MWSA1204-8R2MT

Sunlord Categories: general confidential Specifications for Wire Wound Molded SMD Power Inductors Page 1 of 28 S P E C I F I C AT I O N S Customer Product Name Wire Wound Molded SMD Power Inductors Sunlord Part Number MWSA Series Customer Part Number [ New Released, Revised] SPEC No.: MWSA06170000 【This SPEC is total 28 pages including specifications and appendix.】 【ROHS Compliant Parts】 Approved By Checked By Issued By Shenzhen Sunlord Electronics Co., Ltd. Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110 Tel: 0086-755-29832660 Fax: 0086-755-82269029 E-Mail: sunlord@sunlordinc.com 【For Customer approval Only】 Qualification Status: Full Approved By Comments: Verified By Date: Restricted Rejected Re-checked By Checked By Sunlord Categories: general confidential Specifications for Wire Wound Molded SMD Power Inductors Page 2 of 28 【Version change history】 Rev. Effective Date Changed Contents Change Reasons Approved By 01 / New release / Hai Guo Sunlord 1. Categories: general confidential Specifications for Wire Wound Molded SMD Power Inductors Page 3 of 28 Scope This specification applies to MWSA series of wire wound molded SMD power Inductors 2. Product Description and Identification (Part Number) 1) Description 2) Product Identification (Part Number) Wire Wound Molded SMD Type Power Inductor, MWSAXXXX, XX μH± X% @XXX KHz/XXXV, XXXmΩ, XXXm A. MWSA XXXX -XXX □ T ① ② ③ ④ ⑤ Type ① MWSA 3. 0412~1205 Inductors Example Nominal Value 1R0 1.0μH 100 10μH 101 100μH Inductance Tolerance ④ Nominal Inductance ③ External Dimensions (mm) ② Wire wound molded SMD power M ±20% Packing ⑤ T Tape Carrier Package Electrical Characteristics Please refer to Appendix A. 4. 1) Operating temperature range (Including self-heating): -55℃~+125℃. 2) Storage temperature and humidity range (product with tapping ): -10℃~+40℃, RH 70% Max. Shape and Dimensions 1) Dimensions and recommended PCB pattern for reflow soldering: See Fig.4-1 and Table 4-1. Unit: mm Series A B C D E I typ. J typ. H typ. MWSA0412 4.2±0.25 4.4±0.35 1.0±0.2 0.8±0.3 2.0±0.3 1.5. 2.2 2.5 MWSA0402 4.2±0.25 4.4±0.35 1.8±0.2 0.8±0.3 2.0±0.3 1.5. 2.2 2.5 MWSA0518 5.2±0.2 5.4±0.3 1.6±0.2 1.20±0.2 2.2±0.3 1.9 2.2 2.5 MWSA0503 5.2±0.2 5.4±0.3 2.8±0.2 1.20±0.2 2.2±0.3 1.9. 2.2 2.5 MWSA0618 6.6±0.2 7.0±0.3 1.6±0.2 1.60±0.3 3.0±0.3 2.35 3.7 3.5 MWSA0624 6.6±0.2 7.0±0.3 2.2±0.2 1.60±0.3 3.0±0.3 2.35 3.7 3.5 MWSA0603 6.6±0.2 7.0±0.3 2.8±0.2 1.60±0.3 3.0±0.3 2.35 3.7 3.5 MWSA1004 10.0±0.3 11.5Max 3.8±0.2 2.0±0.5 3.0±0.5 4.1 5.4 4.1 MWSA1205 12.6±0.3 13.45±0.35 4.8±0.2 2.0±0.5 See Remarks 3.25 8.0 5.0 Dimensions Remarks： Code E R36/R50/R68 3R3/100/150 1R0/1R5/2R2 220/330/470 3.85±0.5 5.0±0.5 Sunlord Categories: general confidential Specifications for Wire Wound Molded SMD Power Inductors Page 4 of 28 Structure and Components: See Table 4-2 Table 4-2] Symbol a 5. Components MARKING Material Ink(black) b CORE Alloy Sponge Powder c WIRE Polyurethane copper wire d Terminal Copper plated with Sn Test and Measurement Procedures 5.1 Test Conditions 5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86 KPa to 106 KPa 5.1.2 If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86KPa to 106 KPa 5.2 Visual Examination a. Inspection Equipment: 10 X magnifier 5.3 Electrical Test 5.3.1 DC Resistance (DCR) a. Refer to Appendix A. b. Test equipment (Analyzer): HIOKI3540 or equivalent. 5.3.2 Inductance (L) a. Refer to Appendix A. b. Test equipment: Wayne kerr3260+3265B or equivalent. 