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AM2358NE

AM2358NE

  • 厂商:

    VBSEMI(微碧)

  • 封装:

    SOT-23

  • 描述:

    Vds=60V Id=4A SOT-23-3

  • 数据手册
  • 价格&库存
AM2358NE 数据手册
AM2358NE www.VBsemi.tw N-Channel 60-V (D-S) MOSFET FEATURES PRODUCT SUMMARY RDS(on) (Ω) ID (A)a 0.085 at VGS = 10 V 4.0 0.096 at VGS = 4.5 V 3.8 VDS (V) 60 Qg (Typ.) 2.1 nC • Halogen-free According to IEC 61249-2-21 Available • TrenchFET® Power MOSFET • 100 % Rg Tested • 100 % UIS Tested APPLICATIONS • Battery Switch • DC/DC Converter D TO-236 (SOT23) G 1 3 S G D 2 S Top View N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 °C) Symbol VDS VGS TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C Pulsed Drain Current Limit 60 ± 20 4.0 3.4 ID 3.1b, c 2.5b, c 12 1.39 0.91b, c 6 1.8 1.66 1.06 1.09b, c 0.7b, c - 55 to 150 IDM Continuous Source-Drain Diode Current TC = 25 °C TA = 25 °C IS Avalanche Current Single-Pulse Avalanche Energy L = 0.1 mH IAS EAS Maximum Power Dissipation TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C PD TJ, Tstg Operating Junction and Storage Temperature Range Unit V A mJ W °C THERMAL RESISTANCE RATINGS Parameter ≤5s Maximum Junction-to-Ambientb, d Steady State Maximum Junction-to-Foot (Drain) Notes: a. Based on TC = 25 °C. b. Surface Mounted on 1" x 1" FR4 board. c. t = 5 s. d. Maximum under Steady State conditions is 120 °C/W. E-mail:China@VBsemi TEL:86-755-83251052 Symbol RthJA RthJF Typical 90 60 Maximum 115 75 Unit °C/W AM2358NE www.VBsemi.tw MOSFET SPECIFICATIONS TJ = 25 °C, unless otherwise noted Parameter Symbol Test Conditions Min. VDS VDS = 0 V, ID = 250 µA 60 Typ. Max. Unit Static Drain-Source Breakdown Voltage VDS Temperature Coefficient ΔVDS/TJ V 55 mV/°C VGS(th) Temperature Coefficient ΔVGS(th)/TJ ID = 250 µA Gate-Source Threshold Voltage VGS(th) VDS = VGS, ID = 250 µA 3 V Gate-Source Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA Zero Gate Voltage Drain Current IDSS VDS = 60 V, VGS = 0 V 1 VDS = 60 V, VGS = 0 V, TJ = 55 °C 10 On-State Drain Currenta ID(on) Drain-Source On-State Resistancea Forward Transconductancea RDS(on) gfs VDS ≥ 5 V, VGS = 10 V -5 1 8 µA A VGS = 10 V, ID = 1.9 A 0.075 0.085 VGS = 4.5 V, ID = 1.7 A 0.086 0.096 VDS = 15V, ID = 1.9 A 5 Ω S Dynamicb Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss Total Gate Charge Qg Gate-Source Charge Qgs Gate-Drain Charge Qgd Gate Resistance Rg 180 tr Rise Time td(off) Turn-Off Delay Time VDS = 30 V, VGS = 4.5 V, ID = 1.9 A f = 1 MHz VDD = 30 V, RL = 20 Ω ID ≅ 1.5 A, VGEN = 10 V, RG = 1 Ω td(on) Turn-On Delay Time tr Rise Time td(off) Turn-Off Delay Time VDD = 30 V, RL = 20 Ω ID = 1.5 A, VGEN = 4.5 V, RG = 1 Ω tf Fall Time 4.2 6.1 2.1 3.2 0.7 nC 1 tf Fall Time pF 13 VDS = 30 V, VGS = 10 V, ID = 1.9 A td(on) Turn-On Delay Time 22 VDS = 30 V, VGS = 0 V, f = 1 MHz 0.6 2.2 5.1 4 6 10 15 10 15 7 10.5 15 23 16 24 11 17 11 17 Ω ns ns Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current Pulse Diode Forward Currenta Body Diode Voltage IS TC = 25 °C 2.19 7 ISM VSD Body Diode Reverse Recovery Time trr Body Diode Reverse Recovery Charge Qrr Reverse Recovery Fall Time ta Reverse Recovery Rise Time tb IS = 1.5 A IF = 1.5 A, dI/dt = 100 A/µs, TJ = 25 °C A 0.8 1.2 V 15 23 ns 10 15 nC 12 3 ns Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. E-mail:China@VBsemi TEL:86-755-83251052 AM2358NE www.VBsemi.tw TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 6 4 VGS = 10 thru 5 V VGS = 4 V I D - Drain Current (A) I D - Drain Current (A) 4 2 1 3 TC = - 55 °C 2 TC = 125 °C 1 VGS = 3 V TC = 25 °C VGS = 2 V 0 0 1 2 3 4 0 0.0 5 0.7 2.1 2.8 3.5 VGS - Gate-to-Source Voltage (V) VDS - Drain-to-Source Voltage (V) Output Characteristics Transfer Characteristics 0.20 300 240 0.16 VGS = 4.5 V 0.12 Ciss C - Capacitance (pF) R DS(on) - On-Resistance (Ω) 1.4 VGS = 10 V 180 120 0.08 60 Coss 0.04 Crss 0 0 2 4 6 8 10 0 10 20 30 40 50 ID - Drain Current (A) VDS - Drain-to-Source Voltage (V) On-Resistance vs. Drain Current and Gate Voltage Capacitance 10 60 2.0 8 VGS = 1 0 V, I D = 2 . 