A15641-15

TflexTM 200T V0 Series Thermal Gap Filler Innovative Technology for a Connected World THIN THERMALLY CONDUCTIVITY ELASTOMERIC INTERFACE MATERIAL Tflex™ 200T V0 is a specially formulated thin gap filler thermal interface material designed for thin interfaces that require a combination good thermal performance with great reliability. The elastomeric property of Tflex™ 200T V0 provides good thermal performance in a thin interface where reliability, shock and vibration considerations, are critical performance considerations in addition to low thermal resistance. Tflex™ 200T V0’s unique silicone and ceramic filler technology allows a combination of great reliability, good thermal performance, and easy handling. Tflex™ 200T V0 is slightly tacky, and requires no additional adhesive coating that inhibits thermal performance. Tflex™ 200T V0 is electrically insulating, stable from -40ºC thru 200ºC and meets UL 94V0 flame rating. FEATURES AND BENEFITS • Thermal Conductivity 1.5 W/mK • Compliant Elastomeric based thin interface material • Available in 0.008-inch (0.2mm), 0.010-inch (0.25mm), 0.012-inch (0.30mm), 0.015-inch (0.38mm) , and 0.020-inch (0.51mm) thicknesses • Slightly tacky for adhesion during assembly and transport • Competitive price for high volume applications • Available as individual custom parts, sheets, or custom parts converted on a roll APPLICATIONS • Memory Modules: DDR2, DDR3, SDRAM, SRAM, RAM, NVRAM • LED solid state lighting • Power electronics global solutions: local support Americas: +1.800.843.4556 Europe: +49.8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice@lairdtech.com www.lairdtech.com/thermal TM TflexTM 200T V0 Series Thermal Gap Filler Innovative Technology for a Connected World 8 MIL 10 MIL 15 MIL Ceramic filled silicone elastomer Ceramic filled silicone elastomer Ceramic filled silicone elastomer, reinforced Color Light Grey Light Grey Light Grey Thickness 0.008” (0.203mm) 0.010” (0.254mm) 0.015” (0.381mm) Thickness tolerance ±0.0015” (±0.038mm) ±0.0015” (±0.038mm) ±0.00225” (±0.057mm) 2.32 g/cc 2.32 g/cc 2.32 g/cc Helium Pycnometer 55 55 55 ASTM D2240 Outgassing TML (Post Cured) 0.38% 0.38% 0.38% ASTM E595 Outgassing CVCM (Post Cured ) 0.11% 0.11% 0.11% ASTM E595 UL Flammability Rating 94 V0 94 V0 94 V0 E180840 Temperature Range -45ºC to 200ºC -45ºC to 200ºC -45ºC to 200ºC Thermal Conductivity 1.5 W/mK 1.5 W/mK 1.5 W/mK Hot Disk Thermal Impedance @ 10 psi @ 69 KPa 0.384°C-in²/W 2.48°C-cm²/W 0.488°C-in²/W 3.14°C-cm²/W 0.714°C-in²/W 4.60°C-cm²/W ASTM D5470 (modified) Thermal Expansion (30-150°C) 231.19ppm/°C 231.19ppm/°C 231.19ppm/°C IPC-TM-650 2.4 2.4 Volume Resistivity 3.5x1010 ohm-cm 3.5x1010 ohm-cm 3.5x1010 ohm-cm ASTM D257 5.0 5.1 5.1 ASTM D150 Construction & Composition Specific Gravity (Density) Hardness (Shore 00) Dielectric Constant @ 1 MHz TEST METHOD Visual Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. THR-DS-Tflex-200T-V0 1209 Any information furnished by Laird Technologies and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with the end user since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability, or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request.damages of any kind. All Laird Technologies’ products are sold pursuant to the Laird Technologies’ terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request. A15922-00 Rev C., 12/2009. © 2009 All Rights Reserved. Laird Technologies is a registered trademark of Laird Technologies, Inc.