J K250 SERIES
Positive Temperature Coefficient (PTC)
Features
■
■
■
■
■
■
Radial leaded devices.
Over-current protection
High voltage surge capabilities
Flame retardant epoxy polymer insulating material meets UL94 V-0 requirement.
Available in lead-free version.
Meets MSL level 1, per J-STD-020
Dimensions (Unit: mm)
Part
Number
A
B
C
D
E
F
Max.
Max.
±0.6
Max.
Typ.
Min.
JK250-030
6.0
8.0
5. 1
4.6
0.6
7.6
DZ
JK250-040
7.4
13.5 / 12.7
5.1
4.6
0.6
4.6 / 7.6
DY / DZ
JK250-060
7.4
14.5 / 12.7
5.1
4. 6
0.6
4.6 / 7.6
DY / DZ
JK250-080
7.4
14.5 / 12.7
5.1
4.6
0.6
4.6 / 7.6
DY / DZ
JK250-090
7.4
14.5 / 12.7
5.1
4. 6
0.6
4.6 / 7.6
DY / DZ
JK250-110
7.0
14.5 / 10.5
5.1
4.6
0.6
4.6 / 7.6
SY / SZ
JK250-120
7.0
14.5 / 10.5
5.1
4. 6
0.6
4.6 / 7.6
SY / SZ
JK250-145
7.5
15.0 / 11.0
5.1
4.6
0.6
4.6 / 7.6
SY / SZ
JK250-180
10.5
18.5 / 14.5
5.1
4.6
0.6
4.6 / 7.6
SY/SZ/DZ
JK250-200
10.5
17.0
5.1
4.6
0.6
7.6
SZ / DZ
JK250-400
11.2
17.0
5.1
4.6
0.8
7.6
SZ
JK250-600
16.0
18.0
5.1
4.6
0.8
7.6
SZ
JK250-800
20.0
22.0
5. 1
4.6
0.8
7.6
SZ
1/5
Style.
J K250 SERIES
Electrical Characteristics
Part
Number
IH
IT
VMAXi
IMAX
RMAX
RMIN
Pd typ.
(A)
(A)
(VAC)
(A)
(Ω)
(Ω)
(W)
JK250-030
0.03
0.06
250
1
90.0
35.0
1.0
JK250-040
0.04
0.08
250
3
65.0
27.0
1.0
JK250-060
0.06
0.12
250
3
45.0
20.0
1.0
JK250-080
0.08
0.16
250
3
22.0
10.0
1.0
JK250-090
0.09
0.18
250
3
20.0
7.0
1.0
JK250-110
0.11
0.22
250
3
12.0
6.0
1.0
JK250-120
0.12
0.24
250
3
10.5
6.0
1.0
JK250-145
0.145
0.29
250
3
6.5
3.5
1.0
JK250-180
0.18
0.54
250
10
3.0
1.0
1.0
JK250-200
0.20
0.40
250
10
6.0
3.0
1.0
JK250-400
0.40
0.80
250
10
3.0
1.0
1.0
JK250-600
0.60
1.20
250
10
2.0
0.6
1.0
JK250-800
0.80
1.60
250
10
1.0
0.4
1.0
·IH = Hold current: maximum current device will pass without tripping in 25℃ still air.
·IT = Trip current: minimum current at which the device will trip in 25℃ still air.
·VMAXi = Maximum interrupt voltage device can withstand without damage at rated current.
·IMAX = Maximum fault current device can withstand without damage at rated voltage.
·RMAX = Maximum resistance of device in initial (un-soldered) state.
·RMIN = Minimum resistance of device in initial (un-soldered) state.
·Pd typ. = Typical power dissipation from device when in the tripped state at 25℃ still air.
