MPL115A1
Miniature SPI digital barometer, 50 to 115 kPa
Rev. 8 — 10 October 2017
1
Data sheet: technical data
General description
The MPL115A1 is an absolute pressure sensor with a digital SPI output targeting low
cost applications. A miniature 5 x 3 x 1.2 mm LGA package is ideally suited for the space
constrained requirements of portable electronic devices. Low current consumptions of
5 μA during Active mode and 1 μA during Shutdown (Sleep) mode are essential when
focusing on low-power applications. The wide operating temperature range spans from –
40 °C to +105 °C to fit demanding environment conditions.
The MPL115A1 employs a MEMS pressure sensor with a conditioning IC to provide
accurate pressure measurements from 50 to 115 kPa. An integrated ADC converts
pressure and temperature sensor readings to digitized outputs via a SPI port. Factory
calibration data is stored internally in an on-board ROM. Utilizing the raw sensor output
and calibration data, the host microcontroller executes a compensation algorithm to
render Compensated Absolute Pressure with ±1 kPa accuracy.
The MPL115A1 pressure sensor’s small form factor, low power capability, precision, and
digital output optimize it for barometric measurement applications.
2
Features
• Digitized pressure and temperature information together with programmed calibration
coefficients for host micro use.
• Factory calibrated
• 50 kPa to 115 kPa absolute pressure
• ±1 kPa accuracy
• 2.375 V to 5.5 V supply
• Integrated ADC
• SPI Interface
• Monotonic pressure and temperature data outputs
• Surface mount RoHS compliant package
3
Applications
•
•
•
•
•
•
•
Barometry (portable and desktop)
Altimeters
Weather stations
Hard-disk drives (HDD)
Industrial equipment
Health monitoring
Air control systems
MPL115A1
NXP Semiconductors
Miniature SPI digital barometer, 50 to 115 kPa
4
Ordering information
Table 1. Ordering information
Type number
MPL115A1
Package
Name
Description
Version
TSON8
LGA 8 I/O, 3 X 5 X 1.25 PITCH, SENSOR 1.2MAX MM PKG
SOT1769-1
4.1 Ordering options
Table 2. Ordering options
Device Name
Package Options
# of Ports
None Single
Pressure Type
Dual
Gauge
Differential
Absolute
Digital
Interface
MPL115A1
Tray
•
•
SPI
MPL115A1T1
Tape & Reel (1000)
•
•
SPI
5
Block diagram
Figure 1. Block diagram of MPL115A1
MPL115A1
Data sheet: technical data
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MPL115A1
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Miniature SPI digital barometer, 50 to 115 kPa
6
Pinning information
6.1 Pinning
MPL115A1
VDD
1
8
SCLK
CAP
2
7
DIN
GND
3
6
DOUT
SHDN
4
5
CS
transparent top view
Figure 2. Pin configuration
6.2 Pin description
Table 3. Pin description
7
Pin
Name
1
VDD
Power Supply Connection. VDD range is 2.375 V to 5.5 V.
2
CAP
External Capacitor: Output decoupling capacitor for main internal
regulator. Connect a 1 μF ceramic capacitor to ground.
3
GND
Ground
4
SHDN
5
CS
6
DOUT
7
DIN
8
SCLK
Function
Shutdown: Connect to GND to disable the device. When in shut
down the part draws no more than 1 μA supply current and all
communications pins (CS, SCLK, DOUT, DIN) are high impedance.
Connect to VDD for normal operation.
Chip Select line.
Serial data output
Serial data input
Serial clock input.
Handling and Board Mount Recommendations
The sensor die is sensitive to light exposure. Direct light exposure through the port hole
can lead to varied accuracy of pressure measurement. Avoid such exposure to the port
during normal operation.
7.1 Methods of Handling
Components can be picked from the carrier tape using either the vacuum assist or the
mechanical type pickup heads. A vacuum assist nozzle type is most common due to its
lower cost of maintenance and ease of operation. The recommended vacuum nozzle
configuration should be designed to make contact with the device directly on the metal
cover and avoid vacuum port location directly over the vent hole in the metal cover of the
MPL115A1
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MPL115A1
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Miniature SPI digital barometer, 50 to 115 kPa
device. Multiple vacuum ports within the nozzle may be required to effectively handle the
device and prevent shifting during movement to placement position.
