SMD6000

Lead Free Solder Wire and Spheres Safety Data Sheet (SDS) www.chipquik.com To comply with European CLP Regulation 1272/2008, US 29CFR 1910.1200 OSHA's Hazard Communication Standard, Australian NOHSC: 1008 [2004] and ADG Code 7.4, and Canadian WHMIS 2015 1. PRODUCT AND COMPANY IDENTIFICATION PRODUCT NAME: SYNONYMS: PART NUMBERS: Chip Quik Lead Free Solder Wire and Spheres Series: SMDSWLF, SMDSWLTLFP, SMD_NL, SMD20 Solder Spool, Solder Sticks, Solder Coil, Chip Quik Alloy, Removal Alloy, Rework Solder, Solder Spheres SMD1NL, SMD4.5NL, SMD8NL, SMD16NL, SMD32NL, SMD32NLS, SMD32ENL, SMD6000, SMDSWLF.020 1OZ, SMDSWLF.031 1OZ, SMDSWLF.020 2OZ, SMDSWLF.031 2OZ, SMDSWLF.020 4OZ, SMDSWLF.031 4OZ, SMDSWLTLFP32, SMD2040, SMD2040-25000, SMD2050, SMD2050-25000, SMD2055, SMD2055-25000, SMD2060, SMD2060-25000, SMDSWLF.015 1LB, SMDSWLF.020 1LB, SMDSWLF.031 1LB, SMD2SWLF.015 1LB, SMD2SWLF.020 1LB, SMD2SWLF.031 1LB, SMDSWLF.015 8OZ, SMDSWLF.020 8OZ, SMDSWLF.031 8OZ, SMD2SWLF.015 8OZ, SMD2SWLF.020 8OZ, SMD2SWLF.031 8OZ, SOLDERWICK1.5, SOLDERWICK2.0, SOLDERWICK2.8, SMDIN100, SMDIN52SN48, SMDIN97AG3, SMDSWLF.015 .3OZ, SMDSWLF.020 .4OZ, SMDSWLF.031 .7OZ, SMD2SWLF.015 .3OZ, SMD2SWLF.020 .4OZ, SMD2SWLF.031 .7OZ, SMDSWLF.006 50g, SMDSWLF.008 50g, SMD2SWLF.012 100g, SMDSWLF.015 1OZ, SMDSWLF.015 2OZ, SMDSWLF.015 4OZ, SMD2SWLF.015 1OZ, SMD2SWLF.015 2OZ, SMD2SWLF.015 4OZ, SMD2SWLF.020 1OZ, SMD2SWLF.020 2OZ, SMD2SWLF.020 4OZ, SMD2SWLF.031 1OZ, SMD2SWLF.031 2OZ, SMD2SWLF.031 4OZ, SMD2016, SMD2016-25000, SMD2020, SMD2020-25000, SMD2024, SMD2024-25000, SMD2028, SMD2028-25000, SMD2032, SMD2032-25000, SMD2036, SMD2036-25000, RASWLF.015 1OZ, RASWLF.015 2OZ, RASWLF.015 4OZ, RASWLF.015 8OZ, RASWLF.015 1LB, RASWLF.020 1OZ, RASWLF.020 2OZ, RASWLF.020 4OZ, RASWLF.020 8OZ, RASWLF.020 1LB, RASWLF.031 1OZ, RASWLF.031 2OZ, RASWLF.031 4OZ, RASWLF.031 8OZ, RASWLF.031 1LB, RASWLF.015 .3OZ, RASWLF.020 .4OZ, RASWLF.031 .7OZ, SMDSWLT.040 10g, SMDSWLT.040 20g, SMDSWLT.040 50g, SMDSWLT.040 100g, SMDSWLT.040 200g, NCSWLF.020 1LB, NCSWLF.031 1LB, NC2SWLF.020 1LB, NC2SWLF.031 1LB, NC3SWLF.020 1LB, NC3SWLF.031 1LB, SMDIN100-R, SMDIN52SN48-R, CQ100Ge.020 1LB, CQ100Ge.031 1LB, SMD2SWLT.040 10g, SMD2SWLT.040 20g, SMD2SWLT.040 50g, SMD2SWLT.040 100g, SMD2SWLT.040 200g, SMD3SWLT.040 10g, SMD3SWLT.040 20g, SMD3SWLT.040 50g, SMD3SWLT.040 100g, SMD3SWLT.040 200g, REMKIT-NL, NCSWLF.020 0.3OZ, NCSWLF.031 0.5OZ, NC2SWLF.020 0.3OZ, NC2SWLF.031 0.5OZ, NC3SWLF.020 0.3OZ, NC3SWLF.031 0.5OZ, REM4.5-NL, REM8-NL, REM16-NL, REM32-NL, REMKIT4.5-NL, REM2.7-ULTRA-NL, REM4.5-ULTRA-NL, REM8-ULTRA-NL, REM16-ULTRA-NL, REM32-ULTRA-NL, NCSWLF.015 