5.3.3 Rated Current a. Refer to Appendix A. b. Test equipment: Wayne kerr3260+3265B, Agilent E3633A, R2M-2H3 or equivalent. c. Definition of Rated Current (Ir): With the condition of the DC current pass, the inductance decrease by 30% of the standard value, compare to the temperature rise by 40℃, the smaller is Rated Current.(reference environment temperature:20℃) 5.4 Reliability Test Mechanical Reliability Item Solderability Specification and Requirement Test Method The surface of terminal immersed shall be Solder heat proof: minimum of 95% covered with a new coating of 1. Preheating: 160 ± 10 ℃ solder 2. Retention time: 245 ± 5 ℃ for 2 ± 0.5 seconds 1. Vibration frequency: (10 Hz to 55 Hz to 10Hz) in 60 seconds as a period Vibration Inductance change: Within ± 10% Without 2. mechanical damage such as break Vibration time: Period cycled for 2 hours in each of 3 mutual perpendicular directions. Shock Inductance change: Within ± 10% Without mechanical damage such as break 3. Amplitude: 1.5 mm max. 1. Peak value: 100 G 2. Duration of pulse: 11ms 3. 3 times in each positive and negative direction of 3 mutual perpendicular directions Endurance Reliability Item Thermal Shock Specification and Requirement Inductance change: Within ± 10% Without distinct damage in appearance Test Method 1. Repeat 100 cycles as follow: (-55 ± 2 ℃; 30 ± 3 min) →(Room temp., 5 min) Sunlord Categories: general confidential Specifications for Wire Wound Molded SMD Power Inductors Page 5 of 28 → (+125 ± 2 ℃, 30 ± 3 min) → (Room temp., 5 min) 2. Recovery: 48 + 4 / -0 hours of recovery under the standard condition after the test. High Temperature Resistance Humidity Resistance Inductance change: Within ± 10% Without distinct damage in appearance 1. Applied Current: Rated current 2. Duration: 1000 + 4 / -0 hours 1. Environment condition: 60 ± 2 ℃ Inductance change: Within ±10% Without distinct Humidity: 90–95% damage in appearance Applied Current: Rated current 2. Low Temperature Store High Temperature Store 6. Environment condition: 85 ± 2 ℃ Duration: 1000 + 4 / -0 hours Inductance change: Within ± 10% Without distinct Store temperature: damage in appearance -55 ± 2 ℃,1000 + 4 / -0 hours Inductance change: Within ± 10% Without distinct Store temperature: damage in appearance +125 ± 2 ℃,1000 + 4 / -0 hours Packaging, Storage and Transportation 6.1 Tape Carrier Packaging: Packaging code: T (1) Tape carrier packaging are specified in attached figure Fig.6.1-1~2 (2) Tape carrier packaging quantity: Type Standard Quantity (pcs/reel) Type Standard Quantity (pcs/reel) MWSA0412 3000 MWSA0624 1500 MWSA0402 3000 MWSA0603 1500 MWSA0518 2000 MWSA1004 500 MWSA0503 2000 MWSA1205 500 MWSA0618 1500 a. Taping Drawings (Unit: mm) Fig.6.1-1 b.Reel and Taping Dimensions (Unit: mm) Fig.6.1-2 Sunlord Type Categories: general confidential Specifications for Wire Wound Molded SMD Power Inductors Reel dimensions (mm) Tape dimensions (mm) A B C D MWSA0412 330±2.0 100±1.0 13±1.0 16.5±0.9 MWSA0402 330±2.0 100±1.0 MWSA0518 330±2.0 MWSA0503 E W Page 6 of 28 P P0 H T A0 B0 12.5±0.5 12±0.3 8±0.1 4±0.1 1.4±0.15 0.35±0.05 4.5±0.1 4.8±0.1 13±1.0 16.5±0.6 12.5±0.2 12±0.3 8±0.1 4±0.1 2.5±0.15 0.35±0.05 4.5±0.1 4.8±0.1 100±1.0 13±1.0 16.5±0.6 12.5±0.2 12±0.3 8±0.1 4±0.1 2.3±0.15 0.35±0.05 5.7±0.1 5.9±0.1 330±2.0 100±1.0 13±1.0 16.5±0.6 12.5±0.2 12±0.3 8±0.1 4±0.1 3.3±0.15 0.35±0.05 5.7±0.1 5.9±0.1 MWSA0618 330±2.0 