Vacuum pressure required to adequately support the component should be
approximately 25 inches Hg (85 kPa). This level is typical of in-house vacuum supply.
Pickup nozzles are available in various sizes and configurations to suit a variety of
component geometries. To select the nozzle best suited for the specific application, it
is recommended that the customer consult their pick and place equipment supplier to
determine the correct nozzle. In some cases it may be necessary to fabricate a special
nozzle depending on the equipment and speed of operation.
Tweezers or other mechanical forms of handling that have a sharp point are not
recommended since they can inadvertently be inserted into the vent hole of the device.
This can lead to a puncture of the MEMS element that will render the device inoperable.
7.2 Board Mount Recommendations
Components can be mounted using solder paste stencil, screen printed or dispensed
onto the PCB pads prior to placement of the component. The volume of solder paste
applied to the PCB is normally sufficient to secure the component during transport to the
subsequent reflow soldering process. Use of adhesives to secure the component is not
recommended, but where necessary can be applied to the underside of the device.
Solder pastes are available in variety of metal compositions, particle size and flux types.
The solder paste consists of metals and flux required for a reliable connection between
the component lead and the PCB pad. Flux aids the removal of oxides that may be
present on PCB pads and prevents further oxidation from occurring during the solder
process.
The use of a No-Clean (NC) flux is recommended for exposed cavity components.
Using pressure spray, wire brush, or other methods of cleaning is not recommended
since it can puncture the MEMS device and render it unusable. If cleaning of the pcb
is performed, Water Soluble (WS) flux can be used. However, it is recommended the
component cavity is protected by adhesive Kapton tape, vinyl cap or other means
prior to the cleaning process. This covering will prevent damage to the MEMS device,
contamination, and foreign materials from being introduced into device cavity as result of
cleaning processes.
Ultrasonic cleaning is not recommended as the frequencies can damage wire bond
interconnections and the MEMS device.
MPL115A1
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Miniature SPI digital barometer, 50 to 115 kPa
8
Functional description
Initial
powe rup
Readin g
coefficient data
Data conversion
Compensated
pressure readin g
Shutdown
Figure 3. Sequence flow chart
The MPL115A interfaces to a host (or system) microcontroller in the user’s application.
All communications are via SPI. A typical usage sequence is as follows:
Initial power-up
All circuit elements are active. SPI port pins are high impedance and associated registers
are cleared. The device then enters standby mode.
Reading coefficient data
The user then typically accesses the part and reads the coefficient data. The main
circuits within the slave device are disabled during read activity. The coefficients are
usually stored in the host microcontoller local memory but can be re-read at any time.
Reading of the coefficients may be executed only once and the values stored in the host
microcontroller. It is not necessary to read this multiple times because the coefficients
within a device are constant and do not change. However, note that the coefficients will
be different from device to device, and cannot be used for another part.
Data conversion
This is the first step that is performed each time a new pressure reading is required which
is initiated by the host sending the CONVERT command. The main system circuits are
activated (wake) in response to the command and after the conversion completes, the
result is placed into the Pressure and Temperature ADC output registers.
The conversion completes within the maximum conversion time, tc (see row 6, in
Table 11). The device then enters standby mode.
MPL115A1
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Miniature SPI digital barometer, 50 to 115 kPa
Compensated pressure reading
After the conversion has been given sufficient time to complete, the host microcontroller
reads the result from the ADC output registers and calculates the Compensated
Pressure, a barometric/atmospheric pressure value which is compensated for changes
in temperature and pressure sensor linearity. This is done using the coefficient data
from the MPL115A and the raw sampled pressure and temperature ADC output values,
in a compensation equation (detailed later). Note that this is an absolute pressure
measurement with a vacuum as a reference.
From this step the host controller may either wait and then return to the Data Conversion
step to obtain the next pressure reading or it may go to the Shutdown step.
