Features
Applications
■ Surface Mount Devices
Almost anywhere there is a low voltage
■ Lead free device
power supply, up to 15V and a load to be
■ Size 2.0*1.2 mm / 0.08*0.05 inch
protected, including:
■ Surface Mount packaging
■ Computer mother board, Modem. USB hub
for automated assembly
■ PDAs & Charger, Analog & digital line card
SMD0805 Series
■ Digital cameras, Disk drivers, CD-ROMs,
Alpha-Top (Sea & Land Alliance)
Performance Specification
Maximum
Pd
Ihold
Itrip
Time To Trip
Model
Marking
@25°C
@25°C
Typ.
Current
Time
(Vdc)
(A)
(A)
(A)
(W)
(A)
(Sec)
SMD0805-010
15.0
100
0.10
0.30
0.5
0.5
1.50
1
SMD0805-020
9.0
100
0.20
0.50
0.5
8.0
0.02
2
SMD0805-035
6.0
100
0.35
0.75
0.5
8.0
0.10
3
6.0
100
0.50
1.00
0.5
8.0
0.10
SMD0805-050
5
6.0
40
0.75
1.50
0.6
8.0
0.20
SMD0805-075
7
6.0
100
1.00
1.95
0.6
8.0
0.30
SMD0805-100
0
6.0
100
1.10
2.20
0.6
8.0
0.30
SMD0805-110
0
6.0
100
1.25
2.50
1.5
8.0
0.60
SMD0805-125
12
Ihold = Hold Current. Maximum current device will not trip in 25°C still air.
Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air.
Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax).
Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax).
Pd
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C.
R1max = Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Vmax
Imax
Environmental Specifications
Test
Conditions
Passive aging
+85°C, 1000 hrs.
Humidity aging
+85°C, 85% R.H. , 168 hours
Thermal shock
+85°C to -40°C, 20 times
Resistance to solvent
MIL-STD-202,Method 215
Vibration
MIL-STD-202,Method 201
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
Resistance
Rimin
()
1.000
0.650
0.250
0.150
0.090
0.060
0.060
0.030
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
E201504(Alpha-Top)/E319079(Sea&Land)
Agency Approvals :
NO. R-50141892
Regulation/Standard:
2002/95/EC
EN14582
Ihold Versus Temperature
Model
SMD0805-010
SMD0805-020
SMD0805-035
SMD0805-050
SMD0805-075
SMD0805-100
SMD0805-110
SMD0805-125
Maximum ambient operating temperature (T mao ) vs. hold current (Ihold)
-40°C
0.14
0.28
0.47
0.68
1.00
1.35
1.45
1.65
-20°C
0.12
0.25
0.44
0.62
0.90
1.25
1.35
1.53
0°C
0.11
0.23
0.39
0.55
0.79
1.15
1.20
1.36
25°C
0.10
0.20
0.35
0.50
0.75
1.00
1.10
1.25
40°C
0.08
0.17
0.30
0.40
0.63
0.82
0.92
1.05
第2页
50°C
0.07
0.14
0.27
0.37
0.57
0.74
0.84
0.95
60°C
0.06
0.12
0.24
0.33
0.53
0.65
0.75
0.85
70°C
0.05
0.10
0.20
0.29
0.41
0.55
0.65
0.74
85°C
0.03
0.07
0.14
0.23
0.34
0.42
0.52
0.59
R1max
()
6.000
3.500
1.200
0.850
0.385
0.230
0.210
0.140
Agency Approval
UL
√
√
√
√
√
√
TUV
√
SMD0805 Series
Alpha-Top (Sea & Land Alliance)
Construction And Dimension (Unit:mm)
A
Model
Min.
SMD0805-010
2.00
SMD0805-020
2.00
SMD0805-035
2.00
SMD0805-050
2.00
SMD0805-075
2.00
2.00
SMD0805-100
2.00
SMD0805-110
2.00
SMD0805-125
Min.
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
Max.
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
Min.
0.50
0.50
0.50
0.30
0.50
0.50
0.50
0.50
Dimensions & Marking
A
Max.
1.00
1.00
1.00
0.60
1.10
1.10
1.10
1.20
E
Min.
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
Recommended Pad Layout (mm)
1.0 士0.1
1.5士0.1
1.0士0.1
1
B
D
Min.
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
C
B
Max.
2.20
2.20
2.20
2.20
2.20
2.20
2.20
2.20
1 = Part identification
D
E
Termination Pad Characteristics
Terminal pad materials:
Terminal pad solderability:
1.2士0.1
C
Tin-plated Nickel-Copper
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
Rework
Use standard industry practices, the removal device must be replaced with a fresh one.
Thermal Derating Curve
Typical Time-To-Trip At 25°C
Derating Curves for SMD0805 Series
Average Time Current Curves
Time In Seconds
Percentage of Derated Current
0.10A
0.20A
1000
160
140
120
100
80
60
40
20
0.35A
100
0.50A
10
0.75A
1
1.00A
0.1
1.10A
1.25A
0.01
0
-40
-20
0
20
40
60
0.1
80
1
Temperature (°C)
Current In Amperes
· Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
· PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are
anticipated.
· Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components.
· Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.
· Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
· Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices. PPTC SMD can be cleaned by standard
methods.
· Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or reflow profile could negatively impact solderability
performance of our devices.
第3页
10
SMD0805 Series
Alpha-Top (Sea & Land Alliance)
Recommended Solder Reflow Conditions
300
Preheating
Soldering
‧Recommended reflow methods:IR, vapor phase oven, hot air oven.
Cooling
‧Devices are not designed to be wave soldered to the bottom side
250
of the board.
200
‧Recommended maximum paste thickness is 0.25 mm (0.010 inch).
190
‧Devices can be cleaned using standard method and solvents.
160
Note:If reflow temperatures exceed the recommended profile,
100
0
devices may not meet the performance requirements.
60-120 sec.
30~60sec.
120 sec.
EIA Tape Component Dimensions
Tape And Reel Specifications (mm)
P0
Governing Specifications
W
P0
P1
P2
A0
B0
B1max.
D0
F
E1
E2min.
T
T1max.
K0
Leader min.
Trailer min.
Reel Dimensions
A max.
N min.
W1
W2
EIA 481-1
8.0 ± 0.3
4.0 ± 0.10
4.0 ± 0.10
2.0 ± 0.05
1.45 ± 0.10
2.30 ± 0.10
4.35
1.55 + 0.1, -0
3.5 ± 0.05
1.75 ± 0.10
6.25
0.25
0.1
0.74 ± 0.1
390
160
178
60
9.0 ± 0.5
12.0 ± 0.05
T
Embossment
P2
D0
E1
Cover tape
A0
F
B1
K0
B0
T1
W
E2
P1
EIA Reel Dimensions
W2(measured at hub)
N(hub dia.)
A
0
Cover tape
W1(measured at hub)
Carrier tape
Embossed cavity
Storage And Handling
‧ Storage conditions:40°C max, 70% R.H.
‧ Devices may not meet specified performance
if storage conditions are exceeded.
Order Information
Packaging
SMD0805
Product name
Size 2012 mm / 0805 inch
SMD:surface mount device
Tape & reel packaging per EIA481-1
010
Hold
Current
0.10A
Tape & Reel Quantity
075,100,110,125
The others
Labeling Information
Sea & Land Electronic Corp.
Pb
Model:
Part no.:
Spec.:
Lot no.:
Q'ty:
倉儲:密封!溫度:18~33℃/濕度:30~60% A
第4页
RoHS
4,000 pcs/reel
5,000 pcs/reel
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