山东晶导微电子有限公司
Jingdao Microelectronics
BAV19WS / BAV20WS / BAV21WS
FEATURES
▪ For surface mounted applications
▪ Glass Passivated Chip Junction
▪ Fast reverse recovery time
▪ Ideal for automated placement
▪ Lead free in comply with EU RoHS 2011/65/EU directives
PINNING
PIN
DESCRIPTION
1
Cathode
2
Anode
2
MECHANICAL DATA
▪Case: SOD-323
▪Terminals: Solderable per MIL-STD-750, Method 2026
1
Top View
Simplified outline SOD-323 and symbol
Absolute Maximum Ratings at 25 °C
Symbols
Parameter
BAV19WS
BAV20WS
BAV21WS
Units
Maximum Repetitive Peak Reverse Voltage
V RRM
120
200
250
V
Maximum RMS voltage
V RMS
100
150
200
V
Continuous Forward Current
IF
250
mA
Repetitive Peak Forward Current
I FRM
625
mA
I FSM
1
3
9
A
P tot
500
mW
T j , T stg
-55 ~ +150
°C
Non-reptitive Peak Forward Surge Current
Total Power Dissipation
Operating and Storage Temperature Range
at 1s
at 1ms
at 1 us
Characteristics at T a = 25 °C
Parameter
Reverse Breakdown Voltage at I R=100 μA
Symbols
BAV19WS
BAV20WS
BAV21WS
Units
V (BR)R
120
200
250
V
VF
1.00
1.25
V
IR
0.1
100
μA
Typical Junction Capacitance
at V R=4V, f=1MHz
Cj
5
pF
Maximum Reverse Recovery Time
t rr
50
ns
Maximum Forward Voltage
at 100 m A
at 200 m A
Maximum DC Reverse Current
T a = 25 °C
at Rated DC Blocking Voltage
T a =150 °C
2016.01
SOD323-K-BAV19WS/BAV20WS/BAV21WS
Page 1 of 3
山东晶导微电子有限公司
Jingdao Microelectronics
BAV19WS / BAV20WS / BAV21WS
Fig.2 Typical Reverse Characteristics
600
500
400
300
200
100
0.0
25
75
50
100
125
150
175
Instaneous Reverse Current(μ A)
Total Power Dissipation (mW)
Fig.1 Forward Current Derating Curve
100
T J =150°C
10
1
0.1
T J =25°C
0.01
00
1.0
0.1
0.4
0.6
0.8
1.0
1.2
1.4
1.6
80
100
120
T J =25°C
10
1
0.1
1.0
10
100
Reverse Voltage (V)
Instaneous Forward Voltage (V)
2016.01
60
100
T J =25°C
0.2
40
Fig.4 Typical Junction Capacitance
Junction Capacitance ( pF)
Instaneous Forward Current (A)
Fig.3 Typical Instaneous Forward
Characteristics
0.01
0.0
20
percent of Rated Peak Reverse Voltage (%)
Ambient Temperature (°C)
www.sdjingdao.com
Page 2 of 3
山东晶导微电子有限公司
Jingdao Microelectronics
BAV19WS / BAV20WS / BAV21WS
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
SOD-323
E
E
D
b
A
C
A1
∠ALL ROUND
L1
E1
SOD-323 mechanical data
A
C
D
E
E1
b
L1
A1
max
1.1
0.15
1.4
1.8
2.75
0.4
0.45
0.2
min
0.8
0.08
1.2
1.4
2.55
0.25
0.2
max
43
5.9
55
70
108
16
16
min
32
3.1
47
63
100
9.8
7.9
UNIT
∠
mm
9°
8
mil
The recommended mounting pad size
1.4
(55)
1.2
(47)
Type number
Marking code
BAV19WS
A8
BAV20WS
T2
BAV21WS
T3
1.2
(47)
1.2
(47)
Marking
Unit: mm
(mil)
2016.01
JD511132B5
Page 3 of 3