Shutdown
For longer periods of inactivity the user may assert the SHDN input by driving this pin
low to reduce system power consumption. This removes power from all internal circuits,
including any registers. In the shutdown state, the Pressure and Temperature registers
will be reset, losing any previous ADC output values.
This step is exited by taking the SHDN pin high. Wait for the maximum wakeup time,
tw (see row 7, in Table 11), after which another pressure reading can be taken by
transitioning to the data Conversion step.
Table 4. Device memory map
Address
Name
Description
00h
Padc_MSB
10-bit Pressure ADC output value MSB
01h
Padc_LSB
10-bit Pressure ADC output value LSB
02h
Tadc_MSB
10-bit Temperature ADC output value MSB
03h
Tacd_LSB
10-bit Temperature ADC output value LSB
04h
a0_MSB
a0 coefficient MSB
05h
a0_LSB
a0 coefficient LSB
06h
b1_MSB
b1 coefficient MSB
07h
b1_LSB
b1 coefficient LSB
08h
b2_MSB
b2 coefficient MSB
09h
b2_LSB
b2 coefficient LSB
0Ah
c12_MSB
c12 coefficient MSB
0Bh
c12_LSB
c12 coefficient LSB
0Ch
reserved
Data sheet: technical data
—
[1]
—
[1]
—
[1]
—
0Dh
reserved
0Eh
reserved
0Fh
MPL115A1
[1]
reserved
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Miniature SPI digital barometer, 50 to 115 kPa
Address
Name
Description
10h
reserved
—
11h
reserved
—
12h
CONVERT
Start Pressure and Temperature Conversion
[1]
This register is set to 00h. It is reserved, and was previously utilized as Coefficient values, c11 and c22, which were
always 00h.
For values with less than 16 bits, the lower LSBs are zero. For example, c12 is 14 bits
and is stored into 2 bytes as follows:
c12 MS byte = c12[13:6] = [c12b13 , c12b12 , c12b11 , c12b10 , c12b9 , c12b8 , c12b7 , c12b6]
c12 LS byte = c12[5:0] & "00" = [c12b5 , c12b4 , c12b3 , c12b2 , c12b1 , c12b0 , 0 , 0]
8.1 Pressure, temperature and coefficient bit-width specifications
The table below specifies the initial coefficient bit-width specifications for the
compensation algorithm and the specifications for Pressure and Temperature ADC
values.
Table 5. Pressure, temperature and compensation coefficient specifications
a0
b1
b2
c12
Padc
Tadc
Total Bits
16
16
16
14
10
10
Sign Bits
1
1
1
1
0
0
Integer Bits
12
2
1
0
10
10
Fractional Bits
3
13
14
13
0
0
dec pt zero pad
0
0
0
9
0
0
Example Binary Format Definitions:
a0 Signed, Integer Bits = 12, Fractional Bits = 3 :
Coeff a0 = S I11 I10 I9 I8 I7 I6 I5 I4 I3 I2 I1 I0 . F2 F1 F0
b1 Signed, Integer Bits = 2, Fractional Bits = 13 :
Coeff b1 = S I1 I0 . F12 F11 F10 F9 F8 F7 F6 F5 F4 F3 F2 F1 F0
b2 Signed, Integer Bits = 1, Fractional Bits = 14 :
Coeff b2 = S I0 . F13 F12 F11 F10 F9 F8 F7 F6 F5 F4 F3 F2 F1 F0
c12 Signed, Integer Bits = 0, Fractional Bits = 13, dec pt zero pad = 9 :
Coeff c12 = S 0 . 000 000 000 F12 F11 F10 F9 F8 F7 F6 F5 F4 F3 F2 F1 F0
Padc Unsigned, Integer Bits = 10 :
Padc U = I9 I8 I7 I6 I5 I4 I3 I2 I1 I0
Tadc Unsigned, Integer Bits =10 :
Tadc U = I9 I8 I7 I6 I5 I4 I3 I2 I1 I0
Note: Negative coefficients are coded in 2’s complement notation.
