XD293-16

XD293-16 DIP16 XL293-20 SOP20 The XD293-16 is assembled in a 16 lead plastic packaage which has 4 center pins connected together and used for heatsinking The XL293-20 is assembled in a 20 lead surface mount which has 8 center pins connected together and used for heatsinking. 600mA OUTPUT CURRENT CAPABILITY PER CHANNEL 1.2A PEAK OUTPUT CURRENT (non repetitive) PER CHANNEL ENABLE FACILITY OVERTEMPERATURE PROTECTION LOGICAL "0" INPUT VOLTAGE UP TO 1.5 V (HIGH NOISE IMMUNITY) INTERNAL CLAMP DIODES DESCRIPTION The Device is a monolithic integrated high voltage, high current four channel driver designed to accept standard DTL or TTL logic levels and drive inductive loads (such as relays solenoides, DC and stepping motors) and switching power transistors. To simplify use as two bridges each pair of channels is equipped with an enable input. A separate supply input is provided for the logic, allowing operation at a lower voltage and internal clamp diodes are included. This device is suitable for use in switching applications at frequencies up to 5 kHz. BLOCK DIAGRAM 1 XD293-16 DIP16 / XL293-20 SOP20 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit VS Supply Voltage 36 V VSS Vi Logic Supply Voltage 36 V Ven Io Enable Voltage Peak Output Current (100 µs non repetitive) Ptot Total Power Dissipation at Tpins = 90 °C Tstg, Tj Input Voltage Storage and Junction Temperature 7 V 7 1.2 V A 4 W – 40 to 150 °C PIN CONNECTIONS (Top view) THERMAL DATA Symbol Decription DIP SO Unit Rth j-pins Rth j-amb Thermal Resistance Junction-pins Thermal Resistance junction-ambient max. max. – 80 14 50 (*) °C/W °C/W Rth j-case Thermal Resistance Junction-case max. 14 – (*) With 6sq. cm on board heatsink. 2 XD293-16 DIP16 / XL293-20 SOP20 ELECTRICAL CHARACTERISTICS (for each channel, VS = 24 V, VSS = 5 V, Tamb = 25 °C, unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Unit VS Supply Voltage (pin 10) VSS 36 V VSS Logic Supply Voltage (pin 20) 4.5 36 V IS Total Quiescent Supply Current (pin 10) ISS Total Quiescent Logic Supply Current (pin 20) Vi = L ; IO = 0 ; Ven = H Vi = H ; IO = 0 ; Ven = H 2 16 6 24 mA mA Ven = L Vi = L ; IO = 0 ; Ven = H 44 4 60 mA mA Vi = H ; IO = 0 ; Ven = H 16 22 mA Ven = L 16 – 0.3 24 1.5 mA V 2.3 2.3 VSS 7 V V – 10 µA 100 µA – 0.3 1.5 V 2.3 2.3 VSS 7 V V – 100 µA ± 10 µA VIL Input Low Voltage (pin 2, 9, 12, 19) VIH Input High Voltage (pin 2, 9, 12, 19) VSS ≤ 7 V VSS > 7 V IIL Low Voltage Input Current (pin 2, 9, 12, 19) VIL = 1.5 V IIH High Voltage Input Current (pin 2, 9, 12, 19) 2.3 V ≤ VIH ≤ VSS – 0.6 V Ven L Enable Low Voltage (pin 1, 11) Ven H Enable High Voltage (pin 1, 11) VSS ≤ 7 V VSS > 7 V Ien L Low Voltage Enable Current (pin 1, 11) Ven L = 1.5 V Ien H High Voltage Enable Current (pin 1, 11) Source Output Saturation Voltage (pins 3, 8, 13, 18) Sink Output Saturation Voltage (pins 3, 8, 13, 18) Clamp Diode Forward Voltage 2.3 V ≤ Ven H ≤ VSS – 0.6 V tr tf ton toff VCE(sat)H VCE(sat)L VF 30 – 30 IO = – 0.6 A 1.4 1.8 V IO = + 0.6 A 1.2 1.8 V IO = 600nA 1.3 V Rise Time (*) 0.1 to 0.9 VO 250 ns Fall Time (*) Turn-on Delay (*) Turn-off Delay (*) 0.9 to 0.1 VO 0.5 Vi to 0.5 VO 0.5 Vi to 0.5 VO 250 750 200 ns ns ns (*) See fig. 1. 3 XD293-16 DIP16 / XL293-20 SOP20 Figure 1: Switching Times TRUTH TABLE (one channel) Input Enable (*) Output H L H L H H L L H L Z Z Z = High output impedance (*) Relative to the considered channel Figure 2: Junction to ambient thermal resistance vs. area on board heatsink 4 XD293-16 DIP16 / XL293-20 SOP20 SOP 54 XD293-16 DIP16 / XL293-20 SOP20 DIP 46