DATA SHEET
SURFACE MOUNT MULTILAYER
CERAMIC CAPACITORS
General purpose class II
X6S
4 V TO 50 V
100 pF to 47µF
Product Specification – August 7, 2017 V.4
RoHS compliant & Halogen free
Product specification
Surface Mount Multilayer Ceramic Capacitors
General Purpose
X6S
4 V to 50 V
2
10
SCOPE
ORDERING INFORMATION - GLOBAL PART NUMBER,
This specification describes X6S
series chip capacitors with leadfree terminations.
All part numbers are identified by the series, size, tolerance, TC material,
packing style, voltage, process code, termination and capacitance value.
YAGEO BRAND ordering code
APPLICATIONS
PCs, Hard disk, Game PCs
Power supplies
DVD players
Mobile phones
Data processing
GLOBAL PART NUMBER (PREFERRED )
CC
XXXX X X
(1)
X6S
(2) (3)
X
BB
XXX
(4)
(5)
(1) SIZE – INCH BASED (METRIC)
0201 (0603)
0402 (1005)
FEATURES
Supplied in tape on reel
Nickel-barrier end termination
RoHS compliant
Halogen free compliant
0603 (1608)
0805 (2012)
1206 (3216)
1210 (3225)
(2) TOLERANCE
K = ± 10%
M = ± 20%
(3) PACKING STYLE
R = Paper/PE taping reel; Reel 7 inch
K = Blister taping reel; Reel 7 inch
P = Paper/PE taping reel; Reel 13 inch
F = Blister taping reel; Reel 13 inch
C = Bulk case
(4) RATED VOLTAGE
4=4V
5 = 6.3 V
6 = 10 V
7 = 16 V
8 = 25 V
9 = 50 V
(5) CAPACITANCE VALUE
2 significant digits+number of zeros
The 3rd digit signifies the multiplying factor, and letter R is decimal point
Example: 103 = 10 x 103 = 10,000 pF = 10 nF
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Aug. 7, 2017 V.4
Product specification
Surface Mount Multilayer Ceramic Capacitors
General Purpose
X6S
4 V to 50 V
3
10
CONSTRUCTION
The capacitor consists of a
rectangular block of ceramic
dielectric in which a number of
interleaved metal electrodes are
contained. This structure gives
rise to a high capacitance per
unit volume.
The inner electrodes are
connected to the two end
terminations and finally covered
with a layer of plated tin (NiSn).
Thterminations are lead-free. A
cross section of the structure is
shown in Fig.1.
Fig. 1 Surface mount multilayer ceramic capacitor construction
DIMENSION
Table 1 For outlines see fig. 2
TYPE
0201
0402
0603
OUTLINES
L1 (mm)
W (mm)
0.6 ± 0.03
0.3 ± 0.03
0.3 ± 0.03
0.6± 0.09
0.3 ± 0.09
0.3± 0.09
1.0 ± 0.05
0.5 ± 0.05
0.5 ± 0.05
1.0 ± 0.15
0.5 ± 0.15
0.5 ± 0.15
1.0 ± 0.20
0.5 ± 0.20
0.5 ± 0.20
1.6± 0.10
0.8 ± 0.10
0.8 ± 0.10
1.6 ± 0.15
0.8 ± 0.15
0.8 ± 0.15
T (MM)
L2 / L3 (mm)
min.
max.
L4 (mm)
min.
0.10
0.20
0.20
0.15
0.30
0.40
0.20
0.60
0.40
1.6 ± 0.20
0.8 ± 0.20
0.8 ± 0.20
0805
2.0± 0.20
1.25 ± 0.20
1.25 ± 0.20
0.25
0.75
0.55
1206
3.2 ± 0.30
1.6 ± 0.20
1.6 ± 0.20
0.25
0.75
1.40
3.2 ± 0.40
2.5 ± 0.30
2.5 ± 0.20
3.2 ± 0.40
2.5 ± 0.30
2.5 ± 0.30
0.25
0.75
1.40
1210
For dimension see Table 1
Fig. 2 Surface mount multilayer
ceramic capacitor dimension
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Aug. 7, 2017 V.4
Product specification
Surface Mount Multilayer Ceramic Capacitors
General Purpose
X6S
4 V to 50 V
4
10
CAPACITANCE RANGE & THICKNESS FOR X6S
Table 2 Sizes from 0201 to 0402
CAP.
