SMP3022-01ETG
Green Products
Technical Data
Data Sheet N1741 Rev.-
Description
The SMP3022 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide
protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2
international standard ( ± 20kV contact discharge) without performance degradation. The back-to-back
configuration provides symmetrical ESD protection for data lines when AC signals are present and the low loading
capacitance makes it ideal for protecting high speed data lines such as HDMI, USB2.0, USB3.0 and eSATA.
Features
•
•
•
•
ESD protection in accordance with:
IEC 61000-4-2 (ESD) ±30kV (air), ±20kV (contact)
IEC 61000-4-5 (lightning) 3A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Low capacitance of 0.35pF @ VR=0V (TYP)
Low leakage current of 100nA at 5.3V(MAX)
Extremely low dynamic resistance (0.7Ω TYP)
Applications
•
•
•
•
•
•
•
•
•
USB 3.0/USB 2.0/MHL
MIPI Camera and Display
HDMI 2.0, DisplayPort 1.3, eSATA
Set Top Boxes, Game Consoles
Smart Phones
External Storage
Ultrabooks, Notebooks
Tablets, eReaders
High Speed Serial Interfaces
Pinout
Functional Block Diagram
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SMP3022-01ETG
Green Products
Technical Data
Data Sheet N1741 Rev.-
Ordering Information:
Device
Package
Packaging Options
P0/P1
Packaging
Speciications
Min. Order
Qty.
SMP3022-01ETG
SOD882
Tape & Reel - 8mm
tape/7” reel
4mm/2mm
EIA RS-481
10000
Absolute Maximum Ratings:
Parameter
Symbol
Value
Unit
Peak Pulse Current (tp=8/20μs)
IPP
3.0
A
Operating Temperature
TOP
-40 to + 125
°C
Peak Pulse Power (tP=8/20μs)
PPK
20
W
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only
rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not
implied.
Thermal Information:
Parameter
Value
Unit
-55 to + 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
Storage Temperature Range
Electrical Characteristics: (TOP=25°C)
Characteristics
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage1
Dynamic Resistance2
1
ESD With stand Voltage
Junction Capacitance1
Symbol
VRWM
VBR
ILEAK
VC
RDYN
VESD
CD
Condition
IR=1mA
VR =5.3V
IPP = 1A, tp=8/20μs, Fwd
Min.
6.8
-
Typ.
7.8
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