Modified Mil 285 30 - 45 dB 55 - 65 dB — Plane Wave (2 GHz) Modified Mil 285 90 - 100 dB 80 - 115 dB 85 - 95 dB Surface Resistivity 100 dB across a wide spectrum of frequencies (see figure 2). • Prototype samples can be provided quickly utilizing laser technology, CAD/CAM equipment, and customer supplied drawings in DWG®, DXF®, IGS, PRT®, DRW®, STP®, and CT® file formats. • Extremely low compression forces allow for use of lighter materials (see figure 1). • Low Surface Resistivity as low as 0.07 ohms/square dependent on the fabric. Fabric-Over-Foam gaskets provide improved conductivity (ASTM F390). • A wide range of flame retardant gaskets are available (UL recognized per UL94 V0 or UL94 HB). More information is available at ul.com. • Abrasion resistant metallized fabrics show virtually no degradation in shielding performance. • Profile and I/O gaskets are available with a variety of pressure sensitive adhesive (PSA) tapes, including Easy Peel® with extra wide release liner to facilitate quick assembly. • Profile gaskets can be cut to specified lengths, kiss-cut on release liner, or mitered to form frame configurations. • UL94 V0 and Halogen-free gaskets to meet stringent environmental / safety requirements • Urethane core provide low compression set ensuring long-term reliability of gasket performance. Contact Engineering for profile specific data. • Service temperatures from -40°F to 158°F (-40°C to 85°C). • Available in Nickel/Copper (Ni/Cu) and Tin/Copper (Sn/Cu) to ensure galvanic compatibility with a wide variety of host materials. Both versions display no significant performance degradation after environmental exposure per the Accelerated Aging Test (ASTM B845-93 Method H). FIGURE 2 Shielding Effectiveness (dB) Shielding Effectiveness per MIL-STD-285 (mod.) D Shape — Profile # 4789 Frequency (MHz) 55 www.lairdtech.com EMI ESSENTIALS ECOGREEN ENVIRONMENTALLY FRIENDLY FABRIC-OVER-FOAM SHIELDING GASKETS TM Laird is pleased to introduce the next generation in RoHS-compliant EMI shielding technology. While Laird Fabric-Over-Foam EMI gaskets are RoHS compliant, we are proactively strengthening our compliancy by engineering halogen-free EcoGreenTM shields. Not only are the patented EcoGreenTM shields environmentally friendly, they offer high EMI shielding effectiveness, extremely low compression forces, abrasion-resistant metallized fabrics, large service temperature ranges, and multiple profile/gasket options. Laird shields are flame retardant and pass the stringent UL94-VO burn test and the whole gasket is Halogen-free. ENVIRONMENT & SAFETY APPLICATIONS • Halogen-free and RoHS compliant; per the IEC 61249-2-21 standard • UL94 V0 PERFORMANCE AND BENEFITS • Profiles and I/O gaskets are available with a pressure sensitive adhesive (PSA) tape • Profiles can be cut to specified lengths, kiss-cut release liner or mitered to form frame configurations HIGH SHIELDING EFFECTIVENESS • Shielding effectiveness of > 100 dB • Extremely low compression forces allow lighter weight materials, with less fastening and hinge hardware. • Low surface resistivity as low as 115* >122* >115* 400 MHz >107* * Values exceed the dynamic range of the test equipment and were measured in actual MRI shielded enclosures. MECHANICAL PROPERTIES Tensile Strength CMD/MD (ASTM D5035) lb./in (N/100 mm) Elongation, MD (ASTM D5035) 20/60 (350/1050) 8% All dimensions shown are in inches (millimeters) unless otherwise specified. 77 www.lairdtech.com EMI ESSENTIALS CONDUCTIVE TAPE CONDUCTIVE FABRIC SHIELDING TAPE Laird conductive fabric shielding tapes offer exceptional conformability and conductivity for dynamic flex applications. Conductive tapes are constructed of nickel/copper metallized fabric with a conductive pressure sensitive adhesive (PSA). This reliable tape design provides outstanding shielding performance while offering superior abrasion and corrosion resistance under high dynamic flex conditions. Significant advantages over other fabric and foil shielding tapes include: • Available UL510 flame rating. • Thinner design provides superior flexibility and durability. • High conductivity and shielding effectiveness. • Adhesive system provides high peel strength. • Easy die-cutting and processing. • Superb adhesion of nickel copper plating. • Eliminates the potential of injury due to the sharp edges of metal foil tapes. EMI shielding tape is available in standard roll widths from 0.394" (10 mm) to 3.937" (100 mm) in 0.197" (5 mm) increments and roll lengths of 65.62' (20 M). Master rolls are available in sizes up to 1.0 meter widths and 20 meter lengths. For your unique design requirements, custom die-cut parts are also available. Some