RGBW pin aligned LED Emitter
LZ4-00MD09
Key Features
High Luminous Efficacy 4-die RGBW LED
Individually addressable Red, Green, Blue and Daylight White die
Anodes and Cathodes are aligned for easy connection of multiple emitters
Electrically neutral thermal path
Ultra-small foot print – 7.0mm x 7.0mm
Surface mount ceramic package with integrated glass lens
Low Thermal Resistance (2.8°C/W)
Very high Luminous Flux density
JEDEC Level 1 for Moisture Sensitivity Level
Autoclave compliant (JEDEC JESD22-A102-C)
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Typical Applications
Architectural Lighting
Retail Spot and Display Lighting
Stage and Studio Lighting
Hospitality Lighting
Museum Lighting
Video Walls and Full Color Displays
Description
The LZ4-00MD09 RGBW LED emitter contains one red, green, blue and daylight white LED die which provides 10W
power in an extremely small package. With a 7.0mm x 7.0mm ultra-small footprint, this package allows close
proximity to the LED die for optical systems designs that require imaging optics. LED Engin’s RGBW LED offers
ultimate design flexibility with individually addressable die. The LZ4-00MD09 is capable of producing a continuous
spectrum of white light plus millions of colors. The patented design has unparalleled thermal and optical
performance. The high quality materials used in the package are chosen to optimize light output and minimize
stresses which results in monumental reliability and lumen maintenance. The robust product design thrives in
outdoor applications with high ambient temperatures and high humidity.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Part number options
Base part number
Part number
Description
LZ4-00MD09-xxxx
LZ4 RGBW emitter pin aligned
LZ4-60MD09-xxxx
LZ4 RGBW emitter pin aligned on 4 channel Star MCPCB
Bin kit option codes
CW, Cool White (5500K – 6500K)
Kit number
suffix
Min
flux
Bin
Color Bin Ranges
0000
17R
R2 – R2
12G
G2 – G3
17B
B01 – B02
PQ
1BD, 2BD
Description
Red, full distribution flux; full distribution
wavelength
Green, full distribution flux; full
distribution wavelength
Blue, full distribution flux; full
distribution wavelength
White full distribution flux and CCT
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Daylight White Chromaticity Groups
0.38
CIEy
0.36
2BD
0.34
Planckian Locus
1BD
0.32
0.30
0.28
0.28
0.30
0.32
0.34
CIEx
Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below in Table 5.
Cool White Bin Coordinates
Bin Code
1BD
CIEx
CIEy
0.3068
0.3113
0.3028
0.3304
0.3205
0.3481
0.3221
0.3068
Bin Code
CIEx
CIEy
0.3222
0.3243
0.3207
0.3462
0.3376
0.3616
0.3261
0.3366
0.3369
0.3113
0.3222
0.3243
2BD
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Luminous Flux Bins
Table 1:
Bin Code
1 Red
17R
Minimum
Maximum
Luminous Flux (ΦV)
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
@ IF = 700mA [1,2]
(lm)
(lm)
1 Green
1 Blue
1 White
105
1 Red
1 Green
1 Blue
1 White
160
12G
125
195
17B
19
30
18B
30
47
PQ
182
285
Notes for Table 1:
1.
Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ±10% on flux measurements.
2.
Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information.
Dominant Wavelength Bins
Table 2:
Bin Code
R2
G2
G3
B01
B02
Minimum
Dominant Wavelength (λD)
@ IF = 700mA [1]
(nm)
1 Red
1 Green
1 Blue
618
520
525
452
457
Maximum
Dominant Wavelength (λD)
@ IF = 700mA [1]
(nm)
1 Red
1 Green
1 Blue
630
525
530
457
462
Notes for Table 2:
1.
LED Engin maintains a tolerance of ± 1.0nm on dominant wavelength measurements.
Forward Voltage Bin
Table 3:
Bin Code
0
1 Red
2.10
Minimum
Forward Voltage (VF)
@ IF = 700mA [1]
(V)
1 Green 1 Blue 1 White
3.20
2.80
2.80
1 Red
2.90
Maximum
Forward Voltage (VF)
@ IF = 700mA [1]
(V)
1 Green 1 Blue 1 White
4.20
3.80
3.80
Notes for Table 3:
1.