1LB, NCSWLF.015 0.2OZ, NCSWLF.015 1OZ, NCSWLF.015 2OZ, NCSWLF.015 4OZ, NCSWLF.015 8OZ, NC2SWLF.015 1LB, NC2SWLF.015 0.2OZ, NC2SWLF.015 1OZ, NC2SWLF.015 2OZ, NC2SWLF.015 4OZ, NC2SWLF.015 8OZ, SMDSWLF.006 1g, SMDSWLF.006 2g, SMDSWLF.006 5g, SMDSWLF.006 10g, SMDSWLF.059 3.3 1LB, CQ-SS-SNBIAG-0.20MM-25000, CQ-SS-SNBIAG-0.25MM-25000, CQ-SS-SNBIAG-0.30MM-25000, CQ-SS-SNBIAG-0.35MM-25000, CQ-SS-SNBIAG0.40MM-25000, CQ-SS-SNBIAG-0.45MM-25000, CQ-SS-SNBIAG-0.50MM-25000, CQ-SS-SNBIAG-0.60MM-25000, CQ-SSSNBIAG-0.76MM-25000, SMDSWLF.004 20g, SMDIN100-0.4mm, SMDIN52SN48-0.4mm, SMDIN97AG3-0.4mm, SMDSWLTLFP16, SMDIN66.3BI33.7, SMDSN60BI40, CQ-SS-SAC405-0.20MM-25000, CQ-SS-SAC405-0.25MM-25000, CQ-SS-SAC405-0.30MM-25000, CQ-SS-SAC405-0.35MM-25000, CQ-SS-SAC405-0.40MM-25000, CQ-SS-SAC4050.45MM-25000, CQ-SS-SAC405-0.50MM-25000, CQ-SS-SAC405-0.60MM-25000, CQ-SS-SAC405-0.76MM-25000, SMDIN52SN48-1.69X5.71-R MANUFACTURER: ADDRESS: Chip Quik Inc. 931-3909 Witmer Rd., Niagara Falls, NY 14305 (USA) 3rd Floor, 207 Regent Street, London W1B 3HH (UK and EU) 8-1500 Sandhill Dr., Ancaster, ON L9G 4V5 (Canada) 42A Crimea Street, C/O A03886, Parramatta, NSW, 2150 (Australia) (508) 477-2264 (800) 424-9300 (USA and Canada 24/7 CHEMTREC) +44 20 3868 7152 (UK and EU 24/7) +61 2 8607 7057 (Australia 24/7) PHONE: EMERGENCY PHONE: REVISION DATE: REVISION NUMBER: REVISED BY: 2023/06/09 6.1 Chip Quik Product Safety PRODUCT USE: Soldering components for bonding semiconductor chips and packages to circuit boards. Removal of semiconductor chips and packages from circuit boards. 2. HAZARD IDENTIFICATION HMIS® RATING NFPA® 704 CODES: HMIS® and NFPA® Risk Ratings Legend: 0 (Low or None), 1 (Slight), 2 (Moderate), 3 (Serious), 4 (Severe) Classified in accordance with European CLP Regulation 1272/2008 Acute Toxicity Skin Irritant Skin Sensitization 4 2 1 CHEMICAL NAME: CHEMICAL FAMILY: CHEMICAL FORMULA: NA Mixture Proprietary ROUTES OF ENTRY: Inhalation, Ingestion, Skin/Eye Contact TARGET ORGANS: NA GHS/CLP: Signal Word: Warning GHS/CLP LABEL ELEMENTS: Hazard statement(s) H302 H315 H317 H319 H332 H335 Precautionary statement(s) P102 P201 P202 P233 P260 P262 P264 P270 P271 P272 P273 P280 P284 P301/P330/P331/P310 P303/P361/P352/P333/P313 P304/P340/312 P305/P351/338/P310 P308/P313 P342/P311 P362 P391 P402/P404 P405 P501 Harmful if swallowed. Causes skin irritation. May cause an allergic skin reaction. Causes serious eye irritation. Harmful if inhaled. May cause respiratory irritation. Keep out of reach of children. Obtain special