VL-COMM-26ECP

VL-COMm-26 COM Express Mini CPU Module ƒƒ Extremely small COM Express™ mini form factor ƒƒ Intel® Atom™ E6x0T processor ƒƒ Industrial temp. (-40º to +85ºC) ƒƒ Class 3 manufacturing (optional) ƒƒ Wide input voltage (8V–17V) ƒƒ On-board Trusted Platform Module (optional) Highlights Overview COM Express Mini Form Factor The VL-COMm-26 is an extremely small and rugged Computer on Module (COM) based on the industry-standard COM Express mini form factor. Roughly the size of a credit card, the VL-COMm-26 has been engineered to meet the military and medical industries’ requirements for smaller, lighter, and lower power embedded systems while adhering to stringent regulatory standards. The VL-COMm-26 is manufactured to IPC-A-610 Class 2 standards. For extremelyhigh-reliability applications, IPC-A-610 Class 3 (modified) versions are available. This embedded computer module, equipped with an Intel Atom E6x0T processor, is designed to withstand extreme temperature, impact, and vibration. Extremely small 55 mm x 84 mm format with Type 10 pin-out. Intel Atom E6x0T Processor 1.6 GHz performance. Low power consumption. Industrial Temperature Operation -40° to +85°C operation for harsh environments. Class 3 Manufacturing (optional) For applications where extreme reliability is essential. MIL-STD-202G Qualified for high shock / vibration environments. Trusted Platform Module (optional) On-board security option defends against attacks from unauthorized hardware and software. Fanless Operation No moving parts required for CPU cooling. Wide Input Voltage Range Accepts 8 to 17 volts (12V typ.). High-performance Video Graphics core supports MPEG-4 / H.264 and MPEG-2 encoding and decoding. Network Gigabit Ethernet (GbE) with remote boot support. RAM Up to 2 GB soldered-on DDR2 RAM. I/O Interfaces SATA, PCIe, USB host / client, serial, HD audio, LPC, SMBus, and CAN. Flash Memory On-board microSD™ socket and SDIO interface for plug-in flash storage. Details Driven by an Intel Atom E6x0T processor, the VL-COMm-26 provides significant performance and lower power consumption (7W–8W typical) in a very compact package. The VL-COMm-26 provides compatibility with a broad range of standard x86 application development tools for reduced development time. The VL-COMm-26 utilizes advanced Intel technologies to maximize performance. Intel HyperThreading Technology (Intel HT Technology) provides two processing threads per physical core which allows applications to work in parallel and complete tasks sooner. Intel Virtualization Technology allows one VL-COMm-26 system to function as multiple “virtual” platforms. This enables computing activities to be isolated into separate partitions for increased application flexibility and reliability. Enhanced Intel SpeedStep® Technology enables high performance while meeting the power-conservation needs of embedded systems by switching voltage and frequency levels in response to processor load. The integrated Intel GMA600 graphics core provides hardware-accelerated MPEG-4 / H.264 and MPEG-2 video encoding and decoding. A standard LVDS output supports flat panel displays. An SDVO output supports a variety of signaling interfaces including VGA and DVI. The standard Type 10 pin-out provides industry-standard system interfaces including Gigabit Ethernet with network boot capability, seven USB ports, three x1 PCIe lanes, two serial interfaces, Intel High-Definition Audio (HDA), LPC, and SMBus to the carrier board. An auxiliary board-to-board connector provides two additional serial interfaces and a CAN interface. Dual SATA 3 Gb/s interfaces support high-capacity storage. A