SMD1206P200TF

SMD1206 Series Positive Temperature Coefficient (PTC) Description The 1206 series provides miniature surface mount overcurrent protection with holding current from 0.12A to 2.0A. This series is suitable for wide range of applications in modern electronics where space is limited. Features y RoHS compliant and lead-free y Low profile y Halogen-free y Fast response to fault current y Compact design saves board space y Compatible with high temperature solders Applications y Mobile Internet Device (MID) y Set-top-box and HDMI y Battery PCM y Game console port protection y USB hubs, ports and peripherals y General electronics Electrical Characteristics Part Number Ihold (A) I trip (A) Vmax (Vdc) Imax (A) Pd typ (W) Maximum Time To Trip Current Time (A) (Sec.) Resistance R min () R1max () SMD1206P005TF 0.05 0.15 60 100 0.4 0.25 1.50 3.600 50.00 SMD1206P012TF 0.12 0.29 30 100 0.6 1.00 0.20 1.500 6.000 SMD1206P016TF 0.16 0.37 30 100 0.6 1.00 0.30 1.200 4.500 SMD1206P020TF/24 0.20 0.42 24 100 0.6 8.00 0.10 0.650 2.600 SMD1206P025TF 0.25 0.50 16 100 0.6 8.00 0.08 0.550 2.300 SMD1206P025TF/24 0.25 0.55 24 100 0.6 8.00 0.08 0.550 2.300 SMD1206P035TF 0.35 0.75 6 100 0.6 8.00 0.10 0.300 1.200 SMD1206P035TF/16 0.35 0.75 16 100 0.6 8.00 0.10 0.300 1.200 SMD1206P050TF 0.50 1.00 6 100 0.6 8.00 0.10 0.150 0.700 SMD1206P050TF/15 0.50 1.00 15 100 0.6 8.00 0.10 0.150 0.750 SMD1206P075TFT 0.75 1.50 8 100 0.6 8.00 0.20 0.090 0.290 SMD1206P075TF/13.2 0.75 1.50 13.2 100 0.6 8.00 0.20 0.090 0.350 SMD1206P075TF/16 0.75 1.50 16 100 0.6 8.00 0.20 0.090 0.290 SMD1206P100TFT 1.00 2.00 13.2 100 0.8 8.00 0.10 0.040 0.210 SMD1206P110TFT 1.10 2.20 13.2 100 0.8 8.00 0.10 0.040 0.210 SMD1206P150TFT 1.50 3.00 8 100 0.8 8.00 0.30 0.040 0.120 SMD1206P175TF 1.75 3.50 6 100 0.8 8.00 0.50 0.020 0.090 SMD1206P200TF 2.00 3.50 6 100 0.8 8.00 1.50 0.018 0.080 1/6 SMD1206 Series Positive Temperature Coefficient (PTC) Note on Electrical Characteristics „ Vocabulary Ihold = Hold current: maximum current device will pass without tripping in 23ºC still air. Itrip = Trip current: minimum current at which the device will trip in 23 ºC still air. Vmax = Maximum voltage device can withstand without damage at rated current (I max) Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) Pd typ = Typical power dissipated from device when in the tripped state at 23 ºC still air. Rmin = Minimum resistance of device in initial (un-soldered) state. R1max = Maximum resistance of device at 23 ºC measured one hour after tripping or reflow soldering of 260 ºC for 20 sec. „ Value specified is determined by using the PWB with 0.030”*1.5oz copper traces. „ Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. „ Specifications are subject to change without notice. Polymeric PTC Selecting Guide „ Determine the following operating parameters for the circuits: y Normal operating current (Ihold) Ɂ Maximum interrupt current (Imax) y Maximum circuit voltage (Vmax) Ɂ Normal operating temperature surrounding device (minºC/maxºC) y Surface Mount Device (SMD) Ɂ Axial Leaded Device (ALD) y Radial Leaded Device (RLD) Ɂ DISC Device ! !! „ Select the device form factor and dimension suitable for the application: !! Ɂ Other Customized Form Factors !! !! „ Compare the maximum rating for Vmax and Imax of the PPTC device with the circuit in application and make sure the circuit’s requirement does not exceed the device rating. „ Check that PPTC device’s trip time (time-to-trip) will protect the circuit. „ Verify