LED Engin maintains a tolerance of ± 0.04V on forward voltage measurements.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Absolute Maximum Ratings
Table 4:
Parameter
Symbol
Value
Unit
DC Forward Current
Peak Pulsed Forward Current [2]
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature [4]
Allowable Reflow Cycles
IF
IFP
VR
Tstd
TJ
Tsol
1000
1500
See Note 3
-40 ~ +150
125
260
6
121°C at 2 ATM,
100% RH for 168 hours
> 8,000 V HBM
Class 3B JESD22-A114-D
mA
mA
V
°C
°C
°C
Autoclave Conditions [5]
ESD Sensitivity [6]
Notes for Table 4:
1.
Maximum DC forward current is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 12 for current derating. Max current for continues operation is 1.0A
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3.
LEDs are not designed to be reversing biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 4.
5.
Autoclave Conditions per JEDEC JESD22-A102-C.
6.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the emitter in an electrostatic protected area (EPA). An
EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @TC = 25°C
Table 5:
Parameter
Symbol
Luminous Flux (@ IF = 700mA)
Luminous Flux (@ IF = 1000mA)
Dominant Wavelength
Correlated Color Temperature
Color Rendering Index (CRI)
Viewing Angle [2]
Total Included Angle [3]
ΦV
ΦV
Typical
Unit
Red
Green
Blue [1]
White
130
180
623
165
215
523
39
50
457
240
315
lm
lm
6500
75
K
CCT
Ra
2Θ½
Θ0.9
95
115
Degrees
Notes for Table 5:
1.
When operating the Blue LED, observe IEC 60825-1 class 2 rating. Do not stare into the beam.
2.
Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
3.
Total Included Angle is the total angle that includes 90% of the total luminous flux.
Electrical Characteristics @TC = 25°C
Table 6:
Parameter
Symbol
Forward Voltage (@ IF = 700mA)
Temperature Coefficient
of Forward Voltage
Thermal Resistance
(Junction to Case)
RΘJ-C
Typical
Unit
Red
Green
Blue
White
VF
2.5
3.6
3.2
3.2
V
ΔVF/ΔTJ
-1.9
-2.9
-2.0
-2.0
mV/°C
2.8
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°C/W
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
Unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 7:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and
includes the maximum time allowed out of the bag at the distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period.
Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen
Maintenance at 65,000 hours of operation at a forward current of 700mA. This projection is based on constant
current operation with junction temperature maintained at or below 125°C for LZ4 product.
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Mechanical Dimensions (mm)
Pin Out
Pad
Die
Color
Function
1
A
Green
Anode
2
D
Blue
Anode
3
B
Red
Anode
4
C
White
Anode
5
C
White
Cathode
6
B
Red
Cathode
7
D
Blue
Cathode
8
A
Green
Cathode
9 [2]
n/a
n/a
Thermal
Figure 1: Package Outline Drawing.
Notes for Figure 1:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Thermal contact, Pad 9, is electrically neutral.
Recommended Solder Pad Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
1
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2a:
1. Unless otherwise noted, the tolerance = ± 0.20 mm.
2. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate t he high thermal resistance
dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system
thermal resistance.
3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less
than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure
rates due to thermal over stress.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Recommended Solder Mask Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8 mil Stencil Apertures Layout (mm)
Non-pedestal MCPCB Design
Pedestal MCPCB Design
Figure 2c: Recommended 8mil stencil apertures for anode, cathode, and thermal pad for non-pedestal and pedestal design
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
Typical Radiation Pattern
100
90
Relative Intensity (%)
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern.
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Typical Relative Spectral Power Distribution
1.00
0.90
0.80
Relative Spectral Power
0.70
0.60
Red
0.50
Green
Blue
0.40
White
0.30
0.20
0.10
0.00
400
450
500
550
600
650
Wavelength (nm)
700
750
800
Figure 5: Typical relative spectral power vs. wavelength @ T C = 25°C.
Typical Forward Current Characteristics
1600
1400
IF - Forward Current (mA)
1200
1000
800
Red
Green
600
Blue/White
400
200
0
1.80
2.00
2.20
2.40
2.60
2.80
3.00
Vf (V)
3.20
3.40
3.60
3.80
4.00
4.20
Figure 6: Typical forward current vs. forward voltage @ T C = 25°C
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Typical Relative Light Output over Current
160%
140%
Relative Light Output
120%
100%
80%
60%
Red
Green
40%
Blue
20%
White
0%
0
200
400
600
800
IF - Forward Current (mA)
1000
1200
Figure 7: Typical relative light output vs. forward current @ TC = 25°C
Typical Relative Light Output over Temperature
140%
120%
Relative Light Output
100%
80%
60%
40%
Red
Green
20%
Blue
White
0%
0
20
40
60
Case Temperature (oC)
80
100
120
Figure 8: Typical relative light output vs. case temperature.