0201
6.3V
0402
10V
16V
25V
6.3 V
0603
10 V
16 V
25 V
4V
6.3 V
10 V
16 V
0.5±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1 0.8±0.15
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.2
0.8± 0.2
0.8± 0.2
25 V
50 V
100 nF 0.3±0.03 0.3±0.03 0.3±0.03 0.3±0.03
220 nF 0.3±0.03 0.3±0.03
0.5±0.05 0.5±0.05 0.5±0.05
470 nF 0.3± 0.09
0.5±0.05 0.5±0.05 0.5±0.05
1 uF 0.3± 0.09
0.5±0.05 0.5±0.05 0.5±0.05
2.2 uF
0.5±0.05
4.7 uF
0.5±0.15
0.8±0.2
0.8±0.2
0.8± 0.2
0.8± 0.2
10 uF
0.5±0.20
0.8±0.2
0.8±0.2
0.8± 0.2
0.8± 0.2
0.8±0.2
0.8±0.2
0.5± 0.2 0.5±0.20
22 uF
47 uF
Table 3 Sizes from 0805 to 1210
CAP.
0805
6.3 V
1210
1206
10 V
16 V
25 V
50 V
6.3 V
10 V
16 V
25 V
10 uF 1.25±0.2 1.25±0.2 1.25±0.2 1.25±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
22 uF 1.25±0.2 1.25±0.2 1.25±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
47 uF
1.6±0.2
6.3 V
10 V
16V
2.5±0.2
2.5±0.2
2.5± 0.3
2.5±0.2
2.5± 0.3
100 nF
220 nF
470 nF
1 uF
2.2 uF 1.25±0.2 1.25±0.2 1.25±0.2 1.25±0.2 1.25±0.2
4.7 uF 1.25±0.2 1.25±0.2 1.25±0.2 1.25±0.2 1.25±0.2
100 uF
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Aug. 7, 2017 V.4
Product specification
Surface Mount Multilayer Ceramic Capacitors
General Purpose
X6S
5
10
4 V to 50 V
THICKNESS CLASSES AND PACKING QUANTITY
Table 4
SIZE
CODE
Ø 180 MM / 7 INCH
Paper
Blister
Ø 330 MM / 13 INCH
Paper
Blister
THICKNESS
CLASSIFICATION
TAPE WIDTH
QUANTITY PER REEL
QUANTITY
PER BULK CASE
0201
0.3 ± 0.03 mm
8 mm
15,000
---
50,000
---
---
0402
---
50,000
---
50,000
0.5 ± 0.05 mm
8 mm
10,000
0603
0.8 ± 0.1 mm
8 mm
4,000
---
15,000
---
15,000
0805
1.25 ± 0.2 mm
8 mm
---
3,000
---
10,000
5,000
1206
1.6 ± 0.2 mm
8 mm
---
2,000
---
8,000
---
1210
2.5± 0.2/0.3 mm
8 mm
---
500
---
---
---
ELECTRICAL CHARACTERISTICS
X6S DIELECTRIC CAPACITORS; NISN TERMINATIONS
Unless otherwise specified, all tests and measurements shall be made under standard atmospheric conditions
for testing as given in 5.3 of IEC 60068-1:
-
Temperature: 15 °C to 35 °C
Relative humidity: 25% to 75%
Air pressure: 86 kPa to 106 kPa
Before the measurements are made, the capacitor shall be stored at the measuring temperature for a time
sufficient to allow the entire capacitor to reach this temperature.
The period as prescribed for recovery at the en d of a test is normally sufficient for this purpose.
Table 5
VALUE
DESCRIPTION
Capacitance range
100 nF to 100 µF
Capacitance tolerance
± 10% and ± 20%
Dissipation factor (D.F.)
