Serial No. : 2014-1357
DATE : 2014/12/22
CRYSTAL OSCILLATOR
ITEM :
DSB221SDN
TYPE :
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26.000MHz
NOMINAL FREQUENCY :
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1XXB26000MAA
SPEC No. :
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RECEIPT
DATE
RECEIVED
(signature)
(name)
General Manufacture of Quartz Devices
1389 Shinzaike, Hiraoka-cho, Kakogawa, Hyogo
675-0194 Japan
Phone (81)79-425-3141 Fax (81)79-425-1134
http://www.kds.info/index_en.htm
C.ENG.
ENG.
Serial No.2014-1357
1. Device Name
TCXO
2. Model Name
DSB221SDN
3. Nominal Frequency
26.000 MHz
4. Mass
0.02g max.
5. Absolute Maximum Ratings
1
2
Item
Supply Voltage
Storage Temperature Range
Symbol
VCC
T_STG
Rating
-0.3~+4.6
-40~+85
unit
V
C
6. Recommended Operating Conditions
Item
1
Supply Voltage
Symbol
VCC
2
Load Impedance (resistance part)
(parallel capacitance)
Operating Temperature Range
LOAD_R
LOAD_C
T_OPR
3
min.
+1.71
+2.09
+2.66
9
9
-40
typ.
+1.8
+2.2
+2.8
10
10
-
max.
+1.89
+2.31
+2.94
11
11
+85
unit
V
kΩ
pF
C
7. Electrical Characteristics
(TA=-40~+85C, LOAD_R//C=10kΩ//10pF, VCC=+1.8V or +2.2V or +2.8V, unless otherwise noted)
Item
1
2
3
4
Current Consumption
Output Level
Symmetry
Frequency Stability
1.Tolerance
2.vs Temperature
3.vs Drift Rate/Slope
4.vs Hysteresys
5.vs Supply Voltage
6.vs Load Variation
7.vs Aging
5
6
7
G Sensitivity
Start Up Time
SSB Phase Noise
Conditions
GND level (DC cut)
After 2 times reflow
TA=-30~+85C
TA=-40~-30C
@ 0.3C/s
VCC=+1.8V±5%,+2.2V±5%,+2.8V±5%
LOAD_R//C=(10kΩ//10pF)±10%
TA=Room ambient
TA=Room ambient
TA=Room ambient
TA=Room ambient
Gamma Vector of all 3axes from 30 to 1500Hz
@90% of final VOUT level
Relative to f0 level offset 1Hz
Relative to f0 level offset 5Hz
Relative to f0 level offset 10Hz
Relative to f0 level offset 100Hz
Relative to f0 level offset 1kHz
Relative to f0 level offset 10kHz
Relative to f0 level offset 100kHz
min.
0.8
40/60
Limits
typ
-
-
-
-
-
max.
1.5
60/40
±1.5
±0.5
±1.0
±10.0
±0.6
±0.1
±0.1
±1.0
±1.5
±2.5
±5.0
±2.0
2.0
-50
-73
-80
-106
-134
-144
-152
unit
Notes
mA
VP-P
%
1
ppm
ppm
ppm
ppb/s
ppm
ppm
ppm
ppm/year
2,3
4
4
ppm/2years
ppm/5years
ppm/10years
ppb/G
ms
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Notes
1. Clipped sine wave (DC-coupled)
2. Ref. to nominal frequency
3. Please leave after reflow in 2h or more at room ambient.
4. Ref. to frequency (TA=+25C)
TITLE
Remark
DSB221SDN TYPE SPECIFICATION
Date
2014/12/22
Spec. No.
Rev.
1XXB26000MAA
DAISHINKU CORP.
-
Page
1/13
DM-Z0002: Style-010 Ver.1
Serial No.2014-1357
8. Outline, Pin Connections
Outline
Pin Connections
#4
Pin No.
#1
#2
#3
#4
#3
(1)
(2)
(3)
Connection
GND
GND
Output
VCC
Marking
(4)
#1
#2
#1 Index
(1) Model code
BN
(2) Frequency
26.0 (MHz, 3digits)
(3) Logo
D
(4) Date code
Year (1digit) +Week (2digits)
401
e.g.2014/1/1
unit: mm
Dimensional Tolerance: ±0.15
(Unless otherwise noted)
#1
#2
#4
#3
9. Measurement Circuit
1000pF
T.P.
mA
Power
Supply
#3
#4
+
10000pF
TCXO
V
-
Output
Vcc
GND
#1
GND
LOAD_R
#2
LOAD_C
LOAD_R=10kΩ
LOAD_C=10pF (Include Jig stray capacitance)
TITLE
Remark
DSB221SDN TYPE SPECIFICATION
Date
2014/12/22
Spec. No.
Rev.
1XXB26000MAA
DAISHINKU CORP.
-
Page
2/13
DM-Z0002: Style-010 Ver.1
Serial No.2014-1357
10. Mechanical Characteristics
All test is performed after 3times reflow (Clause.13) except 10.10 (Resistance to soldering heat)
Item
1
2
3
4
5
Drop
Vibration
Shock
PCB bend
strength
Adherence nature
6
Package strength
7
Gross leak
8
Fine leak
9
Solderability
10
Resistance to
soldering heat
Description
Requirements
Natural drop (On concrete)
Mounting on the set or test fixture.(Total weight 100g)
Height : 150cm
Direction : X,Y,Z, 6directions
Test cycle : 3cycles
Reference specification : EIAJ-ED-4702A Method5
Sweep range : 10~500Hz
Sweep speed : 11min/cycle
Amplitude : 1.5mm (10~55Hz)
2
Acceleration : 200m/s (55~500Hz)
Direction : X,Y,Z, 3directions
Test cycle : 10cycles
Reference specification : IEC 60068-2-6
2
Acceleration : 1000m/s
Direction : X,Y,Z, 6directions
Duration : 6ms
Test cycle : 3cycles/each directions
Reference specification : IEC 60068-2-27
PWB : t=1.6mm
Pressure speed : 1.0mm/s
Bend width : 1 2 3mm
Duration : 10±1s
Reference specification : IEC 60068-2-21 Ue1
PWB : t=1.6mm
Direction : X,Y, 2directions
Pressure : 10N
Duration : 10±1s
Reference specification : IEC 60068-2-21 Ue3
Pressure : 10N
Duration : 10±1s
Reference specification : IEC 60068-2-77
It is immersed for 3min into +125±5C
Chlorofluorocarbon (CFCs) liquid.
Reference specification : IEC 60068-2-17
It shall be measured by the helium leak detector
after pressurization for 60min by the pressure
5
of (3.92±0.49) x10 Pa in a helium gas atmosphere.
Reference specification : IEC 60068-2-17
Solder bath temperature : +245±5C
Duration : 3±0.3s
Reference specification : IEC 60068-2-58
1) Solder iron method
Bit size : B(φ3) Bit temperature : +350±10C
Duration : 3+1/-0s /each terminal
It shall be measured after 2h at room temperature,
humidity. Reference specification : IEC 60068-2-20
2) Reflow
In refer to temperature profile shown in clause13.
Test cycle : 3cycles
It shall be measured after 2h at room temperature,
humidity. Reference specification : IEC 60068-2-58
TITLE
df/f=
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