8.2 Compensation
The 10-bit compensated pressure output, Pcomp, is calculated as follows:
MPL115A1
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Miniature SPI digital barometer, 50 to 115 kPa
(1)
Where:
Padc is the 10-bit pressure ADC output of the MPL115A
Tadc is the 10-bit temperature ADC output of the MPL115A
a0 is the pressure offset coefficient
b1 is the pressure sensitivity coefficient
b2 is the temperature coefficient of offset (TCO)
c12 is the temperature coefficient of sensitivity (TCS)
Pcomp will produce a value of 0 with an input pressure of 50 kPa and will produce a fullscale value of 1023 with an input pressure of 115 kPa.
(2)
8.3 Evaluation sequence, arithmetic circuits
The following is an example of the calculation for Pcomp, the compensated pressure
output. Input values are in bold.
c12x2 = c12 * Tadc
a1 = b1 + c12x2
a1x1 = a1 * Padc
y1 = a0 + a1x1
a2x2 = b2 * Tadc
Pcomp = y1 + a2x2
This can be calculated as a succession of Multiply Accumulates (MACs) operations of the
form y = a + b * x:
a
b
+
y
X
x
The polynomial can be evaluated (Equation 1) as a sequence of 3 MACs:
MPL115A1
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Miniature SPI digital barometer, 50 to 115 kPa
b1
a1
c12
Tadc
y1
a0
Padc
y
b2
PComp
Tadc
Please refer to NXP application note AN3785 for more detailed notes on implementation.
8.4 SPI device read/write operations
All device read/write operations are memory mapped. Device actions e.g. "Start
Conversions" are controlled by writing to the appropriate memory address location. All
memory address locations are 6-bit (see Table 2).
The 8-bit command word comprises:
• the most significant bit which is the Read/Write identifier which is '1' for read operations
and '0' for write operations.
• the 6-bit address (from Table 4);
• the least significant bit which is not used and is don't care (X).
The device write commands are shown in Table 6.
Table 6. SPI write command
Legend: X = don't care
Command
Binary
Start Conversions
[1]
HEX
0010010X
[1]
24h
The command byte needs to be paired with a 00h as part of the SPI exchange to complete the passing of Start
Conversions.
The actions taken by the part in response to each command are as follows:
Table 7. SPI Write command description
Command
Start Conversions
MPL115A1
Data sheet: technical data
Action taken
Wake main circuits. Start clock. Allow supply stabilization
time. Select pressure sensor input. Apply positive sensor
excitation and perform A to D conversion. Select temperature
input. Perform A to D conversion. Load the Pressure and
Temperature registers with the result. Shut down main circuits
and clock.
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Miniature SPI digital barometer, 50 to 115 kPa
SPI Read operations are performed by sending the required address with a leading Read
bit set to ‘1’. SPI operations require that each byte be addressed individually. All data is
transmitted most significant bit first.
Table 8. Example SPI Read Commands
Legend: X = don't care
Command
Binary
HEX
[1]
Read Pressure MSB
1000000X
80h
Read Pressure LSB
1000001X
82h
Read Temperature MSB
1000010X
84h
Read Temperature LSB
1000011X
86h
Read Coefficient data byte 1
1000100X
88h
[1]
The command byte needs to be paired with a 00h as part of the SPI exchange to complete the passing of stated
command.
8.5 SPI timing
Table 9 and Figure 4 describe the timing requirements for the SPI system.
Table 9. SPI timing
Ref
Symbol Function
Min
Max
Unit
—
8
MHz
1
Of
Operating Frequency
2
tSCLK
SCLK Period
125
—
ns
3
tCLKH
SCLK High time
62.5
—
ns
4
tCLKL
SCLK Low time
62.5
—
ns
5
tSCS
Enable lead time
125
—
ns
6
tHCS
Enable lag time
125
—
ns
7
tSET
Data setup time
30
—
ns
8
tHOLD
Data hold time
30
—
ns
9
tDDLY
Data valid (after SCLK low edge)
—
32
ns
10
tWCS
Width CS High
30
—
ns
Figure 4. SPI timing diagram
MPL115A1
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8.6 Example of SPI reading of coefficients
These are MPL115A1 SPI commands to read coefficients, execute Pressure and
Temperature conversions, and to read Pressure and Temperature data. The sequence
of the commands for the interaction is given as an example to operate the MPL115A1.
