CLP-105-02-S-D-BE-A-TR

CLP-105-02-S-D-BE-A-TR

  • 厂商:

    SAMTEC(申泰)

  • 封装:

    SMD,P=1.27mm

  • 描述:

    排母 间距:1.27mm 2x5P SMT

  • 详情介绍
  • 数据手册
  • 价格&库存
CLP-105-02-S-D-BE-A-TR 数据手册
REVISION DE DO NOT SCALE FROM THIS PRINT CLP-1XX-XX-XXX-D-XX 1. C REPRESENTS A CRITICAL DIMENSION. 2. MINIMUM PUSHOUT FORCE: .5LB (8 OZ). 3. ONE POSITON WILL BE LOST FOR EVERY CUT MADE ON A No OF POSITIONS PER ROW OPTION SOCKET STRIP. -02 THRU -50 -P: PICK & PLACE PAD (USE LMP-01) 4. TUBE PACKAGE POSITIONS 5-50 ONLY. POSITIONS 2-4 ARE (AVAILABLE ON POSITON -05 THRU -50 ONLY) TO BE PLACED IN ANTISTATIC BUBBLE BAGS P/N ASBBLT4X5.5. (NOT AVAILABLE WITH -PA OR -K OPTIONS) 5. SHEAR TAILS TO DIMENSIONS SHOWN. (SEE FIG 3, SHT 2) LEAD STYLE SPEC 6. NOTE DELETED. -A: ALIGNMENT PIN (USE CLP-XX-D-XX) -02: SURFACE MOUNT 7. TAIL SIDE ENDWALL AFTER CUTTING: .0160[0.406]±.0025[0.064]. (NOT AVAILABLE WITH -PA OPTION) (USE C-106-X2-XXX OR 8. VOID CORES MAY NOT BE PRESENT. (SEE FIG 2, SHT 2) SUB-C-106-X2-XXX) 9. HAND FILL USE C-106-01-XX. -TR: TAPE AND REEL (SEE NOTE 14) (SEE NOTE 9) -BE: BOTTOM ENTRY ONLY (USE CLP-XX-DBE-XX) CAN'T HAND FILL -STL & -LTL-PLATING. -PA: PICK & PLACE PAD WITH ALIGNMENT PINS AUTOMATION USE C-106-22-XX. C-106-02-XX CAN BE (NOT AVAILABLE WITH -P, -A, OR -K OPTIONS) SUBBED FOR C-106-22-XX. (SEE SHT 2, TABLE 3)(SEE NOTE 12) .0100 0.254 FOR -LTL AND -STL PLATING USE SUB-C-106-X2-XTL PINS -K: POLYIMIDE FILM PAD (AVAILABLE ON -03 THRU -50 C 10. MAX CUT FLASH: .010[0.25] X .020[0.51] (HEIGHT X WIDTH) WITH NO .005 0.12 C POSITIONS. USE K-DOT-.157-.250-.005) (AVAILABLE FLASH ALLOWED IN HOLES OR EXTENDING BELOW LEADS. (SEE NOTE 13) ON -02 POSITIONS. USE K-DOT-.118-.219-.005) C 11. MAX BURR: .005[.13]. (SEE FIG 5, SHT 2)(NOT AVAILABLE WITH -P OR -PA C 12. ALL -PA OPTION PARTS SHIP IN EIA-960 TRAYS. OPTIONS) 13. DOES NOT APPLY TO -BE END OPTION. -FR: FULL REEL QTY. TAPE & REEL (SEE NOTE 15) 14. -TR OPTION ORDERS INVOLVING PARTIAL REEL QUANTITIES MAY BE PACKAGED ACCORDING TO THE SAMTEC PACKAGING EFFICIENCY BODY SPEC STANDARDS (SPES) FOUND ON WWW.SAMTEC.COM. -D: DOUBLE ROW 15. -FR OPTIONS WILL BE SHIPPED AT THE MAX QUANTITY PER REEL, (USE CLP-XX-D) BASED ON OPTIONS SELECTED. PLATING SPEC DETAIL 'D' -F: 3µ" FLASH SELECTIVE GOLD IN CONTACT AREA MATTE TIN ON TAIL SCALE 16 : 1 -L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA No OF POS x .0500[1.270]) - .0500[1.270] MATTE