that the circuit operating temperature is within the PPTC device’s normal operating temperature range. „ Verify the performance and suitability of the chosen PPTC device in the application. „ Mechanical Stress y PPTC devices will undergo a thermal expansion during fault condition. If PPTC devices are installed or placed in an application where the space between PPTC devices and the surrounding materials (e.g., covering materials, packaging materials, encapsulate materials and the like) is insufficient, it will cause an inhibiting effect upon the thermal expansion. Pressing, twisting, bending and other kinds of mechanical stress will also adversely affect the performance of the PPTC devices, and shall not be used or applied. „ Chemical Pollutants y Silicone-based oils, oils, solvents, gels, electrolytes, fuels, acids, and the like will adversely affect the properties of PPTC devices, and shall not be used or applied. „ Electronic and Thermal Effect y PPTC devices are secondary protection devices and are used solely for sporadic, accidental over-current or over-temperature error condition, and shall NOT be used if or when constant or repeated fault conditions (such fault conditions may be caused by, among others, incorrect pin-connection of a connector) or over-extensive trip events may occur. y PTTC devices are different from fuses and, when a fault condition occurs, will go into high-resistance state and do not open circuit, in which case the voltage at such PPTC devices may reach a hazardous level. y Operation over the maximum rating or other forms of improper use may cause failure, arcing, flame and/or other damage to the PPTC devices. y Conductive material contamination, such as metal particle, may induce shortage, flame or arcing. y Due to the inductance, the operation circuits may generate a circuit voltage (Ldi/dt) above the rated voltage of PPTC devices, which shall not be used under such circumstances. „ General y Customers shall evaluate and test the properties of PPTC devices independently to verify and ensure that their individual applications will be met. y The performance of PPTC devices will be adversely affected if they are improperly used under electronic, thermal and/or mechanical procedures and/or conditions non-conformant to those recommended by manufacturer. y Customers shall be responsible for determining whether it is necessary to have back-up, failsafe and/or fool-proof protection to avoid or minimize damage that may result from extra-ordinary, irregular function or failure of PPTC devices. y Any and all responsibilities and liabilities are disclaimed if any item under this notice of warning is not complied with. 2/6 SMD1206 Series Positive Temperature Coefficient (PTC) Thermal Derating Curve Percentage of Rated Current 200.00 150.00 100.00 50.00 0.00 -40.00 0.00 40.00 80.00 120.00 Device Ambient Temperature (ɗ ) Thermal Derating Chart Recommended Hold Current (A) at Ambient Temperature (ºC) Part Number Ambient Operation Temperature -40 ºC -20 ºC 0 ºC 23 ºC 40 ºC 50 ºC 60 ºC 70 ºC 85 ºC SMD1206P012TF 0.18 0.16 0.14 0.125 0.10 0.09 0.08 0.07 0.05 SMD1206P016TF 0.22 0.20 0.18 0.16 0.14 0.12 0.10 0.09 0.08 SMD1206P020TF/24 0.28 0.25 0.23 0.20 0.17 0.15 0.14 0.12 0.09 SMD1206P025TF 0.37 0.33 0.29 0.25 0.22 0.20 0.17 0.15 0.12 SMD1206P025TF/24 0.37 0.33 0.29 0.25 0.22 0.20 0.17 0.15 0.12 SMD1206P035TF/16 0.50 0.45 0.40 0.35 0.30 0.27 0.24 0.21 0.15 SMD1206P050TF 0.71 0.64 0.57 0.50 0.42 0.39 0.35 0.31 0.25 