≤10%
Insulation resistance after 1 minute at Ur (DC)
Rins × Cr ≥ 100 / 50 Ω.F *
Maximum capacitance change as a function of temperature
(temperature characteristic/coefficient):
± 22%
Operating temperature range:
–55 °C to +105 °C
Note:
Rins × Cr ≥ 100 Ω.F
Rins × Cr ≥ 50 Ω.F
0201: 100nF to 470nF
0201: 1uF
0402: 220nF, 470nF, 1uF/ 6.3V to 10V, 2.2uF/ 6.3V to 10 V
0402: 1uF/ 16V to 25V, 2.2uF/ 16V, 4.7uF to 10uF/ 6.3V
0603: 1uF, 2.2uF/ 6.3V to 16V, 4.7uF/ 6.3V to 16V
0603: 2.2uF/ 25V, 4.7uF/ 25V, 10uF to 22uF
0805: 2.2uF, 4.7uF to 10uF/ 6.3V to 16V
0805: 4.7uF/ 50V, 10uF/ 25V, 22uF to 47uF
1206: 10uF/ 6.3V to 16V, 22uF/ 6.3V to 10V
1206: 10uF/ 25V, 22uF/ 16V, 47uF to 100uF
1210: 47uF to 100uF
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Aug. 7, 2017 V.4
Product specification
Surface Mount Multilayer Ceramic Capacitors
General Purpose
X6S
4 V to 50 V
6
10
SOLDERING RECOMMENDATION
Table 6
SOLDERING
METHOD
Reflow
SIZE
≤ 0402
0603
0805
1206
≥ 1210
Reflow only
≥ 1.0 µF
≥ 2.2 µF
≥ 4.7 µF
Reflow only
---
< 1.0 µF
< 2.2 µF
< 4.7 µF
---
Reflow/Wave
TESTS AND REQUIREMENTS
Table 7 Test procedures and requirements
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Mounting
IEC 60384- 4.3
21/22
The capacitors may be mounted on printed-circuit boards or
ceramic substrates
No visible damage
Any applicable method using × 10 magnification
In accordance with specification
Visual
Inspection and
Dimension
Check
4.4
Capacitance (1)
4.5.1 Class 2:
Within specified tolerance
At 20 °C, 24 hrs after annealing
Cap ≤ 1 µF, f = 1 KHz, measuring at voltage 1 Vrms at 20 °C
Cap > 1 µF, f = 1 KHz for C ≤ 10 µF, rated voltage > 6.3 V,
measuring at voltage 1 Vrms at 20 °C
f = 1 KHz, for C ≤ 10 µF, rated voltage ≤ 6.3 V, measuring at
voltage 0.5 Vrms at 20 °C
f = 120 Hz for C > 10 µF, measuring at voltage 0.5 Vrms at 20 °C
Dissipation
Factor (D.F.) (1)
4.5.2 Class 2:
In accordance with specification
At 20 °C, 24 hrs after annealing
Cap ≤ 1 µF, f = 1 KHz, measuring at voltage 1 Vrms at 20 °C
Cap > 1 µF, f = 1 KHz for C ≤ 10 µF, rated voltage > 6.3 V,
measuring at voltage 1 Vrms at 20 °C
f = 1 KHz, for C ≤ 10 µF, rated voltage ≤ 6.3 V, measuring at
voltage 0.5 Vrms at 20 °C
f = 120 Hz for C > 10 µF, measuring at voltage 0.5 Vrms at 20 °C
Insulation
Resistance
4.5.3 At Ur (DC) for 1 minute
In accordance with specification
NOTE
1. The figure indicates typical inspection. Please refer to individual specifications.
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Aug. 7, 2017 V.4
Product specification
Surface Mount Multilayer Ceramic Capacitors
TEST
TEST METHOD
Temperature
4.6
Characteristic
General Purpose
X6S
PROCEDURE
REQUIREMENTS
Capacitance shall be measured by the steps shown in the
following table.
Class1:
∆ C/C: ± 30ppm
The capacitance change should be measured after 5 min at
each specified temperature stage.
Class2:
X6S: ∆ C/C: ±22%
Step
Temperature(°C)
a
25± 2
b
Lower temperature± 3°C
c
25± 2
d
Upper Temperature± 2°C
e
25± 2
4 V to 50 V
7
10
(1) Class I
Temperature Coefficient shall be calculated from the
formula as below
C2 - C1
Temp, Coefficient =
106 [ppm/°C]
C1 xΔT
C1: Capacitance at step c
C2: Capacitance at 125°C
∆T: 100°C(=125°C-25°C)
(2) Class II
Capacitance Change shall be calculated from the formula
as below
C2 - C1
∆C =
x 100%
C1
C1: Capacitance at step c
C2: Capacitance at step b or d
Adhesion
Bending
Strength
IEC 6038421/22
4.7
A force applied for 10 seconds to the line joining the
terminations and in a plane parallel to the substrate
Force
size ≥ 0603: 5N
size = 0402: 2.5N
size = 0201: 1N
4.8
Mounting in accordance with IEC 60384-22 paragraph 4.3
No visible damage
Conditions: bending 1 mm at a rate of 1 mm/s, radius jig
5 mm
∆C/C
Class2:
X6S: ± 10%
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Aug. 7, 2017 V.4
8
Product specification
Surface Mount Multilayer Ceramic Capacitors
TEST
TEST METHOD
Resistance to
Soldering
Heat
4.9
General Purpose
X6S
4 V to 50 V
10
PROCEDURE
REQUIREMENTS
Precondition: 150 +0/–10 °C for 1 hour, then keep for
24 ± 1 hours at room temperature
Dissolution of the end face plating shall
not exceed 25% of the length of the
edge concerned
Preheating: for size ≤ 1206: 120 °C to 150 °C for 1
minute
Preheating: for size >1206: 100 °C to 120 °C for 1
minute and 170 °C to 200 °C for 1 minute
Solder bath temperature: 260 ± 5 °C
Dipping time: 10 ± 0.5 seconds
∆C/C
Class2:
X6S: ± 10%
D.F. within initial specified value
Rins within initial specified value
Recovery time: 24 ± 2 hours
Solderability
4.10
Preheated the temperature of 80 °C to 140 °C and
maintained for 30 seconds to 60 seconds.
