SMD2018-050

厂商：
SEA&LAND(台湾陆海)
封装：
2018
描述：
PTC自恢复保险丝 FUSE2018 60V 0.55A

数据手册：

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数据手册
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SMD2018-050 数据手册

Features Applications ■ Surface Mount Devices Almost anywhere there is a low voltage ■ Lead free device power supply, up to 60V and a load to be ■ Size 5.0*4.5mm/0.20*0.18 inch protected, including: ■ Surface Mount packaging ■ Computer mother board, Modem. for automated assembly SMD2018 Series ■ Telecommunication equipments. Alpha-Top (Sea & Land Alliance) Performance Specification Maximum Ihold Itrip Pd Time To Trip Model @25°C @25°C Typ. Current Time (Vdc) (A) (A) (A) (W) (A) (Sec) SMD2018-030 60 100 0.30 0.60 0.9 1.5 3.00 SMD2018-050 60 100 0.55 1.20 1.0 2.5 3.00 SMD2018-100 15 100 1.10 2.20 1.1 8.0 0.40 SMD2018-100-33V 33 100 1.10 2.20 1.1 8.0 0.40 SMD2018-150 15 100 1.50 3.00 1.1 8.0 0.80 SMD2018-200 10 100 2.00 4.00 1.1 8.0 2.40 Ihold = Hold Current. Maximum current device will not trip in 25°C still air. Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air. Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax). Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax). Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame. Vmax Imax Environmental Specifications Test Conditions Passive aging +85°C, 1000 hrs. Humidity aging +85°C, 85% R.H. , 168 hours Thermal shock +85°C to -40°C, 20 times Resistance to solvent MIL-STD-202,Method 215 Vibration MIL-STD-202,Method 201 Ambient operating conditions : - 40 °C to +85 °C Maximum surface temperature of the device in the tripped state is 125 °C AGENCY APPROVALS : UL pending Regulation/Standard: 2002/95/EC Resistance Rimin (Ω) 0.500 0.200 0.060 0.060 0.050 0.030 R1max (Ω) 2.300 1.000 0.360 0.360 0.170 0.100 Resistance change ±5% typical ±5% typical ±33% typical No change No change EN14582 Ihold Versus Temperature Model SMD2018-030 SMD2018-050 SMD2018-100 SMD2018-100-33V SMD2018-150 SMD2018-200 -40°C 0.48 0.87 1.71 1.71 2.38 2.95 -20°C 0.42 0.77 1.52 1.52 2.10 2.65 Maximum ambient operating temperature (Tmao) vs. hold current (Ihold) 0°C 25°C 40°C 50°C 60°C 0.35 0.30 0.24 0.21 0.17 0.67 0.55 0.46 0.41 0.36 1.32 1.10 0.94 0.84 0.74 1.32 1.10 0.94 0.84 0.74 1.82 1.50 1.27 1.13 0.99 2.35 2.00 1.74 1.59 1.44 70°C 0.15 0.31 0.64 0.64 0.85 1.29 85°C 0.10 0.23 0.50 0.50 0.64 1.06 SMD2018 Series Alpha-Top (Sea & Land Alliance) Construction And Dimension (Unit:mm) A Model B Min. 4.72 4.72 4.72 4.72 4.72 4.72 SMD2018-030 SMD2018-050 SMD2018-100 SMD2018-100-33V SMD2018-150 SMD2018-200 Max. 5.44 5.44 5.44 5.44 5.44 5.44 Min. 4.22 4.22 4.22 4.22 4.22 4.22 C Max. 4.93 4.93 4.93 4.93 4.93 4.93 Min. 0.60 0.70 0.45 0.45 0.45 0.45 Dimensions & Marking Recommended Pad Layout (mm) A 1.5士0.1 α 010 1.5 士0.1 4.6士0.1 B D Min. 0.30 0.30 0.30 0.30 0.30 0.30 Max. 1.10 1.30 0.80 0.80 0.80 0.80 = Trademark 010 = Hold current D E 3.4士0.1 C Termination Pad Characteristics Terminal pad materials： Tin-plated Nickel-Copper Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Terminal pad solderability： Rework Use standard industry practices, the