SMDB03LCC
THRU
SMDB24LCC
Green Products
Technical Data
Data Sheet N0427, Rev. B
MARKING DIAGRAM
Where XXXXX is YYWWL
SMDB03LCC
S
YY
WW
L
= Part Name
=S
= Year
= Week
= Lot Number
Cautions：Molding resin
Epoxy resin UL:94V-0
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SMDB03LCC
THRU
SMDB24LCC
Green Products
Technical Data
Data Sheet N0427, Rev. B
PACKAGE OUTLINES & DEMENSIONS
MILLMETER
SYMBOL
MIN.
TYP.
MAX.
A
-
-
1.75
A1
0.10
-
0.225
A2
1.30
1.40
1.50
A3
0.60
0.65
0.70
b
0.39
-
0.48
c
0.21
-
0.26
D
4.70
4.90
5.10
E
3.70
3.90
4.10
E1
5.80
6.00
6.20
e
1.27BSC
h
0.25
-
0.50
L
0.50
-
0.80
L1
Θ1
1.05BSC
0
SO-8
Circuit Diagram
Ideal for Ethernet applications, SMDBxxLCC Series
provides up to four (4) lines of protection in a commonmode configuration.
Circuit connectivity is as follows:
✔ TPIN is connected to Pin 5.
✔ TPIP is connected to Pin 6.
✔ TPON is connected to Pin 1.
✔ TPOP is connected to Pin 2.
✔ Pins 3, 4, 7 & 8 are connected to ground.
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-
8°
SMDB03LCC
THRU
SMDB24LCC
Green Products
Technical Data
Data Sheet N0427, Rev. B
Ordering Information:
Device
SMDB03LCC THRU SMDB24LCC
Package
Shipping
SO-8 (Pb-Free)
2500pcs / reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification.
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SMDB03LCC
THRU
SMDB24LCC
Green Products
Technical Data
Data Sheet N0427, Rev. B
Fig.1- Peak Pulse vs. Pulse Time (μs)
Fig.2- Pulse Waveform (μs)
CLAMPING VOLTAGE(V)
15
12
9
SMDB05LCC
6
3
0
0
5
10
15
20
25
30
35
40
PEAK PULSE CURRENT(A)
Fig.3- Power Derating Curve
Fig.4- Clamping Voltage vs. Peak Pulse Current
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SMDB03LCC
THRU
SMDB24LCC
Technical Data
Data Sheet N0427, Rev. B
Green Products
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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