Utilizing this gathered data, an example of the calculating the Compensated Pressure
reading is given in floating point notation.
SPI Commands (simplified for communication)
Command to Write "Convert Pressure and Temperature" = 24h
Command to Read "Pressure ADC High byte" = 80h
Command to Read "Pressure ADC Low byte" = 82h
Command to Read "Temperature ADC High byte" = 84h
Command to Read "Temperature ADC Low byte" = 86h
Command to Read "Coefficient data byte 1 High byte" = 88h
Read coefficients:
[CS=0], [88h], [00h], [8Ah], [00h], [8Ch], [00h], [8Eh], [00h], [90h], [00h], [92h], [00h],
[94h], [00h], [96h], [00h], [00h], [CS=1]
Start pressure and temperature conversion, read raw pressure:
[CS=0], [24h], [00h], [CS=1], [3 ms Delay]
[CS=0], [80h], [00h], [82h], [00h], [84h], [00h], [86h], [00h], [00h], [CS=1]
Note: Extra [00h] at the end of each sequence to output the last data byte on the slave
side of the SPI.
Figure 5. SPI read coefficient datagram
MPL115A1
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Miniature SPI digital barometer, 50 to 115 kPa
a0 coefficient MSB
=
41h
a0 coefficient LSB
=
DFh
b1 coefficient MSB
=
B0h
b1 coefficient LSB
=
28h
b2 coefficient MSB
=
BEh
b2 coefficient LSB
=
ADh
c12 coefficient MSB
=
38h
c12 coefficient LSB
=
CCh
a0 coefficient
=
41DFh
=
2107.875
b1 coefficient
=
B028h
=
–2.49512
b2 coefficient
=
BEADh
=
–1.02069
c12 coefficient
=
38CCh
=
0.00086665
Figure 6. SPI start conversion datagram
Command to start pressure and temperature conversion, 24h
Figure 7. SPI read results datagram
Pressure MSB
= 67h
Pressure LSB
= C0h
Pressure
= 67C0h
= 0110 0111 11 00 0000
= 415 ADC counts
Temperature MSB
= 80h
Temperature LSB
= 40h
Temperature
= 8040h
= 1000 0000 01 00 0000
= 513 ADC counts
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8.7 Example of pressure compensated calculation in floating-point
notation
a0 coefficient
=
2107.875
b1 coefficient
=
–2.49512
b2 coefficient
=
–1.02069
c12 coefficient =
0.00086665
Pressure
=
415 ADC counts
Temperature
=
513 ADC counts
Pressure compensation
Using the evaluation sequence
The evaluation sequence is located in Section 8.3.
MPL115A1
Data sheet: technical data
c12x2
= c12 * Tadc
= 0.00086665 * 513
a1
= b1 + c12x2 = –2.49512 + 0.44459
= –2.05052
a1x1
= a1 * Padc
= –2.05052 * 415
= –850.96785
y1
= a0 + a1x1
= 2107.875 + (–850.96785)
= 1256.90715
a2x2
= b2 * Tadc
= –1.02069 * 513
= –523.61444
PComp
= y1 + a2x2
= 1256.90715 + (–
523.61444)
= 733.29270
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Miniature SPI digital barometer, 50 to 115 kPa
9
Maximum ratings
Table 10. Maximum ratings
Voltage (with respect to GND unless otherwise noted)
Symbol
Value
Units
–0.3 to +5.5
V
–0.3 to VDD + 0.3
V
Operating Temperature Range
–40 to +105
°C
Storage Temperature Range
–40 to +125
°C
1000
kPa
VDD
SHDN, SCLK, CS, DIN, DOUT
Overpressure
10 Mechanical and electrical characteristics
Table 11. Mechanical and electrical characteristics
VDD = 2.375 V to 5.5 V, TA = –40 °C to +105 °C, unless otherwise noted. Typical values are at VDD = 3.3 V, TA = +25 °C.