removal device must be replaced with a fresh one. Thermal Derating Curve Typical Time-To-Trip At 25°C Average Time Current Curves Derating Curves for SMD2018 Series Percentage of Derated Current 160 050 100 100 140 150 10 Time In Second 120 100 80 60 40 200 1 133 0.1 030 0.01 20 0.001 0 -40 -20 0 20 Temperature (°C) 40 60 80 0.1 1 10 100 Current In Amperes · Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. · PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. · Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components. · Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC. · Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space. · Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices. PPTC SMD can be cleaned by standard methods. · Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or reflow profile could negatively impact solderability performance of our devices. SMD2018 Series Alpha-Top (Sea & Land Alliance) Recommended Solder Reflow Conditions 300 Preheating Cooling Soldering ‧Recommended reflow methods：IR, vapor phase oven, hot air oven. ‧Devices are not designed to be wave soldered to the bottom side 250 of the board. 200 ‧Recommended maximum paste thickness is 0.25 mm (0.010 inch). 190 ‧Devices can be cleaned using standard method and solvents. 160 Note：If reflow temperatures exceed the recommended profile, 100 0 devices may not meet the performance requirements. 60-120 sec. 30~60sec. Tape And Reel Specifications (mm) Governing Specifications W P0 P1 P2 A0 B0 B1max. D0 F E1 E2min. Tmax. T1max. K0 Leader min. Trailer min. Reel Dimensions A max. N min. W1 W 2max. 120 sec. EIA Tape Component Dimensions EIA 481-2 12.0 ± 0.20 4.0 ± 0.10 8.0 ± 0.10 2.0 ± 0.05 4.40 ± 0.10 5.50 ± 0.10 8.2 1.5 + 0.1, -0.0 5.5 ± 0.05 1.75 ± 0.10 10.25 0.6 0.1 1.36 ± 0.1 390 160 178 50 12.4 + 2.0, -0.0 18.4 P0 T Embossment P2 D0 E1 Cover tape A0 B1 F K0 T1 W E2 B0 P1 EIA Reel Dimensions W2(measured at hub) A N(hub dia.) 0 Cover tape W1(measured at hub) Carrier tape Embossed cavity Storage And Handling ‧ Storage conditions：40°C max, 70% R.H. ‧ Devices may not meet specified performance if storage conditions are exceeded. Order Information Packaging SMD2018 Product name Size 5045mm/2018 inch SMD：surface mount device Tape & reel packaging per EIA481-1 050 Hold Current 0.50A Labeling Information Sea & Land Electronic Corp. Pb Model: Part no.: Spec.: Lot no.: Q'ty: 倉儲：密封！溫度：18～33℃/濕度：30～60％ A RoHS Tape & Reel Quantity 030, 050 1,500 pcs/reel 100, 100-33V, 150, 200 2,500 pcs/reel

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SMD2018-050

1. 物料型号：SMD2018系列，包括SMD2018-030、SMD2018-050、SMD2018-100、SMD2018-100-33V、SMD2018-150和SMD2018-200。

2. 器件简介：SMD2018系列是表面贴装设备，尺寸为5.04.5mm，无铅设备，适用于自动化组装。

3. 引脚分配：文档中未明确提供引脚分配图，但提到了表面贴装封装。

4. 参数特性：包括最大工作电压(Vmax)、最大故障电流(Imax)、保持电流(Ihold)、触发电流(Itrip)、功耗(Pd)、最大电阻变化(Rimin/max)等。

5. 功能详解：SMD2018系列主要用于低电压电源保护，适用于计算机主板、调制解调器、电信设备等。

6. 应用信息：适用于高达60V的低电压电源和需要保护的负载。

7. 封装信息：提供了详细的尺寸和标记信息，包括推荐焊盘布局和端子垫特性。

8. 环境规格：包括被动老化、湿度老化、热冲击、耐溶剂性、振动等测试条件和电阻变化。

9. 机构认证：UL待定，符合RoHS、2002/95/EC、EN14582等标准。

10. 温度与保持电流关系：提供了不同型号在不同环境温度下的保持电流变化。