instructions before use. Do not handle until all safety precautions have been read and understood. Keep container tightly closed. Do not breathe dust/fume/gas/mist/vapor/spray. Do not get in eyes, on skin, or on clothing. Wash hands thoroughly after handling. Do not eat, drink, or smoke when using this product. Use in a well-ventilated area. Contaminated work clothing should not be allowed out of the workplace. Avoid release to the environment. Wear protective gloves/protective clothing/eye protection/face protection. In case of inadequate ventilation wear respiratory protection. IF SWALLOWED: Rinse mouth. DO NOT induce vomiting. Immediately call a POISON CENTER/Doctor. IF ON SKIN (or hair): Take off immediately all contaminated clothing. Wash with soap & water. Get medical advice/attention if skin irritation or rash occurs or if you feel unwell. IF INHALED: Remove victim to fresh air and keep comfortable for breathing. Call a POISON CENTER or doctor/physician if you feel unwell. IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing. Immediately call POISON CENTER/Doctor. IF EXPOSED OR CONCERNED: Get medical advice/attention. IF EXPERIENCING RESPIRATORY SYMPTOMS: Call POISON CENTER/Doctor. Take off contaminated clothing and wash it before reuse. Collect spillage. Store in a dry place. Store in a closed container. Store locked up. Dispose of contents/container in accordance with local/regional/national/international regulations. POTENTIAL HEALTH EFFECTS (CHRONIC and OVEREXPOSURE) Tin: Dust or fumes may cause irritation of the skin mucous membranes and may result in a benign Pneumoconiosis (Stannosis). Silver: May cause discoloration of eyes and skin (Argyia). Bismuth: May cause foul breath, a blue-black line on the gums, and Stomatitis. Antimony: May cause gastrointestinal upset, sleeplessness, irritability, and muscular pain. Indium: May cause weight loss, pulmonary edema, blood damage and degenerative changes in liver and kidneys. MEDICAL CONDITIONS POSSIBLY AGGRAVATED BY EXPOSURE: Diseases of the blood-forming organs, kidneys, nervous and possibly reproductive systems. Occupational Asthma. SECTION 2 NOTES: Chip Quik Inc. does not recommend, manufacture, market, or endorse any of its products for human consumption. 3. COMPOSITION / INFORMATION ON INGREDIENTS Classified in accordance with European CLP Regulation 1272/2008 Hazardous Ingredients (1) C.A.S. Number Weight Percent Modified Rosins (Rosin) (2) Pine Oil Derivatives (Terpineol) Mixed Carboxylic Acids (Maleic Acid)(2) Tin Silver Bismuth Indium Copper 8050-09-7 8000-41-7