634-15ABP

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin Without Pin 634-10AB 634-10ABP 왖 634-15ABP 634-15AB 634-20ABP 왖 634-20AB Material: Aluminum, Black Anodized. Height Above PC Board in. (mm) 1.000 (25.4) 1.500 (38.1) 2.000 (50.8) These slim profile unidirectional fin heat sinks offer users two assembly alternatives for vertically mounting TO-220 and TO-218 components. Models are available with or without wave- MECHANICAL DIMENSIONS TO-220 and TO-218 Footprint Dimensions in. (mm) 0.640 (16.26) x 0.640 (16.26) 0.640 (16.26) x 0.640 (16.26) 0.640 (16.26) x 0.640 (16.26) Weight lbs. (grams) 0.016 (7.48) 0.025 (11.21) 0.033 (14.95) solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications where quick assembly is needed and space is at a premium. 634 SERIES TYPICAL THERMAL PERFORMANCE FOR 634-15ABP Notes: 1. Thermal compound is assumed between device and heat sink. 2. Tab temp with longer heat sink (634-20ABP) will typically be about 15% cooler. Tab temp with shorter heat sink (634- I0ABP) will typically be about 25% higher. Dimensions: in. (mm) 637 SERIES Standard P/N High-Efficiency Heat Sinks For Vertical Board Mounting Height Above PC Board “A” in. (mm) 637-10ABP 왖 1.000 (25.4) 637-15ABP 왖 1.500 (38.1) 637-20ABP 왖 2.000 (50.8) 637-25ABP 왖 2.500 (63.5) Material: Aluminum, Black Anodized Maximum Footprint in. (mm) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight MECHANICAL DIMENSIONS TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection Weight lbs. (grams) 76°C @ 6W 65°C @ 6w 55°C @ 6W 48°C @ 6W 0.023 (10.43) 0.035 (15.88) 0.050 (22.68) 0.062 (28.12) 5.8°C/W @ 200 LFM 5.5°C/W @ 200 LFM 4.7°C/W @ 200 LFM 4.2°C/W @ 200 LFM and board space occupied must be minimized. Refer to the Accessory products section for thermal interface materials, thermal compounds, and other accessories products. 637 SERIES (EXTRUSION PROFILE 5183) NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 44 왖 Normally stocked