CB61F10A-TR1

Effective April 2024 Supersedes December 2020 Technical Data 4377 CB61F Fast-acting surface mount Brick™ fuses Applications Primary circuit protection Product features • Power supplies • Servers • Medical equipment • White goods • Battery chargers • Consumer electronics • Test equipment • Battery pack protection • Fast-acting • 2410 (6125 metric) compact footprint • Designed to UL 248 Agency information • High interrupting ratings • • Current ratings from 2 A to 40 A UL Listed cULus: File E19180, Guide JDYX (2 A - 15 A) • Reflow and wave solder compatible • • Wire-in-air design UL Recognized cURus: File E19180, Guide JDYX2 (20 A - 40 A) Moisture sensitivity level (MSL): 1 • • CQC: CQC09012040316 (2 A - 6.3 A & 8 A - 10 A) Environmental compliance HALOGEN Pb HF FREE Ordering code The ordering code is the part number replacing the “.” with a “-” plus adding the packaging suffix. CB61F 6-3A Product code Ampere rating Packaging suffix • -TR1 1000 fuses on a 7” diameter tape and reel • -TR2 5000 fuses on a 13” diameter tape and reel (2 A to 15 A only) CB61F Fast-acting surface mount Brick™ fuses  Technical Data 4377 Effective April 2024 Electrical characteristics Amp Rating % of Amp Rating Opening Time 2 A – 40 A 100% 4 hours minimum 2 A – 15 A 200% 5 seconds maximum 20 A – 40 A 200% 60 seconds maximum Product specifications Current rating (A) Voltage rating (Vac) Voltage rating (Vdc) Interrupting rating1,2 (A) @ rated voltage (Vac) (Vdc) Typical DC cold resistance3 (mΩ) Typical melting4 I²t (A2s) Typical voltage drop5 (mV) Part marking CB61F2A 2.0 125 125 100 300 39 0.85 100 2 x x CB61F3A 3.0 125 125 100 300 25 2.08 100 3 x x CB61F4A 4.0 125 125 100 300 17 4.4 93 4 x x CB61F5A 5.0 125 125 100 300 13 7.7 90 5 x x CB61F6.3A 6.3 125 125 100 300 10 13.7 90 6.3 x x CB61F7A 7.0 125 125 100 300 9 15.6 85 7 x CB61F8A 8.0 125 125 100 300 8 19.5 90 8 x x CB61F10A 10 125 125 100 300 6 36 90 10 x x CB61F12A 12 125 125 50 200 5 40 90 12 x CB61F15A 15 125 125 50 200 4 56 85 15 x CB61F20A 20 - 72 - 500 2.3 210 60 20 x CB61F25A 25 - 72 - 500 1.7 400 55 25 x CB61F30A 30 - 72 - 500 1.2 900 50 30 x CB61F40A 40 - 63 - 500 0.9 1600 50 40 x Part Number 1. 2. 3. 4. 5. AC Interrupting rating: Measured at rated voltage, 100% power factor DC Interrupting rating: Measured at rated voltage, time constant of less than 50 microseconds, battery source Typical DC cold resistance: Measured at 10% of rated current Typical Pre-arcing I2t are measured at 10In Current Typical voltage drop: Measured at rated current after temperature stabilizes Dimensions–mm 2 A to 15 A Recommended pad layout 20 A to 40 A Recommended pad layout 2 www.eaton.com/electronics Agency approval cULus cURus CQC Technical Data 4377 CB61F Fast-acting surface mount Brick™ fuses Effective April 2024  Time current curve 2 A to 15 A 20 A to 40 A Temperature derating curve General specifications Operating temperature: -55 °C to +125 °C (with derating) Storage temperature: -55 °C to +125 °C Thermal shock: 2 A to 15 A - MIL-STD-202, Method 107G, -65 °C/+125 °C, number of cycles :10 20 A to 40 A - MIL-STD-202, Method 107G -55 °C/+125 °C, number of cycles: 100 Bias humidity: 2 A to 15 A - MIL-STD-202, Method 103 +85 °C/85%RH. ,100 hours 20 A to 40 A - MIL-STD-202, Method 103 +85 °C/85%RH. ,1000 hours Mechanical shock: 2 A to 40 A - MIL-STD-202G, Method 213B, Test condition C, 100 g’s peak for 6 ms; Half-sine waveform Mechanical vibration: 2 A to 15 A - MIL-STD-202G, Method 201, Test condition A (10 - 55 Hz, 0.06 inch, 2 hours each of 3 mutually perpendicular direction, total 6 hours), high Freguency: 20 g’s for 20 min., 12 cycles each of 3orientations. ,10 - 2000 Hz.10 to 55 Hz, 0.06 inch, total excursion 20 A to 40 A - MIL-STD-202G, Method 201, 2 hours each of 3 orientations. Test from 10 -5 5 Hz in 1 minute Resistance to solder heat: 2 A to 40 A - MIL-STD-202G, Method 210F , condition D (+260 °C, 10s) www.eaton.com/electronics 3 CB61F Fast-acting surface mount Brick™ fuses  Technical Data 4377 Effective April 2024 Wave solder profile tp Temperature Tp First Wave Second Wave Tsmax Tstyp Tsmin Preheat area Cool down area Time Reference EN 61760-1:2006 Profile feature Standard SnPb solder Lead (Pb) free solder • Temperature min. (Tsmin) 100 °C 100 °C • Temperature typ. (Tstyp) 120 °C 120 °C • Temperature max. (Tsmax) 130 °C 130 °C • Time (Tsmin to Tsmax) (ts) 70 seconds 70 seconds D preheat to max Temperature 150 °C max. 150 °C max. Peak temperature (TP)* 235 °C – 260 °C 250 °C – 260 °C Time at peak temperature (tp) 10 seconds max 5 seconds max each wave 10 seconds max 5 seconds max each wave Ramp-down rate ~ 2 K/s min ~3.5 K/s typ ~5 K/s max ~ 2 K/s min ~3.5 K/s typ ~5 K/s max Time 25 °C to 25 °C 4 minutes 4 minutes Preheat Manual solder +350 °C (4-5 seconds by soldering iron), generally manual/hand soldering is not recommended 4 www.eaton.com/electronics CB61F Fast-acting surface mount Brick™ fuses Technical Data 4377 Effective April 2024  Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb solder (Tc) Package thickness Volume mm3