microSD socket provides flexible solid-state drive (SSD) options. For enhanced security, the VL-COMm-26 supports Execute Disable Bit functionality. This hardware-based security feature reduces exposure to viruses and malicious-code attacks by preventing harmful software from executing and propagating on the network. An optional on-board Trusted Platform Module (TPM) is available for applications that require additional hardware-level security functions. VersaLogic Corporation  •  12100 SW Tualatin Rd., Tualatin, OR  97062  •  (503) 747-2261  •  Info@VersaLogic.com  •  www.VersaLogic.com VL-COMm-26 Designed and tested for industrial temperature (-40º to +85ºC) operation, the rugged VL-COMm-26 also meets MIL-STD-202G specifications for shock and vibration. Soldered-on RAM provides additional ruggedization for use in extremely harsh environments. Heatsink or heat plate versions provide fanless heat dissipation. Thermal monitoring technologies protect the system from thermal failure by reducing power consumption when required to remain within normal thermal operating limits. COM Express Mini CPU Module Specifications General Chipset Battery Power Requirements  (@ +12V) § A wide input voltage range of 8 to 17 volts (12V typ.) simplifies system power supply requirements. It is fully compatible with 12V automotive-type power systems. The VL-COMm-26 is compatible with a variety of popular x86 operating systems including Windows, Windows Embedded, Linux, and VxWorks. Product customization is available, even in low quantities. Options include a Trusted Platform Module, conformal coating, BGA underfill, IPC Class 3 (modified) construction, BIOS/splash screen configuration, application-specific testing, BOM revision locks, special labeling, etc. Form Factor Processor Input Voltage System Reset & Hardware Monitors Manufacturing Standards Environmental As a mate to the VL-COMm-26, VersaLogic can design and manufacture carrier boards that meet your exact requirements for an embedded system. Please contact a VersaLogic Sales Engineer for more information. Regulatory Compliance Operating Temperature Storage Temperature Cooling Airflow Requirements Ordering Information Model VL-COMm-26EAP* VL-COMm-26EBP VL-COMm-26ECP VL-COMm-26EDP* VL-COMm-26EAK* VL-COMm-26EBK VL-COMm-26ECK VL-COMm-26EDK* Processor Atom E620T Atom E640T Atom E680T Atom E680T Atom E620T Atom E640T Atom E680T Atom E680T Speed 0.6 GHz 1.0 GHz 1.6 GHz 1.6 GHz 0.6 GHz 1.0 GHz 1.6 GHz 1.6 GHz RAM 512 MB 1 GB 1 GB 2 GB 512 MB 1 GB 1 GB 2 GB Cooling Heat plate Heat plate Heat plate Heat plate Heatsink Heatsink Heatsink Heatsink Altitude ¤ Thermal Shock Humidity Vibration, Sinusoidal Sweep ¥ Vibration, Random ¥ Mechanical Shock ¥ * Special order Accessories Part Number Description Carrier Boards VL-BBm-10E-xxxx Carrier board, 5 mm board spacing, AUX connector, Class 2 Solid-State Storage (Flash Memory) VL-F41-xxxx microSD card (SDIO), SLC, industrial temp. Hardware VL-HDW-405 Secondary mounting plate. Simplifies installation in many situations. Attaches to heat plate models. Miscellaneous VL-HDW-401 Thermal compound paste (1.75g) Security Memory Video TPM (optional) System RAM Up to 2 GB soldered-on DDR2 SDRAM. 800 MT/s. General Intel GMA600 high-performance graphics core. Advanced 2D / 3D graphics. Hardware-accelerated video encode and decode. Up to 256 MB + 384 MB shared DRAM SDVO supports a variety of signaling interfaces including VGA and DVI. Up to 1920 x 1080 (50 Hz) or 1280 x 1024 (85 Hz). Single-channel LVDS interface. 