SMD1206P050TF/15 0.71 0.64 0.57 0.50 0.42 0.39 0.35 0.31 0.25 SMD1206P075TFT 1.14 1.01 0.88 0.75 0.65 0.59 0.54 0.49 0.41 SMD1206P075TF/13.2 1.14 1.01 0.88 0.75 0.65 0.59 0.54 0.49 0.41 SMD1206P075TF/16 1.14 1.01 0.88 0.75 0.65 0.59 0.54 0.49 0.41 SMD1206P110TFT 1.64 1.46 1.30 1.10 0.92 0.83 0.80 0.65 0.52 SMD1206P150TFT 2.20 1.99 1.77 1.50 1.34 1.23 1.10 1.01 0.84 SMD1206P175TF 2.50 2.25 2.00 1.75 1.55 1.45 1.35 1.25 1.10 SMD1206P200TF 2.60 2.44 2.35 2.00 1.78 1.67 1.50 1.45 1.10  3/6 SMD1206 Series Positive Temperature Coefficient (PTC) Average Time-Current Curve 100.00 A炼SMD1206P012TF B D B炼SMD1206P016TF C炼SMD1206P020TF/24 A 10.00 Time to Trip (Sec.) C D炼SMD1206P025TF SMD1206P025TF/24 1.00 0.10 0.01 0.10 1.00 10.00 Fault Current (Amp.) Average Time-Current Curve 100.00 A炼SMD1206P035TF/16 A B炼SMD1206P050TF/15 B C炼SMD1206P075TFT H Time to Trip (Sec.) 10.00 D炼SMD1206P075TF/13.2 FG D C SMD1206P075TF/16 E E炼SMD1206P110TFT 1.00 F炼SMD1206P150TFT G炼SMD1206P175TF H炼SMD1206P200TF 0.10 0.01 0.10 1.00 10.00 Faulct Current (Amp.) 4/6 SMD1206 Series Positive Temperature Coefficient (PTC) Soldering Parameters Profile Feature Average Ramp-Up Rate (Tsmax to TP) Preheat -Temperature Min (Tsmin) -Temperature Max (Tsmax) -Time (Tsmin to Tsmax) Time maintained above: -Temperature (TL) -Time (tL) Peak Temperature (TP) Time within 5ºC of actual Peak Temperature (tP) Ramp-Down Rate Time 25ºC to Peak Temperature Storage Condition Pb-Free Assembly 3ºC/second max. 150ºC 200ºC 60-180 seconds 217ºC 60-150 seconds 260ºC 20-40 seconds 6 ºC /second max. 8 minutes max. 0ºC ~35ºC, ʀ70%RH y Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free y Recommended maximum paste thickness is 0.25mm (0.010 inch) y Devices can be cleaned using standard industry methods and solvents. Note 1: All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 5/6 SMD1206 Series Positive Temperature Coefficient (PTC) Physical Dimensions (mm.) Figure 2 Part Number A B C D Max. Min. Max. Min. Max. Min. Max. Min. Max. SMD1206P012TF 3.00 3.40 1.50 1.80 0.65 1.45 0.25 0.75 0.05 0.45 SMD1206P016TF 3.00 3.40 1.50 1.80 0.65 1.45 0.25 0.75 0.05 0.45 SMD1206P020TF/24 3.00 3.40 1.50 1.80 0.50 1.00 0.25 0.75 0.05 0.45 SMD1206P025TF 3.00 3.40 1.50 1.80 0.50 1.00 0.25 0.75 0.05 0.45 SMD1206P025TF/24 3.00 3.40 1.50 1.80 0.50 1.00 0.25 0.75 0.05 0.45 SMD1206P035TF/16 3.00 3.40 1.50 1.80 0.45 0.75 0.25 0.75 0.05 0.45 SMD1206P050TF 3.00 3.40 1.50 1.80 0.45 0.75 0.25 0.75 0.05 0.45 SMD1206P050TF/15 3.00 3.40 1.50 1.80 0.45 0.75 0.25 0.75 0.05 0.45 SMD1206P075TFT 3.00 3.40 1.50 1.80 0.40 0.60 0.25 0.75 0.05 0.45 SMD1206P075TF/13.2 3.00 3.40 1.50 1.80 0.75 1.25 0.25 0.75 0.05 0.45 SMD1206P075TF/16 3.00 3.40 1.50 1.80 0.75 1.25 0.25 0.75 0.05 0.45 SMD1206P110TFT 3.00 3.40 1.50 1.80 0.30 0.60 0.25 0.75 0.05 0.45 SMD1206P150TFT 3.00 3.40 1.50 1.80 0.50 1.00 0.25 0.75 0.05 0.45 SMD1206P175TF 3.00 3.40 1.50 1.80 0.80 1.80 0.25 0.75 0.05 0.45 SMD1206P200TF 3.00 3.40 1.50 1.80 0.80 1.60 0.25 0.75 0.05 0.45 Environmental Specifications  E Min. Operating Temperature -40ºC to +85 ºC Maximum Device Surface Temperature in Tripped State 125ºC Passive Aging +85ºC , 1000 hours ±5% typical resistance change Humidity Aging +85ºC , 85%R.H. 1000 hours ±5% typical resistance change Thermal Shock MIL-STD-202 Method 107G +85ºC /-40ºC 20 times -30% typical resistance change Solvent Resistance MIL-STD-202, Method 215 No change Vibration MIL-STD-883C, Method 2007.1, Condition A No change Moisture Sensitivity Level Level 1, J-STD-020C 6/6