nSMD150

Features Applications ■ Surface Mount Devices Almost anywhere there is a low voltage ■ Lead free device power supply, up to 60V and a load to be ■ Size 3.2*1.6 mm/0.12*0.06 inch protected, including: ■ Surface Mount packaging ■ Computer mother board, Modem. USB hub for automated assembly ■ PDAs & Charger, Analog & digital line card nSMD Series ■ Digital cameras, Disk drivers, CD-ROMs, Alpha-Top (Sea&Land Alliance) Performance Specification Maximum Pd Time To Trip Ihold Itrip @25°C @25°C Max. Current Time (Vdc) (A) (A) (A) (W) (A) (Sec) nSMD005 αZ 60.0 100 0.05 0.15 0.4 0.25 1.50 nSMD010 αN 60.0 100 0.10 0.25 0.4 0.50 1.00 nSMD012 αN 60.0 100 0.12 0.29 0.4 0.50 1.00 nSMD020 αA 24.0 100 0.20 0.46 0.6 8.00 0.08 16.0 100 0.25 0.50 0.6 8.00 0.08 nSMD025 αA 6.0 100 0.35 0.75 0.6 8.00 0.10 nSMD035 αB 6.0 100 0.50 1.00 0.6 8.00 0.10 nSMD050 αF 13.2 100 0.50 1.00 0.6 8.00 0.10 nSMD050-13.2V αF 6.0 100 0.75 1.50 0.6 8.00 0.20 nSMD075 αG 6.0 100 1.00 1.80 0.6 8.00 0.30 nSMD100 αH nSMD110 αH 6.0 100 1.10 2.20 0.6 8.00 0.30 nSMD150 αI 6.0 100 1.50 3.00 0.8 8.00 1.00 nSMD200 αK 6.0 100 2.00 3.50 0.8 8.00 1.50 Ihold = Hold Current. Maximum current device will not trip in 25°C still air. Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air. Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax). Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax). Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame. Model Marking Vmax Resistance Imax Environmental Specifications Test Conditions Passive aging +85°C, 1000 hrs. Humidity aging +85°C, 85% R.H. , 168 hours Thermal shock +85°C to -40°C, 20 times Resistance to solvent MIL-STD-202,Method 215 Vibration MIL-STD-202,Method 201 Ambient operating conditions : - 40 °C to 85 °C Maximum surface temperature of the device in the tripped state is 125 °C Rimin () 3.600 1.600 1.600 0.350 0.350 0.250 0.150 0.150 0.090 0.055 0.050 0.040 0.018 Resistance change ±5% typical ±5% typical ±33% typical No change No change E201504(Alpha-Top)/E319079(Sea&Land) Agency Approvals : ` NO. R-50141892 Regulation/Standard: 2002/95/EC EN14582 Ihold Versus Temperature Model nSMD005 nSMD010 nSMD012 nSMD020 nSMD025 nSMD035 nSMD050 nSMD050-13.2V nSMD075 nSMD100 nSMD110 nSMD150 nSMD200 Maximum ambient operating temperature (T mao) vs. hold current (Ihold) -40°C 0.074 0.148 0.18 0.30 0.37 0.50 0.71 0.71 1.14 1.45 1.60 2.18 2.88 -20°C 0.066 0.132 0.16 0.26 0.33 0.45 0.64 0.64 1.01 1.31 1.45 1.94 2.63 0°C 0.058 0.116 0.14 0.23 0.29 0.40 0.57 0.57 0.88 1.15 1.30 1.72 2.34 25°C 0.05 0.10 0.12 0.20 0.25 0.35 0.50 0.50 0.75 1.00 1.10 1.50 2.00 40°C 0.0425 0.085 0.10 0.17 0.22 0.30 0.42 0.42 0.65 0.84 0.95 1.28 1.74 50°C 0.038 0.075 0.09 0.15 0.20 0.27 0.39 0.39 0.59 0.77 0.80 1.17 1.58 第2页 60°C 0.035 0.07 0.08 0.14 0.17 0.24 0.35 0.35 0.54 0.69 0.72 1.06 1.42 70°C 0.03 0.06 0.07 0.12 0.15 0.21 0.31 0.31 0.49 0.61 0.66 0.96 1.17 85°C 0.0275 0.055 0.07 0.11 0.12 0.15 0.25 0.25 0.41 0.48 0.55 0.77 0.93 R1max () 50.000 15.000 15.000 2.700 2.500 1.300 0.700 0.700 0.500 0.270 0.250 0.130 0.080 Agency Approval UL TUV √ √ √ √ √ √ √ √ nSMD Series Alpha-Top (Sea&Land Alliance) Construction And Dimension (Unit:mm) A Model Min. 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 nSMD005 nSMD010 nSMD012 nSMD020 nSMD025 nSMD035 nSMD050 nSMD050-13.2V nSMD075 nSMD100 nSMD110 nSMD150 nSMD200 B Max. 