18/24-bit. Up to 1280 x 768 (60 Hz). Two SATA 3 Gb/s ports π microSD socket supports up to 32 GB. SDIO interface supports SD, SDIO, and MMC. One autodetect 10BaseT/100BaseTX/1000BaseT port. Network boot option. Six host and one client USB 2.0 ports VRAM Desktop Display Interface π OEM Flat Panel Interface π Mass Storage Rotating Drives / Flash / Solid-State Drives ‡ Network Interface Ethernet † π Type 10 I/O Interfaces USB ‡ # COM1 and COM2 ports are available only when the auxiliary board-to-board connector is used Auxiliary I/O Interfaces COM 3 / 4 # Audio PCIe SMBus LPC Control CAN † COM 1 # ¥ MIL-STD-202G shock and vibe levels are used to illustrate the extreme ruggedness of this product in general. Testing to higher levels and / or different types of shock or vibration methods can be accommodated per the specific requirements of the application. Contact a VersaLogic Sales Engineer for further information. Software COM 2 # BIOS § Represents operation at +25°C and +12V supply running Windows XP with LVDS display, SATA, GbE, COM, and USB keyboard / mouse. Typical power computed as the mean value of Idle and Maximum power specifications. Maximum power measured with 95% CPU utilization. †  IEEE 1588 Precision Time Protocol (PTP) compatible ‡  Bootable storage device ¤ Extended altitude specifications available upon request π Available via Type 10 I/O connector Specifications are subject to change without notification. Intel and Atom are trademarks of Intel Corp. COM Express is a trademark of PICMG. PCI Express is a registered trademark of PCI-SIG. microSD is a trademark of SD-3C, LLC. All other trademarks are the property of their respective owners. 02/21/13 COM Express mini (Type 10): 55 mm x 84 mm (2.17” x 3.31”) Intel Atom E6x0T platform. 512K 8-way L2 cache. Intel Hyper-Threading Technology (HT), Virtualization Technology (VT), Enhanced SpeedStep Technology, Thermal Monitoring Technologies, and Execute Disable Bit. Intel EG20T Platform Controller Hub (PCH) Connection for 3.0V RTC backup battery Model Idle Typical Max. S3 VL-COMm-26EAx 7.2W 7.4W 7.6W 3.0W VL-COMm-26EBx 7.3W 8.0W 8.7W 3.0W VL-COMm-26ECx 7.3W 8.4W 9.5W 3.0W VL-COMm-26EDx 7.3W 8.4W 9.5W 3.0W 8V–17V (nominal 12V operation) All voltage rails monitored. Watchdog timer with programmable timeout (1 µS to 10 min.). Standard IPC-A-610 Class 2 Custom IPC-A-610 Class 3 (modified) RoHS compliant -40° to +85°C. Derate -1.1°C per 305m (1,000 ft.) above 2,300m (7,500 ft.). ¤ -40° to +85°C Fanless. Heatsink or bolt-down heat plate. Model Temp. Range Airflow Heat plate models -40° to +85°C Zero airflow Heat plate must be kept below 90°C Heatsink models -40° to +60°C Zero airflow +60° to +85°C 300 LFM Operating To 15,000 ft. (4,570m) Storage To 40,000 ft. (12,000m) 5°C/min. over operating temperature Less than 95%, noncondensing MIL-STD-202G, Method 204, Modified Condition A: 2g constant acceleration from 5 to 500 Hz, 20 min. per axis MIL-STD-202G, Method 214A, Condition A: 5.35g rms, 5 min. per axis MIL-STD-202G, Method 213B, Condition G: 20g half-sine, 11 ms duration per axis Support for Intel Trusted Platform Module 1.2 devices Sleep Mode Operating Systems CMOS levels. 16C550 compatible. 1 Mbps max. Intel High-Definition Audio (HDA) CODEC Three x1 PCIe (Gen 1) lanes 1 MHz 33 MHz Wake, reset, and power 2-wire CAN port CMOS levels. 16C550 compatible. 1 Mbps max. Handshake lines. CMOS levels. 16C550 compatible. 1 Mbps max. AMI Aptio UEFI BIOS with OEM enhancements. Field reprogrammable. ACPI 3.0. Support for S3 suspend state. Compatible with most x86 operating systems including Windows, Windows Embedded, Linux, and VxWorks VersaLogic Corporation  •  12100 SW Tualatin Rd., Tualatin, OR  97062  •  (503) 747-2261  •  Info@VersaLogic.com  •  www.VersaLogic.com