TIN ON TAIL (TOLERANCE ACCUM ±.0020[0.051]) -S: 30µ" SELECTIVE GOLD IN CONTACT AREA MATTE TIN ON TAIL C -G: 10µ" GOLD IN CONTACT AREA (No OF POS X .0500[1.270]) + .017[0.43]±.008[0.20] .034 0.85 3µ ON TAIL (SEE NOTE 3 AND 7) REF -H: 30µ" HEAVY GOLD IN CONTACT AREA 3µ" ON TAIL -LM: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA 'D' 02 MATTE TIN ON TAIL -FM: 3µ" FLASH SELECTIVE GOLD IN CONTACT AREA MATTE TIN ON TAIL .120 3.05 -SM: 30µ" SELECTIVE GOLD IN CONTACT AREA REF MATTE TIN ON TAIL -LTL: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA 01 TIN/LEAD (90/10+/-5%) TAIL (SEE NOTE 9) -STL: 30µ" SELECTIVE GOLD IN CONTACT AREA -D -D-BE CLP-XX-DBE-XX CLP-XX-D-XX TIN/LEAD (90/10+/-5%) TAIL (SEE NOTE 9) .050 1.27 REF +.003 +0.08 .090 - .001 2.29 - 0.03 "A" "B" (MEASURE AT BEND) C 4° .084 2.12 REF "A" SEE NOTE 10 "B" -D CL CL -D-BE C-106-22-XXX OR SUB-C-106-22-XXX (SEE NOTE 9) C 88° REF 90° -D-BE -D IN-PROCESS SCALE 8:1 POS. 02-35 POS. 36-50 SECTION "B"-"B" (-D-BE BODY: CLP-XX-DBE-XX) (DIFFERENT AS SHOWN, OTHERWISE SAME AS -D BODY) SECTION "A"-"A" 2.5 MAX SWAY (TYP) .010 0.25 .012 0.30 3° .170±.010 4.31±0.25 .016 0.41 x .005[0.13] REF .004[0.10] .006[0.15] FIG 1 (-D BODY: CLP-XX-D-XX) UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. TOLERANCES ARE: DECIMALS ANGLES .XX: .01 [.3] 2 .XXX: .005 [.13] .XXXX: .0020 [.051] MATERIAL: * PROPRIETARY NOTE * THIS DOCUMENT CONTAINS CONFIDENTIAL AND PROPRIETARY INFORMATION AND ALL DESIGN, MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC, INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS WRITTEN CONSENT OF SAMTEC, INC. DO NOT SCALE DRAWING SHEET SCALE: 3:1 INSULATOR: LCP, UL 94 VO, COLOR: BLACK CONTACT: PHOS BRONZE F:\DWG\MISC\MKTG\CLP-1XX-XX-XXX-D-XX-MKT.SLDDRW 520 PARK EAST BLVD, NEW ALBANY, IN 47150 PHONE: 812-944-6733 FAX: 812-948-5047 e-Mail info@SAMTEC.com code 55322 DESCRIPTION: LOW PROFILE .050 x .050 DOUBLE ROW ASM DWG. NO. CLP-1XX-XX-XXX-D-XX BY: PURVIS 01/31/1994 SHEET 1 OF 3 AVAILABLE ON POSITIONS 05 THRU 50 ONLY NOTE: "N" = USED MEASURED DIMENSION (REF) "Q" = [("N" - .250[6.35])/2] ±.020[0.51] REVISION DE C "N" (SEE NOTE) C "Q" 3.45 (SEE NOTE) .100 2.54 .005 X 45° REF (TYP 4 SIDES) .019 0.47 (No OF POS x .0500[1.270]) - .100[2.54] 22.86 LMP-01 .0070 0.178 REF (TYP) .250 6.35 REF FIG 2 .0050 0.127 REF (TYP) FIG 3 -P: PICK AND PLACE PAD (AVAILABLE ON POSITION 05 THRU 50 ONLY) (NOT