Ref
Parameters
Symbol
1
Operating Supply Voltage
VDD
2
Supply Current
IDD
Conditions
Min
Typ
Max
Units
2.375
3.3
5.5
V
Shutdown (SHDN = GND)
—
—
1
μA
Standby
—
3.5
10
μA
Average – at one measurement per
second
—
5
—
μA
Pressure Sensor
3
Range
50
—
115
kPa
4
Resolution
—
0.15
—
kPa
5
Accuracy
–20 ºC to 85 ºC
—
—
±1
kPa
6
Conversion Time
(Start Pressure and
Temperature Conversion)
tc
Time between start convert command
and data available in the Pressure and
Temperature registers
—
1.6
3
ms
7
Wakeup Time
tw
Time between leaving Shutdown
mode (SHDN goes high) and
communicating with the device to
issue a command or read data.
—
3
5
ms
[1]
—
—
8
MHz
SPI Inputs: SCLK, CS, DIN
8
SCLK Clock Frequency
fSCLK
9
Low Level Input Voltage
VIL
—
—
0.3VDD
V
10
High Level Input Voltage
VIH
0.7VDD
—
—
V
V
SPI Outputs: DOUT
11
12
Low Level Output Voltage
High Level Output Voltage
MPL115A1
Data sheet: technical data
VOL1
At 3 mA sink current
0
—
0.4
VOL2
At 6 mA sink current
0
—
0.6
VOH1
At 3 mA source current
VDD
– 0.4
—
—
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Miniature SPI digital barometer, 50 to 115 kPa
[1]
Nominal maximum SPI clock frequency.
11 Package outline
MPL115A1
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Figure 8. Package outline SOT1769-1 (TSON8)
MPL115A1
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12 Packing information
Figure 9. LGA (3 x 5) embossed carrier tape dimensions
Figure 10. Device orientation in chip carrier
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13 Soldering
1. Use SAC solder alloy, i.e., Sn-Ag-Cu, with a melting point of about 217 °C. It is
recommended to use SAC305, i.e., Sn-3.0 wt.% Ag-0.5 wt.% Cu.
2. Reflow
• Ramp up rate: 2 to 3 °C/s.
• Preheat flat (soak): 110 to 130 s.
• Reflow peak temperature: 250 °C to 260 °C (depends on exact SAC alloy
composition).
• Time above 217°C: 40 to 90s (depends on board type, thermal mass of the board/
quantities in the reflow).
• Ramp down: 5 to 6 °C/s.
• Using an inert reflow environment (with O2 level about 5 to 15 ppm).
Note: The stress level and signal offset of the device also depends on the board type,
board core material, board thickness and metal finishing of the board.
14 Soldering/landing pad information
The LGA package is compliant with the RoHS standard. It is recommended to use a noclean solder paste to reduce cleaning exposure to high pressure and chemical agents
that can damage or reduce life span of the Pressure sensing element.
Figure 11. Recommended PCB landing pattern
MPL115A1
Data sheet: technical data
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 10 October 2017
© NXP B.V. 2017. All rights reserved.
18 / 23
MPL115A1
NXP Semiconductors
Miniature SPI digital barometer, 50 to 115 kPa
15 Revision history
Table 12. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
MPL115A1 v.8
20171010
Technical data
—
MPL115A1 v.7
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Removed the first paragraph of Section 7.
• Added Section 7.1 and Section 7.2 in Section 7 "Handling and Board Mount
Recommendations"
• Updated Figure 8. No technical changes.
MPL115A1 v.7
02/2013
MPL115A1
Data sheet: technical data
Technical data
—
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 10 October 2017
—
© NXP B.V. 2017. All rights reserved.
19 / 23
MPL115A1
NXP Semiconductors
Miniature SPI digital barometer, 50 to 115 kPa
16 Legal information
16.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
[short] Data sheet: product preview
Development
This document contains certain information on a product under development.