typical applications for EMI shielding tapes include: • Shielding cables on notebook computers, copiers or other electronic equipment. • “Fix-it” applications in test laboratories. • Shielding over a component in which high conformability is essential. • Shielding or grounding in weight sensitive applications. • Shielding or grounding for electronic equipment where vibration may be present during operation. TAPE CONSTRUCTION * Carrier Nickel Copper Ripstop / Tafeta Fabric (1A) Adhesive Conductive Pressure Sensitive Acrylic Adhesive Liner Kraft Paper PERFORMANCE CHARACTERISTICS * 78 Conductive Tape Thickness 0.005 ± 0.0008 inches (0.13 ± 0.02 mm) Tensile Strength (ASTM D5035) 50 lb / in. Weight (LT 500) 2.9 oz./sq. yard (100 grams/sq. Meter) XY Sheet Resistivity (ASTM F390) < 0.03 ohms/sq. Peel Strength 28 oz./in. (8.7 N/25 mm) Abrasion Resistance (ASTM D3886) > 750,000 Cycles Temperature Range 32°F to 176°F (0°C to 80°C) Max. Temperature (short term) 120°C Shielding Effectiveness 100 MHz @ 70 dB 1 GHz @ 80 dB 3 GHz @ 90 dB Z-Axis Resistivity < 0.040 ohms Shelf Life 6 months @ 23°C, 60% R.H. * Properties for standard tapes. Other tape properties available upon request. www.lairdtech.com ORDERING INFORMATION: 86-726 86-785 86-203 86-205 87-580 DS005 D6-785FX 76-750 Standard Tape Standard Tape Black Tape Black Tape UL510 Rated Double Sided Tape Double Sided Tape Thin Tape EMI ESSENTIALS INTRODUCTION TO ELECTRICALLY CONDUCTIVE ELASTOMERS OVERVIEW ELECTROSEAL™ GASKET INTRODUCTION The electrically conductive elastomers are based on dispersed particles in elastomers, oriented wire in solid or sponge elastomers, impregnated wire mesh screens or expanded metals. They provide highly conductive, yet resilient gasketing materials for EMI sealing as well as pressure and environmental sealing. Conductive elastomer gaskets are EMI shielding and sealing devices made from highly conductive, mechanically resilient and conformable vulcanized elastomers. They are available in the following types: Conductive elastomers are used for shielding electronic enclosures against electromagnetic interference (EMI). Usually, the shielding system consists of a conductive gasket sandwiched between a metal housing and lid. The primary function of these gaskets is to provide sufficient electrical conductivity across the enclosure/gasket/lid junction to meet grounding and EMI shielding requirements, as well as prevent intrusion of the fluids into the electrical components. Laird offers conductive elastomers in the following forms: 1. ElectroSeal dispersed filler particles in elastomers 2. ElectroMet oriented wire in solid and sponge elastomers, and impregnated wire mesh and expanded metals 1. 2. 3. 4. 5. 6. Flat gaskets or die-cuts Molded shapes such as O-rings or intricate parts Extruded profiles or strips Vulcanized-to-metal covers or flanges Co-molded or reinforced seals Form-in-place gaskets When any two flat, but rigid surfaces are brought together, slight surface irregularities on each surface prevent them from meeting completely at all points. These irregularities may be extremely minute, yet may provide a leakage path for gas or liquid under pressure, and for high frequency electromagnetic energy. This problem remains in flange sealing even when very high closure force is applied. However, when a gasket fabricated of resilient material is installed between the mating surfaces, and even minimal closure pressure is applied, the resilient gasket conforms to the irregularities in both mating surfaces. As a result, all surface imperfections and potential leak paths across the joint area are sealed completely against pneumatic and fluid pressure or penetration by environmental gases. If the gasket is conductive as well as resilient, with conductive matrix distributed throughout its total volume in mesh or particle form, the joint can be additionally sealed against penetration by, or exit of, electromagnetic energy. 79 www.lairdtech.com EMI ESSENTIALS ELECTROSEAL CONDUCTIVE ELASTOMER PRODUCT SELECTION GUIDE ECE POLYMER MATERIAL MATRIX Benefit Ag (Silver) AgCu AgNi AgAl AgGlass Ni NiAl Silicone good all purpose material NiGraphite Carbon Non-Conductive ECE082/083 ECE080/094 ECE084 ECE081 ECE085 ECE100 ECE032 ECE072/093 ECE087 NCE220 Fluorosilicone fuel and oil resistant -NA- ECE088 ECE090 ECE050/089 ECE011 -NA- -NA- ECE092 -NA- -NA- EPDM biohazard resistant -NA- -NA- -NA- ECE096 -NA- -NA- -NA- ECE095 ECE013 -NA- FIP RESIN MATRIX Benefit AgCu AgNi AgAl NiGraphite Non-Conductive RXP - room temperature cure simple dispense process SNK55 SNN60 SNL60 SNC70 SIL25 HXP - heat cure longer shelf life SNK60 SNN65 SNL70 SNC70 SIL35 80 www.lairdtech.com 81