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 C Min. 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 Max. 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 Dimensions & Marking Min. 0.60 0.60 0.60 0.40 0.40 0.40 0.35 0.35 0.40 0.40 0.40 0.50 0.50 E Min. 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Recommended Pad Layout (mm) A D 1.0 士0.1 1.9士0.1 1.0士0.1 H B D Min. 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 Max. 1.10 1.10 1.10 0.90 0.90 0.90 0.85 0.85 0.90 0.80 0.80 1.20 1.20 α = Trademark H = Part identification E C 2.0士0.1 Termination Pad Characteristics Terminal pad materials： Terminal pad solderability： Tin-plated Nickel-Copper Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Rework Use standard industry practices, the removal device must be replaced with a fresh one. Thermal Derating Curve Typical Time-To-Trip At 25°C Average Time Current Curves Derating Curves for nSMD Series 100 0.05A 140 0.10A 10 120 Time In Seconds Percentage of Derated Current 160 100 80 60 0.25A 0.35A 1 0.50A 0.75A 1.00A 0.1 40 1.50A 20 2.00A 0 -40 -20 0 20 40 60 80 0.01 0.1 Temperature (°C) 1 Current In Amperes · Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. · PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. · Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components. · Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC. · Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space. · Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices. PPTC SMD can be cleaned by standard methods. · Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or reflow profile could negatively impact solderability performance of our devices. 第3页 10 nSMD Series Alpha-Top (Sea&Land Alliance) Recommended Solder Reflow Conditions 300 250 200 190 Preheating Soldering Cooling ‧Recommended reflow methods：IR, vapor phase oven, hot air oven. ‧Devices are not designed to be wave soldered to the bottom side of the board. ‧Recommended maximum paste thickness is 0.25 mm (0.010 inch). ‧Devices can be cleaned using standard method and solvents. 160 100 0 Note：If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 60-120 sec. 30~60sec. Tape And Reel Specifications (mm) 120 sec. EIA Tape Component Dimensions Governing Specifications W P0 P1 P2 A0 B0 B1max. D0 F E1 E2min. Tmax. T1max. K0 Leader min. Trailer min. Reel Dimensions A max. N min. W1 W2 EIA 481-1 8.15 ± 0.3 4.0 ± 0.10 4.0 ± 0.10 2.0 ± 0.05 1.95 ± 0.10 3.45 ± 0.10 4.35 1.5 + 0.1, -0 3.5 ± 0.05 1.75 ± 0.10 6.25 0.6 0.1 1.04 ± 0.1 390 160 178 60 9 ± 0.5 12.6 ± 0.5 P0 T Embossment P2 D0 E1 Cover tape A0 B1 F K0 T1 W E2 B0 P1 EIA Reel Dimensions W2(measured at hub) N(hub dia.) A 0 Cover tape W1(measured at hub) Carrier tape Embossed cavity Storage And Handling ‧ Storage conditions：40°C max, 70% R.H. ‧ Devices may not meet specified performance if storage conditions are exceeded. Order Information Packaging 075 Hold Current nSMD Product name Size 3216 mm / 1206 inch SMD：surface mount device Tape & reel packaging per EIA481-1 Tape & Reel Quantity 005,010,012,150,200 020,025,035,050,075,100,110 0.75A Labeling Information Sea & Land Electronic Corp. Pb Model: Part no.: Spec.: Lot no.: Q'ty: 倉儲：密封！溫度：18～33℃/濕度：30～60％ A 第4页 RoHS 3,500 pcs/reel 5,000 pcs/reel