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Typical Dominant Wavelength/Chromaticity Coordinate Shift over Current
8.00
Dominant Wavelength Shift (nm)
6.00
Red
Green
4.00
Blue
2.00
0.00
-2.00
-4.00
0
200
400
600
800
IF - Forward Current (mA)
1000
1200
Figure 9a: Typical dominant wavelength shift vs. forward current @ T C = 25°C.
0.0100
0.0080
0.0060
Delta_Cx, Delta_Cy
0.0040
White - Delta_Cx
White - Delta_Cy
0.0020
0.0000
-0.0020
-0.0040
-0.0060
-0.0080
-0.0100
0
200
400
600
800
IF - Forward Current (mA)
1000
1200
Figure 9b: Typical chromaticity coordinate shift vs. forward current @ TC = 25°C.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Typical Dominant Wavelength/Chromaticity Coordinate Shift over Temperature
6.00
Dominant Wavelength Shift (nm)
5.00
4.00
3.00
2.00
1.00
Red
0.00
Green
Blue
-1.00
-2.00
-3.00
0
20
40
60
Case
80
100
120
Temperature (oC)
Figure 10a: Typical dominant wavelength shift vs. case temperature
0.0020
0.0000
White - Delta_Cx
Delta_Cx, Delta_Cy
-0.0020
White - Delta_Cy
-0.0040
-0.0060
-0.0080
-0.0100
-0.0120
0
20
40
60
Case Temperature (oC)
80
100
120
Figure 10b: Typical chromaticity coordinate shift vs. case temperature
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Current De-rating
IF - Maximum Forward Current (mA)
1200
RΘ_J-A 5.0 °C/W
1000
RΘ_J-A 5.5 °C/W
RΘ_J-A 6.0 °C/W
800
700
(Rated)
600
400
200
0
0
25
50
75
Maximum Ambient Temperature (oC)
100
125
Figure 11: Maximum forward current vs. ambient temperature based on T J(MAX) = 125°C
Notes for Figure 11:
1.
Maximum current assumes that all four LED dice are operating concurrently at the same current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for LZ4-04MDC9 is typically 2.8°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
Emitter Tape and Reel Specifications (mm)
Figure 12: Emitter carrier tape specifications (mm).
Figure 13: Emitter Reel specifications (mm).
Notes for Figure 13:
1.
Small reel quantity: up to 250 emitters
2.
Large reel quantity: 250-1200 emitters
3.
Single flux bin and single wavelength per reel.
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LZ4 MCPCB Family
Part number
Type of MCPCB
Diameter
(mm)
LZ4-6xxxxx
4-channel
19.9
Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
2.8 + 0.2 = 3.0
2.5 – 3.6
700
Mechanical Mounting of MCPCB
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
To avoid MCPCB bending:
o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o It is recommended to always use plastics washers in combinations with the three screws.
o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
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LZ4-6xxxxx
4 channel, Standard Star MCPCB (4x1) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.
The thermal resistance of the MCPCB is: RΘC-B 0.2°C/W
Components used
MCPCB:
ESD chips:
MHE-301 copper
BZT52C5-C10
(Rayben)
(NXP, for 1 LED die)
Pad layout
Ch.
1
2
3
4
MCPCB
Pad
8
1
6
3
5
4
7
2
String/die
1/A
2/B
3/C
4/D
Function
Anode +
Cathode Anode +
Cathode Anode +
Cathode Anode +
Cathode -
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About LED Engin
LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED
emitters, optics and light engines to create uncompromised lighting experiences for a wide range of
TM
entertainment, architectural, general lighting and specialty applications. LuxiGen multi-die emitter and
secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a
target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented
TM
compact ceramic package. Our LuxiTune series of tunable white lighting modules leverage our LuxiGen emitters
and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of
new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior insource color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional
light is required. LED Engin is committed to providing products that conserve natural resources and reduce
greenhouse emissions; and reserves the right to make changes to improve performance without notice.
For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200.
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