Thermal Derating Chart – IH (A)
Maximum Ambient Operating Temperatures (℃ )
Part
Number
-20
0
25
30
40
50
60
70
85
JK250-030
0.040
0.035
0.030
0.027
0.025
0.023
0.020
0.017
0.013
JK250-040
0.053
0.047
0.040
0.036
0.034
0.031
0.027
0.024
0.019
JK250-060
0.079
0.070
0.060
0.055
0.051
0.046
0.041
0.037
0.029
JK250-080
0.106
0.094
0.080
0.073
0.068
0.062
0.054
0.049
0.038
JK250-090
0.119
0.105
0.090
0.082
0.077
0.069
0.061
0.055
0.043
JK250-110
0.145
0.129
0.110
0.100
0.094
0.085
0.075
0.067
0.053
JK250-120
0.158
0.140
0.120
0.109
0.102
0.092
0.082
0.073
0.058
JK250-145
0.191
0.170
0.145
0.132
0.123
0.112
0.099
0.088
0.070
JK250-180
0.238
0.211
0.180
0.164
0.153
0.139
0.122
0.110
0.086
JK250-200
0.264
0.234
0.200
0.182
0.170
0.154
0.136
0.122
0.096
JK250-400
0.528
0.468
0.400
0.364
0.340
0.308
0.272
0.244
0.192
JK250-600
0.792
0.702
0.600
0.546
0.510
0.462
0.408
0.366
0.288
JK250-800
1.056
0.936
0.800
0.728
0.680
0.616
0.544
0.488
0.384
2/5
J K250 SERIES
Test Procedures and Requirement
Items
Test Conditions
Accept/Reject Criteria
Resistance
In still air @25℃
Rmin ≤ R ≤ Rmax
Time to Trip
Specified current, Vmax, 25℃
T ≤ max. Time to trip (Ttrip)
Hold Current
60 min, at IH
No trip
Trip Cycle Life
Vmax, Imax, 100 cycles
No arcing or burning
Trip Endurance
Vmax, 24hours
No arcing or burning
Typical Time-to-Trip Charts @25℃
1000
Time to Trip (s)
100
N
10
L
K
J
I
1
H
G
F
E
D
C
B
A
0.1
0.01
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Fault Current (A)
Storage Recommendations
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Storage Temperature: -10℃~+40℃
Relative Humidity: ≤80%RH
Keep away from corrosive atmosphere and sunlight.
Period of Storage: 1 year.
3/5
A=JK250-030
B=JK250-040
C=JK250-060
D=JK250-080
E=JK250-090
F=JK250-110
G=JK250-120
H=JK250-145
I=JK250-180
J=JK250-200
K=JK250-400
L=JK250-600
N=JK250-800
J K250 SERIES
Wave Soldering Recommendation Parameters
300
Soldering
3~5s
250
245℃~260℃
200
150
100℃~130℃
100
Cooling
50
0
0
50
100
150
200
250
Time (s)
Conditions
Items
Pre-Heating Zone
Soldering Zone
Cooling Zone
Refer to the condition recommended by the flux manufacturer.
Maximum ramping rate should not exceed 4℃/sec.
Maximum solder temperature should not exceed 260℃
Forced cooling
Manual Soldering Recommendation Parameters
Items
Conditions
Soldering condition
The highest power of the manual soldering iron should be 30W or less, soldering
temperature should not be higher than 280℃.
Soldering time
The soldering time should be kept within 3 seconds, otherwise it might cause
insulation layer cracking, and increased part resistance.
Soldering position
The distance on the leads between the soldering point and bottom of the PPTC
body should be equal or greater than 4mm.
Other
The soldering iron should not contact the PPTC body except the leads. If the
soldering conditions are kept to lower temperature, less time and larger distance,
the outcome of the soldering will be better.
Notes: 1. Before using the device must be stored in the original bags, if the storage conditions do not guarantee,
the device may not be able to meet the given value.
2. The devices can’t used for reflow soldering.
4/5
J K250 SERIES
Mechanical Characteristics
Items
Specifications
Test Conditions/Methods
Tensile strength
No visible damage
1.0Kgf, 10 seconds
Bending strength
No visible damage
0.5Kgf, 90°, 3 times
Vibration
No visible damage
Freq: 10-55Hz, Amp: 0.75mm, 1min
Reliability Test
Items
Specifications
Solder ability
No visible damage,Solder OK,
Solder area ≥95%
245±5℃, 2±1s, dipping depth=0.5inch max
from the body
Resistance to
soldering heat
No visible damage,
Electrical OK, │△R/R0│≦50%
260±5℃, 10+2/-0s
Damp heat,
steady state
No visible damage, Electrical OK,
│△R/R0│≦20%
40±2℃, 90~95 % RH, total 48Hrs, after 4Hrs
test electrical parameter
Temperature
cycling
No visible damage, Electrical OK,
│△R/R0│≦20%
Ta=-10+0/-1℃ 30min, Ta=70+1/-0℃ 30min,
5cycles, after 1hr test electrical parameter
5/5
Test Conditions/Methods
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