NXP reserves the right to change or discontinue this product without notice.
[short] Data sheet: advance information
Qualification
This document contains information on a new product. Specifications and
information herein are subject to change without notice.
[short] Data sheet: technical data
Production
This document contains the product specification. NXP Semiconductors
reserves the right to change the detail specifications as may be required to
permit improvements in the design of its products.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a
technical data data sheet shall define the specification of the product as
agreed between NXP Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed otherwise in writing.
In no event however, shall an agreement be valid in which the NXP
Semiconductors product is deemed to offer functions and qualities beyond
those described in the technical data data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
MPL115A1
Data sheet: technical data
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 10 October 2017
© NXP B.V. 2017. All rights reserved.
20 / 23
MPL115A1
NXP Semiconductors
Miniature SPI digital barometer, 50 to 115 kPa
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In
the event that customer uses the product for design-in and use in automotive
applications to automotive specifications and standards, customer (a) shall
MPL115A1
Data sheet: technical data
use the product without NXP Semiconductors’ warranty of the product for
such automotive applications, use and specifications, and (b) whenever
customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use
of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
NXP — is a trademark of NXP B.V.
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 10 October 2017
© NXP B.V. 2017. All rights reserved.
21 / 23
MPL115A1
NXP Semiconductors
Miniature SPI digital barometer, 50 to 115 kPa
Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Tab. 5.
Tab. 6.
Ordering information ..........................................2
Ordering options ................................................2
Pin description ...................................................3
Device memory map ......................................... 6
Pressure, temperature and compensation
coefficient specifications ....................................7
SPI write command ...........................................9
Tab. 7.
Tab. 8.
Tab. 9.
Tab. 10.
Tab. 11.
Tab. 12.
SPI Write command description ........................9
Example SPI Read Commands ...................... 10
SPI timing ........................................................10
Maximum ratings ............................................. 14
Mechanical and electrical characteristics ........ 14
Revision history ...............................................19
Fig. 7.
Fig. 8.
Fig. 9.
SPI read results datagram .............................. 12
Package outline SOT1769-1 (TSON8) ............ 15
LGA (3 x 5) embossed carrier tape
dimensions ...................................................... 17
Device orientation in chip carrier .....................17
Recommended PCB landing pattern ............... 18
Figures
Fig. 1.
Fig. 2.
Fig. 3.
Fig. 4.
Fig. 5.
Fig. 6.
Block diagram of MPL115A1 .............................2
Pin configuration ............................................... 3
Sequence flow chart ......................................... 5
SPI timing diagram ..........................................10
SPI read coefficient datagram .........................11
SPI start conversion datagram ........................12
MPL115A1
Data sheet: technical data
Fig. 10.
Fig. 11.
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 10 October 2017
© NXP B.V. 2017. All rights reserved.
22 / 23
MPL115A1
NXP Semiconductors
Miniature SPI digital barometer, 50 to 115 kPa
Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
9
10
11
12
13
14
15
16
General description ............................................ 1
Features ............................................................... 1
Applications .........................................................1
Ordering information .......................................... 2
Ordering options ................................................ 2
Block diagram ..................................................... 2
Pinning information ............................................ 3
Pinning ............................................................... 3
Pin description ................................................... 3
Handling
and
Board
Mount
Recommendations .............................................. 3
Methods of Handling ......................................... 3
Board Mount Recommendations ....................... 4
Functional description ........................................5
Pressure, temperature and coefficient bitwidth specifications ............................................7
Compensation ....................................................7
Evaluation sequence, arithmetic circuits ............8
SPI device read/write operations ....................... 9
SPI timing ........................................................ 10
Example of SPI reading of coefficients ............ 11
Example
of
pressure
compensated
calculation in floating-point notation .................13
Maximum ratings ...............................................14
Mechanical and electrical characteristics .......14
Package outline .................................................15
Packing information ..........................................17
Soldering ............................................................18
Soldering/landing pad information ..................18
Revision history ................................................ 19
Legal information .............................................. 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2017.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 10 October 2017
Document identifier: MPL115A1
