SIT1552AI-JE-DCC-32.768E 数据手册
SiT1552
Smallest (1.2mm2), Smallest (1.2mm2), Ultra-Low Power, 32.768 kHz
MEMS TCXO
Smallest (1.2mm2), Ultra-Low Power, 32.768 kHz MEMS TCXO
Features
Applications
32.768 kHz ±5, ±10, ±20 ppm frequency stability options
over temp
World’s smallest TCXO in a 1.5 x 0.8 mm CSP
Operating temperature ranges:
0°C to +70°C
-40°C to +85°C
Ultra-low power: 3.63V, or lower operating frequency
below 32 kHz.
When measuring the SiT1552 output frequency with a
frequency counter, it is important to make sure the counter's
gate time is >100 ms. The slow frequency of a 32kHz clock
will give false readings with faster gate times.
Rev 1.31
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SiT1552
2
Smallest (1.2mm ), Ultra-Low Power, 32.768 kHz MEMS TCXO
Calculating Load Current
No Load Supply Current
Total Supply Current with Load
When calculating no-load power for the SIT1552, the core
and output driver components need to be added. Since the
output voltage swing can be programmed to minimize load
current, the output driver current is variable. Therefore, noload operating supply current is broken into two sections;
core and output driver. The equation is as follows:
To calculate the total supply current, including the load,
follow the equation listed below.
Total Current = Idd Core + Idd Output Driver + Load Current
Example 1: Full-swing LVCMOS
Total Supply Current (no load) = Idd Core + Idd Output Driver
Vdd = 1.8V
Example 1: Full-swing LVCMOS
Idd Core = 990n
Vdd = 1.8V
Load Capacitance = 10pF
Idd Core = 990nA (typ)
Idd Output Driver: (Cdriver)(Vout)(Fout) =
Voutpp = 1.8V
Idd Output Driver: (Cdriver)(Vout)(Fout) =
(3.5pF)(1.8V)(32768Hz) = 206nA
(3.5pF)(1.8V)(32768Hz) = 206nA
Load Current: (10pF)(1.8V)(32768Hz) = 590nA
Total Current = 990nA + 206nA + 590nA = 1.79µA
Supply Current = 990nA + 206nA = 1.2µA
Rev 1.31
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SiT1552
2
Smallest (1.2mm ), Ultra-Low Power, 32.768 kHz MEMS TCXO
Typical Operating Curves
Frequency Stability (PPM)
(TA = 25°C, Vdd = 1.8V, unless otherwise stated)
Pre-reflow
5 ppm Option (E)
200 units
Post 3x-reflow
5 ppm Option (E)
200 units
Temperature (°C)
Figure 4. Frequency Stability Over Temperature
(Post-Reflow)
Output Stage Current (nA/Vpp)
Figure 3. Frequency Stability Over Temperature
(Pre-Reflow)
Vdd = 3.63V
Vdd = 1.5 – 1.8V
Vdd = 3.63V
Vdd = 1.5 – 1.8V
Temperature (°C)
No Load Current (µA)
Figure 5. Core Current Over Temperature
Figure 6. Output Stage Current Over Temperature
Vdd = 3.63V
(6µA)
Vdd = 1.5 – 1.8V
0.99
Time from Power ON [ms]
Temperature (°C)
Figure 7. Total Supply Current Over Temperature,
LVCMOS (Core + LVCMOS Output Driver, No Load)
Rev 1.31
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Figure 8. Start-up and Steady-State Current Profile
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Smallest (1.2mm ), Ultra-Low Power, 32.768 kHz MEMS TCXO
Frequency Error (ppm)
SiT1552
Noise Injection Frequency (Hz)
Figure 9. Power Supply Noise Rejection (±150mV Noise)
Figure 10. Temperature Ramp Response
Figure 11. LVCMOS Output Waveform
(Vswing = 1.8V, SIT1552AI-JE-DCC-32.768, 10 pF Load)
Rev 1.31
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SiT1552
2
Smallest (1.2mm ), Ultra-Low Power, 32.768 kHz MEMS TCXO
Dimensions and Patterns
Package Size – Dimensions (Unit: mm)
Recommended Landing Pattern (Unit: mm)
1.54 ±0.02
#4
#3
0.84 ±0.02
1.55 x 0.85 mm CSP
#3
#4
#4
#3
0.315 ±0.015
#1
#2
#2
#1
#1
#2
(soldermask openings shown with
dashed line around NSMD pad)
Recommend 4-mil (0.1mm) stencil thickness
Rev 1.31
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SiT1552
2
Smallest (1.2mm ), Ultra-Low Power, 32.768 kHz MEMS TCXO
Manufacturing Guidelines
1) No Ultrasonic Cleaning: Do not subject the SiT1552 to an ultrasonic cleaning environment. Permanent damage or long
term reliability issues to the MEMS structure may occur.
2) Do not apply underfill to the SiT1552. The device will not meet the frequency stability specification if underfill is applied.
3) Reflow profile, per JESD22-A113D.
4) For additional manufacturing guidelines and marking/tape-reel instructions, refer to: SiTime Manufacturing Notes.
Rev 1.31
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SiT1552
2
Smallest (1.2mm ), Ultra-Low Power, 32.768 kHz MEMS TCXO
Ordering Information
Part number characters in blue represent the customer specific options. The other characters in the part number are fixed.
SiT1552AI-JE-DCC-32.768S
Part Family
Packaging
“SiT1552”
“S”: 8 mm Tape & Reel, 10ku reel
“D”: 8 mm Tape & Reel, 3ku reel
“E”: 8 mm Tape & Reel, 1ku reel
Revision Letter
“A”: is the revision
Blank for Bulk
Samples in cut Tape & Reel strips
Temperature Range
Output Clock Frequency (kHz)
“C”: Commercial, 0 to 70ºC
32.768 kHz
“I”: Industrial, -40 to 85ºC
Package Size
“J”: 1.5 mm x 0.8 mm CSP
Over Temperature Stability Options
“E”: ±5 ppm
“F”: ±10 ppm
“1”: ±20 ppm
LVCMOS Output
Rev 1.31
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SiT1552
2
Smallest (1.2mm ), Ultra-Low Power, 32.768 kHz MEMS TCXO
Table 4. Revision History
Version
Release Date
1.0
09/17/2014
Change Summary
Rev 0.9 Preliminary to Rev 1.0 Production Release
Updated start-up time specification
Added typical operating plots
Removed SOT23 and 2012 SMD package options
Added “no underfill” in frequency stability specification condition
Added Manufacturing Guidelines section
1.1
10/14/2014
Improved Start-up Time at Power-up spec
Added 5 pF LVCMOS rise/fall time spec
1.2
11/10/2014
Updated 5 pF LVCMOS rise/fall time spec
1.3
11/12/2015
Removed NanoDrive from EC Table and Ordering Info
Updated logo and company address
1.31
01/18/2018
Updated SPL, page layout changes
SiTime Corporation, 5451 Patrick Henry Drive, Santa Clara, CA 95054, USA | Phone: +1-408-328-4400 | Fax: +1-408-328-4439
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or defect of a Product which is caused in whole or in part by (i) use of any circuitry other than circuitry embodied in a SiTime product, (ii) misuse or abuse including static discharge, neglect
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