AVAILABLE WITH -PA OR -K OPTIONS) -A: ALIGNMENT PIN (3 POSITION MINIMUM) (NOT AVAILABLE WITH -PA OPTION) (DIFFERENT AS SHOWN, OTHERWISE SAME AS FIG 1) .025 0.64 REF (TYP) .0100 0.254 REF (TYP) C .121 3.07 "A" .051 1.30 C "R" (SEE NOTE) .019±.020 0.47±0.51 .035 0.89 REF .325 8.26 REF C "T"±.010 PPP-38-X-X-XX .275 6.99 .095 2.41 "S" (SEE NOTE) C "U"±.0050 FIG 5 FIG 4 -K: POLYIMIDE FILM PAD (AVAILABLE ON POSITION 05 THRU 50 ONLY) (NOT AVAILABLE WITH -P OR -PA OPTIONS) -PA: PICK & PLACE PAD WITH ALIGNMENT PINS (NOT AVAILABLE WITH -P, -A OR -K OPTIONS) NOTE: "R" = USED MEASURED DIMENSION (REF) "S" ON -03 THRU -50 POS = {("R" - .1575[4.000])/2} ±.020[0.51] "S" ON -02 POS = {("R" - .1180[2.997])/2} ±.020[0.51] "U" ON -03 THRU -50 POS = .1575 [4.000] "U" ON -02 POS = .118 [2.997] * PROPRIETARY NOTE * THIS DOCUMENT CONTAINS CONFIDENTIAL AND PROPRIETARY INFORMATION AND ALL DESIGN, MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC, INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS WRITTEN CONSENT OF SAMTEC, INC. DO NOT SCALE DRAWING SHEET SCALE: 4:1 F:\DWG\MISC\MKTG\CLP-1XX-XX-XXX-D-XX-MKT.SLDDRW 520 PARK EAST BLVD, NEW ALBANY, IN 47150 PHONE: 812-944-6733 FAX: 812-948-5047 e-Mail info@SAMTEC.com code 55322 DESCRIPTION: LOW PROFILE .050 x .050 DOUBLE ROW ASM DWG. NO. CLP-1XX-XX-XXX-D-XX BY: PURVIS 01/31/1994 SHEET 2 OF 3 REVISION DE PACKAGING (SEE NOTE 4, SHEET 1) PT-CLX-002-D PT-CLX-001-D * PROPRIETARY NOTE * THIS DOCUMENT CONTAINS CONFIDENTIAL AND PROPRIETARY INFORMATION AND ALL DESIGN, MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC, INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS WRITTEN CONSENT OF SAMTEC, INC. DO NOT SCALE DRAWING SHEET SCALE: 4:1 F:\DWG\MISC\MKTG\CLP-1XX-XX-XXX-D-XX-MKT.SLDDRW 520 PARK EAST BLVD, NEW ALBANY, IN 47150 PHONE: 812-944-6733 FAX: 812-948-5047 e-Mail info@SAMTEC.com code 55322 DESCRIPTION: LOW PROFILE .050 x .050 DOUBLE ROW ASM DWG. NO. CLP-1XX-XX-XXX-D-XX BY: PURVIS 01/31/1994 SHEET 3 OF 3
CLP-105-02-S-D-BE-A-TR
物料型号:CLP-1XX-XX-XXX-D-XX

器件简介:文档描述了一种低剖面、双排的ASM(自动表面贴装)连接器,具有特定的尺寸和引脚分配

引脚分配:文档中提到了不同位置的引脚分配,例如-02位置使用表面贴装(SMT)引脚,而其他位置可能有不同的引脚分配

参数特性:包括最小推力、剪切尾尺寸、手填要求、自动化使用、最大剪切闪光等。

功能详解:文档提供了详细的功能描述,包括不同选项的引脚分配和包装信息。

应用信息:文档中提到了不同选项的应用,例如-P选项用于Pick & Place Pad,-A选项用于对齐销,-TR选项用于胶带和卷轴包装。

封装信息:提供了封装的详细规格,包括绝缘材料、接触材料、引脚样式、镀层规格等。
CLP-105-02-S-D-BE-A-TR 价格&库存

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