5 A 6 VDS = 48 V 4 2 (Normalized) 1.7 VDS = 30 V R DS(on) - On-Resistance VGS - Gate-to-Source Voltage (V) ID = 2 . 5 A 1.4 VGS = 4.5 V, ID = 1.7 A 1.1 0.8 0 0 1 2 3 4 5 0.5 - 50 - 25 0 25 50 75 100 125 Qg - Total Gate Charge (nC) TJ - Junction Temperature (°C) Gate Charge On-Resistance vs. Junction Temperature E-mail:China@VBsemi TEL:86-755-83251052 150 AM2358NE www.VBsemi.tw TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 0.35 10 TJ = 150 °C R DS(on) - On-Resistance (Ω) I S - Source Current (A) ID = 2 . 5 A TJ = 25 °C 1 0.1 0.0 0.2 0.4 0.6 0.8 1.0 0.25 TJ = 125 °C 0.20 0.15 TJ = 25 °C 0.10 3 1.2 4 5 VSD - Source-to-Drain Voltage (V) 6 7 8 9 10 VGS - Gate-to-Source Voltage (V) On-Resistance vs. Gate-to-Source Voltage Source-Drain Diode Forward Voltage 2.4 10 8 2.1 Power (W) VGS(th) (V) ID = 250 µA 1.8 TA = 25 °C Single Pulse 6 4 1.5 2 1.2 - 50 - 25 0 25 50 75 100 125 0 0.01 150 0.1 1 Threshold Voltage Single Pulse Power 5 Limited by R DS(on)* I D - Drain Current (A) 100 µs 1 1 ms 10 ms 0.1 100 ms TA = 25 °C Single Pulse 0.01 0.1 BVDSS Limited 1 1 s, 10 s DC 10 VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which R DS(on) is specified Safe Operating Area E-mail:China@VBsemi TEL:86-755-83251052 10 Time (s) TJ - Temperature (°C) 100 100 600 AM2358NE www.VBsemi.tw TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 5 I D - Drain Current (A) 4 30 2 1 0.0 25 0 50 75 125 100 150 TC - Case Temperature (°C) Current Derating* 2.0 1.2 1.6 Power (W) Power (W) 0.9 1.2 0.8 0.6 0.3 0.4 0.0 0.0 0 25 50 75 100 125 TC - Case Temperature (°C) Power Derating, Junction-to-Case 150 0 25 50 75 100 125 150 TA - Ambient Temperature (°C) Power Derating, Junction-to-Ambient * The power dissipation PD is based on TJ(max.) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. E-mail:China@VBsemi TEL:86-755-83251052 AM2358NE www.VBsemi.tw THERMAL RATINGS (TA = 25 °C, unless otherwise noted) 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 Notes: 0.1 PDM 0.05 t1 0.02 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 130 °C/W 3. TJM - TA = PDMZthJA(t) Single Pulse 4. Surface Mounted 0.01 10-4 10-3 10-2 10-1 1 Square Wave Pulse Duration (s) 10 100 600 Normalized Thermal Transient Impedance, Junction-to-Ambient 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10-4 10-3 10-2 10-1 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Foot E-mail:China@VBsemi TEL:86-755-83251052 1 10 AM2358NE www.VBsemi.tw SOT-23 (TO-236): 3-LEAD b 3 E1 1 E 2 e S e1 D 0.10 mm C 0.004" A2 A C q Gauge Plane Seating Plane Seating Plane C A1 Dim 0.25 mm L L1 MILLIMETERS INCHES Min Max Min Max A 0.89 1.12 0.035 0.044 A1 0.01 0.10 0.0004 0.004 A2 0.88 1.02 0.0346 0.040 b 0.35 0.50 0.014 0.020 c 0.085 0.18 0.003 0.007 D 2.80 3.04 0.110 0.120 E 2.10 2.64 0.083 0.104 E1 1.20 1.40 0.047 e 0.95 BSC e1 L 1.90 BSC 0.40 L1 q ECN: S-03946-Rev. K, 09-Jul-01 DWG: 5479 E-mail:China@VBsemi TEL:86-755-83251052 0.0748 Ref 0.60 0.016 0.64 Ref S 0.024 0.025 Ref 0.50 Ref 3° 0.055 0.0374 Ref 0.020 Ref 8° 3° 8° AM2358NE www.VBsemi.tw 0.053 (1.341) 0.097 (2.459) Recommended Minimum Pads Dimensions in Inches/(mm) E-mail:China@VBsemi TEL:86-755-83251052 0.049 (1.245) 0.029 0.022 (0.559) (0.724) 0.037 (0.950) (2.692) 0.106 RECOMMENDED MINIMUM PADS FOR SOT-23 AM2358NE www.VBsemi.tw Disclaimer All products due to improve reliability, function or design or for other reasons, product specifications and data are subject to change without notice. Taiwan VBsemi Electronics Co., Ltd., branches, agents, employees, and all persons acting on its or their representatives ( collectively, the "Taiwan VBsemi"), assumes no responsibility for any errors, inaccuracies or incomplete data contained in the table or any other any disclosure of any information related to the product.