The solder should cover over 95% of
the critical area of each termination
1. Temperature: 235± 5°C / Dipping time: 2 ± 0.5 s
2. Temperature: 245± 5°C / Dipping time: 3 ± 0.5 s
(lead free)
Depth of immersion: 10mm
Rapid Change
of
Temperature
IEC 6038421/22
4.11
Preconditioning;
150 +0/–10 °C for 1 hour, then keep for 24 ± 1 hours at
room temperature
5 cycles with following detail:
30 minutes at lower category temperature
30 minutes at upper category temperature
Recovery time 24 ± 2 hours
No visual damage
∆C/C
Class2:
X6S: ± 15%
D.F. meet initial specified value
Rins meet initial specified value
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Aug. 7, 2017 V.4
Product specification
Surface Mount Multilayer Ceramic Capacitors
TEST
Damp Heat
with Ur Load
TEST METHOD
4.13
General Purpose
REQUIREMENTS
1. Preconditioning, class 2 only:
No visual damage after recovery
150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour
at room temp
2. Initial measure:
Spec: refer to initial spec C, D, IR
3. Damp heat test:
500 ± 12 hours at 40 ± 2 °C;
90 to 95% R.H. 1.0 Ur applied
Class 2: 24 ± 2 hours
5. Final measure: C, D, IR
P.S. If the capacitance value is less than the minimum
value permitted, then after the other measurements
have been made the capacitor shall be
preconditioned according to “IEC 60384 4.1” and
then the requirements shall be met.
IEC 6038421/22
4.14
4 V to 50 V
PROCEDURE
4. Recovery:
Endurance
X6S
1. Preconditioning, class 2 only:
150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour
at room temp
2. Initial measure:
Spec: refer to initial spec C, D, IR
3. Endurance test::
Temperature: X6S: 105 °C
Specified stress voltage applied for 1,000 hours:
Applied 1.5 x Ur.
Applied 1 Ur:
0201: 1uF
0402: 4.7uF, 10uF
9
10
∆C/C
Class2:
± 20%
D.F.
Class2:
2 x initial value max
Rins
Class2:
Rins x Cr ≥ 5s
whichever is less
No visual damage
∆C/C
Class 2:
± 20%
D.F.
Class 2:
2 x initial value max
Rins
Class 2:
Rins x Cr ≥ 10s
0603: 10uF, 22uF
0805: 10uF/ 25V, 22uF/ 16V
Recovery time: 24 ± 2 hours
4. Final measure: C, D, IR
P.S. If the capacitance value is less than the minimum
value permitted, then after the other measurements
have been made the capacitor shall be
preconditioned according to “IEC 60384 4.1” and
then the requirements shall be met.
Voltage Proof
IEC 60384-1 4.6
Specified stress voltage applied for 1~5 seconds
No breakdown or flashover
Ur ≤ 100 V: series applied 2.5 Ur
Charge/Discharge current is less than 50 mA
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Aug. 7, 2017 V.4
Product specification
Surface Mount Multilayer Ceramic Capacitors
General Purpose
X6S
4 V to 50 V
10
10
REVISION HISTORY
REVISION DATE
CHANGE NOTIFICATION
DESCRIPTION
Version 4
Aug 7, 2017
-
- 0402 Dimension update
Version 3
Jul 19, 2017
-
- Product range updated
Version 2
Feb. 20, 2017
-
- Dimension & capacitance update
Version 1
Sep. 16, 2015
-
- Dimension & capacitance update
Version 0
Nov. 18, 2014
-
- New datasheet for general purpose High Cap X6S
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Aug. 7, 2017 V.4