41206ESDA-TR1

Technical Data DS41206 Effective January 2023 Supersedes May 2017 41206ESDA(2)-TR ESD suppressor four-channel Applications • Product features computers and computer-related equip-ment, such as modems, keyboards, and printers. ESDA family is also well suited for portable electronic equipment such as mobile telephones, test equipment, and card scanners nfotainment and telematics • Computers • Printers • Portable electronics Mobile phones • Protects up to 4 separate lines with one device • • ESD protection for high frequency, low voltage applications • Test equipment • Card scanners • Exceeds testing requirements outlined in IEC 61000-4-2 • Extremely low capacitance • 1206 (3216 metric) compact design utilizes less board space • Fast response time • Bi-directional • 41206ESDA-TR1 Ceramic substrate, 41206ESDA2-TR2 Alumina substrate Environmental compliance HALOGEN HF FREE 41206ESDA-TR1 not Halogen free Ordering part number 4 1206 ESD A -TR1 4 channel device Size designator Type Characteristics Packaging suffix Characteristic A= Standard A2= 2nd Generation Package suffix -TR1 and -TR2: 5000 parts on a 7” diameter reel 41206ESDA(2)-TR ESD suppressor four-channel  Technical Data DS41206 Effective January 2023 Product specifications Performance Characteristics Continuous operating voltage Units Min Typ Vdc 12 Clamping voltage3 V 35 Trigger voltage 1 Max 60 V 500 ESD Threat voltage capability5 kV 8 15 Capacitance (@ 1 kHz to 1.8 GHz) pF 0.15 1 Leakage current (@ 12 Vdc) nA Peak current A 4 100 30 45 Operating temperature °C -40 +25 +105 ESD pulse withstand3,2 # pulses 20 >500 - 3 1. The product is 100% tested for 30 V operating voltage at +25°C. Continuous operation with higher than 12 Vdc under extreme temperature and humidity may cause increasing leakage current and/or shifting device resistance. However, even under severe environmental test, characteristics of the device did not change up to 12 Vdc operation. 2. Some shifting in characteristics may occur when tested over several hundred ESD pulses at very rapid rate of 1 pulse per second or faster. 3, Per IEC 61000-4-2, 30 A @ 8 kV, level 4, clamp measurement made 30 ns after initiation of pulse, all tests in contact discharge mode. 4, Trigger measurement made using Transmission line pulse (TLP) method. 5. PolySurg™ devices are capable of withstanding up to a 15 kV, 45 A ESD pulse. Device ratings are given at 8 kV per Note 1, unless otherwise specified. Circuit symbol Dimensions—mm/(inch) Recommended pad layout (per IPC-7351) L W H A B C D E F I X 3.2 ± 0.2 (0.126 ± 0.008) 1.6 ± 0.2 (0.063 ± 0.008) 0.8 max (0.032 max) 0.38 ± 0.05 (0.015 ± 0.002) 0.2 min, 0.4 typ (0.008 min, 0.16 typ ) 0.4 Typ (0.016 Typ) 0.2 ± 0.1 (0.008 ± 0.004) 0.2 Typ (0.008 typ) 0.38 ± 0.20 (0.015 ± 0.008) 0.80 ± 0.02 (0.03 ± 0.0008) 0.45 ± 0.02 (0.017 ± 0.0008) Part marking : No marking Termination finish: Tin over nickel Color: Green: 41206ESDA-TR1; Black: 41206ESDA2-TR2 2 www.eaton.com/electronics Technical Data DS41206 41206ESDA(2)-TR ESD suppressor four-channel Effective January 2023  General specifications Moisture resistance: MIL-STD-202 Method 103, +85 °C, 85%R.H., 240 hours Thermal shock: MIL-STD-202, Method 107G, -65 °C to +125 °C, 30 minutes per cycle, 5 cycles Vibration: MIL-STD-202F, Method 201A,(10 to 55 to 10 Hz, 1 minute per cycle, 2 hours each in X-Y-Z) Chemical resistance: ASTM D-543, 24 hours @ +50 °C, 3 solutions (H2O, detergent solution, de_fluxer) Full load voltage: Up to 24 Vdc, 1000 hours, +25°C Resistance to solder heat: Per MIL-STD-202 Method 210 Solderability: MIL-STD-202, Method 208 (95% coverage) Packaging information - mm 5,000 parts on a 7 inch tape and reel (EIA Standard 481 compliant) A D0 P0 E1 P2 B B F E2 P1 A W B0 K0 SECTION A-A A0 SECTION B-B Dimension Millimeter W 8.00±0.30 F 3.50±0.05 E1 1.75±0.10 E2 6.25±0.30 P0 4.00±0.10 P1 4.00±0.10 P2 2.00±0.05 D0 1.5±0.10 A0 3.62±0.02 B0 2.02±0.02 K0 0.75±0.05 www.eaton.com/electronics 3 Technical Data DS41206 Effective January 2023 41206ESDA(2)-TR ESD suppressor four-channel  Design considerations The location in the circuit for the 41206ESDA(2) has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common ground). Device application 41206ESDA(2) family are applicable to most signal line circuits. It is applied in a shunt-connected manner. They are not suitable for use on lines where lighting or load-switching transients are present. 41206ESDA(2) family is ideal for use in computers and computer related equipment, such as modems, keyboards, and printers. 41206ESDA(2) family is also well suited for portable electronic equipment such as mobile telephones, test equipment, and card scanners. Processing recommendations 41206ESDA(2) family currently have a convex profile on the top surface of the part. This profile is a result of the construction of the device. They can be processed using standard pick-and-place equipment. The placement and processing techniques for 41206ESDA(2) family are similar to those used for chip resistors and chip capacitors Typical applications 4 www.eaton.com/electronics 41206ESDA(2)-TR ESD suppressor four-channel Technical Data DS41206 Effective January 2023  Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb solder (Tc) Package thickness Volume mm3