(www.VBsemi.tw) Taiwan VBsemi makes no guarantee, representation or warranty on the product for any particular purpose of any goods or continuous production. To the maximum extent permitted by applicable law on Taiwan VBsemi relinquished: ( 1) any application and all liability arising out of or use of any products; ( 2) any and all liability, including but not limited to special, consequential damages or incidental ; ( 3) any and all implied warranties, including a particular purpose, non-infringement and merchantability guarantee. Statement on certain types of applications are based on knowledge of the product is often used in a typical application of the general product VBsemi Taiwan demand that the Taiwan VBsemi of. Statement on whether the product is suitable for a particular application is non-binding. It is the customer's responsibility to verify specific product features in the products described in the specification is appropriate for use in a particular application. Parameter data sheets and technical specifications can be provided may vary depending on the application and performance over time. All operating parameters, including typical parameters must be made by customer's technical experts validated for each customer application. Product specifications do not expand or modify Taiwan VBsemi purchasing terms and conditions, including but not limited to warranty herein. Unless expressly stated in writing, Taiwan VBsemi products are not intended for use in medical, life saving, or life sustaining applications or any other application. Wherein VBsemi product failure could lead to personal injury or death, use or sale of products used in Taiwan VBsemi such applications using client did not express their own risk. Contact your authorized Taiwan VBsemi people who are related to product design applications and other terms and conditions in writing. The information provided in this document and the company's products without a license, express or implied, by estoppel or otherwise, to any intellectual property rights granted to the VBsemi act or document. Product names and trademarks referred to herein are trademarks of their respective representatives will be all. Material Category Policy Taiwan VBsemi Electronics Co., Ltd., hereby certify that all of the products are determined to be R oHS compliant and meets the definition of restrictions under Directive of the European Parliament 2011/65 / EU, 2011 Nian. 6. 8 R i Yue restrict the use of certain hazardous substances in electrical and electronic equipment (EEE) - modification, unless otherwise specified as inconsistent.(www.VBsemi.tw) Please note that some documents may still refer to Taiwan VBsemi RoHS Directive 2002/95 / EC. We confirm that all products identified as consistent with the Directive 2002/95 / EC European Directive 2011/65 /. Taiwan VBsemi Electronics Co., Ltd. hereby certify that all of its products comply identified as halogen-free halogen-free standards required by the JEDEC JS709A. Please note that some Taiwanese VBsemi documents still refer to the definition of IEC 61249-2-21, and we are sure that all products conform to confirm compliance with IEC 61249-2-21 standard level JS709A. E-mail:China@VBsemi TEL:86-755-83251052
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