100±1.0 13±1.0 20.5±0.6 16.5±0.2 16±0.3 12±0.1 4±0.1 2.3±0.15 0.31±0.05 7.2±0.1 7.5±0.1 MWSA0624 330±2.0 100±1.0 13±1.0 20.5±0.6 16.5±0.2 16±0.3 12±0.1 4±0.1 3.6±0.15 0.31±0.05 7.2±0.1 7.5±0.1 MWSA0603 330±2.0 100±1.0 13±1.0 20.5±0.6 16.5±0.2 16±0.3 12±0.1 4±0.1 3.6±0.15 0.31±0.05 7.2±0.1 7.5±0.1 MWSA1004 330±2.0 100±1.0 13±1.0 28.5±0.6 24.5±0.2 24±0.3 16±0.1 4±0.1 4.5±0.1 0.35±0.025 10.7±0.1 12.0±0.1 MWSA1205 330±2.0 100±1.0 13±1.0 28.5±0.6 24.5±0.2 24±0.3 16±0.1 4±0.1 5.4±0.15 0.5±0.05 13.4±0.1 14.4±0.1 c.Inner boxes high for 30mm or 35mm on 12-16mm Carrier tape，Inner boxes high for 35mm or 40mm on 24mm Carrier tape，A reel of a box . d.Peeling off force: 10gf to 130gf in the direction show below. Top tape or cover tape 0 165 ~ 180 Base tape 0 Fig. 6.1-4 6.2 Storage (1) The solderability of the external electrodes may deteriorate if packages are stored in high humidity. Besides, to ensure packing material’s good state, packages must be stored at -10℃ to 40℃ and 70% RH Max. (2) The solderability of the external electrodes may deteriorate if packages are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H2S). (3) Packaging materials may deform if packages are exposed directly to sunlight. (4) Minimum packages, such as polyvinyl heat-seal packages shall not be opened until they are used. If opened, use the reels as soon as possible. (5) Solderability shall be guaranteed for a period of time from the date of delivery on condition that they are stored at the specified environment. For those parts, which passed more than the time shall be checked solderability before using. (6) For magnetic products, keep clear of anything that may generate magnetic fields to avoid change of products performance. (7) To avoid any damage to products, do not load mechanic force on products or place heavy goods on products, and exclude strong vibration or drop. (8)In case of storage over 12 months, solderability shall be checked before actual usage. 7. Warning and Attentions 7.1 Precautions on Use (1) Always wear static control bands to protect against ESD. (2) Any devices used with the products (soldering irons, measuring instruments) should be properly grounded. (3) Keep bare hands and metal conductors (i.e., metal desk) away from electrodes or conductive areas that lead to electrodes. (4) Preheat when soldering. (5) Don’t apply current in excess of the rated current value. It may reduce the impedance or inductance, or cause damage to components due to over-current. (6) For magnetic products, keep clear of anything that may generate magnetic fields such as speakers and coils. Use non-magnetic tweezers when handing the chips. (7) When soldering, the electrical characteristics may be varied due to hot energy and mechanical stress. (8) When coating products with resin, the relatively high resin curing stress may change the electrical characteristics. For exterior coating, select resin carefully so that electrical and mechanical performance of the product is not affected. Before using, please evaluate reliability with the product mounted in your application set. (9) When mount chips with adhesive in preliminary assembly, do appropriate check before the soldering stage, i.e., the size of land pattern, type of adhesive, amount applied, hardening of the adhesive on proper usage and amounts of adhesive to use. (10) Mounting density: Add special attention to radiating heat of products when mounting other