TR/3216TD750-R

Chip™ Fuses 3216TD Series, Time-Delay Dimensions - mm (in) Drawing Not to Scale 1.6±0.1 (0.063) 3.2±0.1 (0.125) 5A 1.0±0.1 (0.039) 1.6±0.1 (0.063) th. 0.1mm Description • Time-delay, surface mount fuse • RoHS compliant and Lead Free • High inrush withstand capability • Wire-in-Air performance • Compatible with leaded and lead-free reflow and wave solder Agency Information • Recognition File number: E19180 Environmental Data • Operating temperture range: -55°C to 125°C with proper derating • Vibration: MIL-STD-202, Method 204 Condition D • Solderability: ANSI/J-STD-002C, Test B Ordering • Specify packaging and product code (i.e., TR/3216TD1-R) Soldering Method • Wave immersion: 260°C, 10 Sec. max. • Infrared reflow: 260°C, 30 Sec. max. • Hand solder: 350°C, 3 Sec. max. 0.63±0.25 (0.025) 0.8±0.05 (0.031) Recommended Pad Layout - mm (in) % of Amp Rating 100% 200% 300% 800% Electrical Characteristics Opening Time 4 Hours Minimum 1 Sec. Minimum, 120 Sec. Maximum 0.05 Sec. Minimum, 3 Sec. Maximum 0.002 Sec. Minimum, 0.05 Sec. Maximum Specifications Product Code 3216TD500-R 3216TD750-R 3216TD800-R 3216TD1-R 3216TD1.5-R 3216TD2-R 3216TD2.5-R 3216TD3-R 3216TD4-R 3216TD5-R 3216TD6.3-R 3216TD7-R 3216TD8-R 3216TD10-R 3216TD12-R Current Rating Amps 0.5 0.75 0.8 1 1.5 2 2.5 3 4 5 6.3 7 8 10 12 Voltage Rating Vac Vdc 63 32 63 32 63 32 63 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 Interrupting Rating (Amps)* AC DC 50 35 50 35 50 35 50 35 35 35 35 35 35 35 35 35 35 35 35 35 35 35 35 35 35 35 35 35 35 35 Resistance (Ω)** Typ. 0.150 0.100 0.087 0.075 0.050 0.030 0.022 0.018 0.0165 0.015 0.0120 0.0095 0.0083 0.006 0.005 Typical Melt I2t† DC 0.064 0.12 0.16 0.32 0.62 1.30 2.25 3.30 5.20 8.40 13.8 18.0 38.0 54.4 64.0 Typical Voltage Drop (V)‡ 75 75 75 75 75 60 55 55 56 66 75 67 65 65 65 * AC Interrupting Rating (Measured at rated voltage with a unity power factor); DC Interrupting Rating (Measured at rated voltage, time constant of less than 50 microseconds, battery source) ** DC Cold Resistance (Measured at 10% of rated current) † Typical Melting I2t (Measured with a battery bank at rated DC voltage, 10x-rated current at 1 microsecond, not to exceed IR. Above 7A uses 70 micron thickness copper layer test board of IEC 60127-3. Others uses 35 micron thickness copper layer. ‡ Typical Voltage Drop (Measured at rated current after temperature stabilizes) Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended, with further derating required at elevated ambient temperatures. 0209 BU-SB08563 Page 1 of 2 Data Sheet 4321 Time In Seconds Time-Current Curves Current In Amps Packaging Packaging Code Prefix TR Description 2,500 fuses on 12mm tape-and-reel on a 180mm reel per EIA-481-A & IEC286-3 This bulletin is intended to present product design solutions and technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. © 2009 Cooper Bussmann St. Louis, MO 63178 w w w. c o o p e r b u s s m a n n . c o m 0209 BU-SB08563 Page 2 of 2 Data Sheet 4321