components nearby. The excessive heat by other products may cause deterioration at joint of this product with substrate. (11) Since some products are constructed like an open magnetic circuit, narrow spacing between components may cause magnetic coupling. (12) Please do not give the product any excessive mechanical shocks in transportation. (13) Please do not touch wires by sharp terminals such as tweezers to avoid causing any damage to wires. (14) Please do not add any shock and power to the soldered product to avoid causing any damage to chip body. Sunlord Categories: general confidential Specifications for Wire Wound Molded SMD Power Inductors Page 7 of 28 (15) Please do not touch the electrodes by naked hand as the solderability of the external electrodes may deteriorate by grease or oil on the skin. 7.2 PCB Bending Design The following shall be considered when designing and laying out PCB’s. (1) PCB shall be designed so that products are not subjected to the mechanical stress from board warp or deflection. Products shall be located in the sideways direction to the mechanical stress (Poor example) (Good example) (2) Products location on PCB separation. Seam B A C Product shall be located carefully because they may be subjected to the mechanical stress in order of A>C=B>D. D (3) When splitting the PCB board, or insert (remove) connector, or fasten thread after mounting components, care is required so as not to give any stress of deflection or twisting to the board. Because mechanical force may cause deterioration of the bonding strength of electrode and solder, even crack of product body. Board separation should not be done manually, but by using appropriate devices. 7.3 Recommended PCB Design for SMT Land-Patterns When chips are mounted on a PCB, the amount of solder used (size of fillet) can directly affect chip performance. Therefore, the following items must be carefully considered in the design of solder land patterns: (1) The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. (2) When more than one part is jointly soldered onto the same land or pad, the pad must be designed that each component’s soldering point is separated by solder-resist. Recommended land dimensions please refer to product specification. 8 Recommended Soldering Technologies 8.1Re-flowing Profile: △ Preheat condition: 150 ~200℃/60~120sec. △ Allowed time above 217℃: 60~90sec. △ Max temp: 260℃ △ Max time at max temp: 10sec. △ Solder paste: Sn/3.0Ag/0.5Cu △ Allowed Reflow time: 2x max Please refer to Fig. 8.1 217℃ Max Ramp Up Rate=3℃/sec. Max Ramp Down Rate=6℃/sec. 60～90sec. 200℃ 150℃ 60～120sec. [Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly Peak 260℃ max 260℃ 25℃ profiles. Actual board assembly profiles must be based on Time 25℃ to Peak =8 min max Fig. 8.1 the customer's specific board design, solder paste and process, and should not exceed the parameters as the Reflow profile shows.] 8.2 Iron Soldering Profile △ Iron soldering power: Max. 30W △ Pre-heating: 150℃/60sec. △ Soldering Tip temperature: 350℃ Max. △ Soldering time: 3sec. Max. △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.1 times for iron soldering 3sec. Max. 350℃ Soldering Iron Power: max. 30W Diameter of Soldering Please refer to Fig. 8.2. Iron 1.0mm max. [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] Tc ℃ 8.3 Recommended Soldering Technologies Heat Gun Profile △ Soldering tip temperature: 350℃ Max. △ Hot air time: