BAT54
Small signal Schottky diodes
Datasheet production data
Features
Low conduction and reverse losses
Negligible switching losses
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Low forward and reverse recovery times
Extremely fast switching
62'
Surface mount device
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Low capacitance diode
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Description
ECOPACK®2 compliant component
62'
The BAT54 series uses 40 V Schottky barrier
diodes packaged in SO123, SOD323, SOD523,
SOT-23, or SOT-323.
62'
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Table 1. Device summary
Symbol
Value
IF
300 mA
VRRM
40 V
C (typ)
7 pF
Tj (max)
150 °C
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June 2016
This is information on a product in full production.
DocID5505 Rev 12
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Characteristics
1
BAT54
Characteristics
Table 2. Absolute ratings (limiting values at Tj = 25 °C, unless otherwise specified)
Symbol
VRRM
IF
Parameter
Value
Unit
Repetitive peak reverse voltage
40
V
Continuous forward current
300
mA
1.25
A
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
Tstg
Storage temperature range
-65 to +150
°C
Tj
Operating junction temperature range
-40 to +150
°C
TL
Maximum soldering temperature
260
°C
Value
Unit
Table 3. Thermal parameters
Symbol
Rth(j-a)
Parameter
Junction to ambient(1)
SOT-23, SOD-123
500
SOT-323, SOD323
550
SOD-523
600
°C/W
1. Epoxy printed circuit board with recommended pad layout
Table 4. Static electrical characteristics
Symbol
IR(1)
VF(2)
Parameter
Test conditions
Reverse leakage current
Tj = 25 °C
Tj = 100 °C
Forward voltage drop
Tj = 25 °C
Min.
Typ.
Max.
Unit
1
VR = 30 V
µA
100
IF = 0.1 mA
240
IF = 1 mA
320
IF = 10 mA
400
IF = 30 mA
500
IF = 100 mA
900
mV
1. Pulse test: tp = 5 ms, < 2%
2. Pulse test: tp = 380 µs, < 2%
Table 5. Dynamic characteristics
Symbol
2/15
Parameter
Test conditions
C
Diode capacitance
VR = 1 V, F = 1 MHz
trr
Reverse recovery time
IF = 10 mA, IR = 10 mA, Tj = 25 °C
Irr = 1 mA, RL = 100
DocID5505 Rev 12
Min.
Typ. Max. Unit
7
10
pF
5
ns
BAT54
Characteristics
Figure 1. Average forward power dissipation
versus average forward current
0.35
P(W)
Figure 2. Average forward current versus
ambient temperature ( = 1)
0.35
δ=0.05
δ=0.2
0.30
0.30
0.25
0.25
0.20
0.20
0.15
0.15
T
0.10
0.05
δ=tp/T
IF(AV)(A)
T
0.10
0.05
δ=tp/T
tp
tp
T amb (°C)
0.00
0.00
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
Figure 3. Reverse leakage current versus
reverse applied voltage (typical values)
1.E+02
IF(AV)(A)
δ=1
δ=0.5
δ=0.1
0
25
50
75
100
125
150
Figure 4. Reverse leakage current versus
junction temperature
IR[T j] / IR[T j=25°C]
IR(µA)
1.E+04
VR=3V
Tj=100°C
1.E+03
1.E+01
1.E+02
Tj=50°C
1.E+00
1.E+01
Tj=25°C
1.E-01
1.E+00
T j(°C)
VR(V)
1.E-02
0
1.E-01
5
10
15
20
25
30
Figure 5. Junction capacitance versus reverse
applied voltage (typical values)
10
C(pF)
0
25
50
75
100
125
150
Figure 6. Forward voltage drop versus forward
current (typical values)
1.E+00
IFM(A)
Tj=100°C
F=1MHz
VOSC=30mVRMS
Tj=25°C
1.E-01
1.E-02
Tj=50°C
Tj=25°C
1.E-03
VR(V)
VFM(V)
1
1
10
Tj=-40 °C
100
1.E-04
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3
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Characteristics
BAT54
Figure 7. Thermal resistance junction to
ambient versus copper surface under each lead
(SOD323)
600
Rth(j-a) (°C/W)
Figure 8. Relative variation of thermal
impedance junction to ambient versus pulse
duration (SOD323)
1.E+00
Zth(j-a) /Rth(j-a)
Single pulse
SOD323
Epoxy FR4
eCU=35 µm
500
1.E-01
400
1.E-02
300
SCU(mm²)
tP(s)
200
0
5
10
15
20
25
30
35
40
45
50
Figure 9. Relative variation of thermal
impedance junction to ambient versus pulse
duration (SOT23)
1.E+00
Epoxy FR4
SCU=2.25 mm²
eCU=35 µm
Zth(j-a) /Rth(j-a)
1.E-03
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 10. Relative variation of thermal
impedance junction to ambient versus pulse
duration (SOD-523)
1.E+00
Zth(j-a) /Rth(j-a)
Single pulse
SOT23
Single pulse
SOD523
1.E-01
1.E-01
1.E-02
Alumine substrate
10 x 8 x 0.5 mm
tP(s)
1.E-02
1.E-03
4/15
1.E-02
1.E-01
tP(s)
1.E+00
1.E+01
1.E+02
1.E-03
1.E-03
DocID5505 Rev 12
1.E-02
1.E-01
Epoxy FR4
eCU=35 µm
1.E+00
1.E+01
BAT54
2
Package information
Package information
Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. SOD123 dimension definitions
+
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Package information
BAT54
Table 6. SOD123 dimension values
Dimensions
Ref.
Millimeters
Min.
Typ.
A
Inches
Max.
Min.
Typ.
1.45
A1
0
0.10
A2
0.85
1.35
0.057
0
0.033
0.004
0.053
b
0.55
0.022
c
0.15
0.039
D
2.55
2.85
0.1
0.112
E
1.4
1.70
0.055
0.067
G
0.25
H
3.55
0.01
3.75
0.14
0.148
Figure 12. SOD123 footprint dimensions in mm (inches)
6/15
Max.
DocID5505 Rev 12
BAT54
Package information
Figure 13. SOD323 dimension definitions
+
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E
(
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'
F
4
/
Table 7. SOD323 dimension values
Dimensions
Ref.
Millimeters
Min.
Typ.
A
Inches
Max.
Min.
Typ.
1.17
Max.
0.046
A1
0
0.1
0
0.004
b
0.25
0.44
0.01
0.017
c
0.1
0.25
0.004
0.01
D
1.52
1.8
0.06
0.071
E
1.11
1.45
0.044
0.057
H
2.3
2.7
0.09
0.106
L
0.1
0.46
0.004
0.02
Q1
0.1
0.41
0.004
0.016
Figure 14. SOD323 footprint dimensions in mm (inches)
DocID5505 Rev 12
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15
Package information
BAT54
Figure 15. SOD-523 dimension definitions
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5
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F
/
/
Table 8. SOD-523 dimension values
Dimensions
Ref.
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.50
0.60
0.70
0.020
0.024
0.028
E
1.50
1.60
1.70
0.059
0.063
0.067
E1
1.10
1.20
1.30
0.043
0.047
0.051
D
0.70
0.80
0.90
0.028
0.031
0.035
b
0.25
0.35
0.010
0.014
c
0.07
0.20
0.003
0.008
L
0.15
0.25
0.006
L1
0.05
0.20
0.002
0.20
0.008
Figure 16. SOD-523 footprint dimensions in mm (inches)
8/15
DocID5505 Rev 12
0.010
0.008
BAT54
Package information
Figure 17. SOT23 dimension definitions
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F
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15
Package information
BAT54
Table 9. SOT23 dimension values
Dimensions
Ref.
Millimeters
Min.
Typ.
Inches
Max.
Min.
Typ.
A
0.89
1.4
0.035
0.055
A1
0
0.1
0
0.004
B
0.3
0.51
0.012
0.02
c
0.085
0.18
0.003
0.007
D
2.75
3.04
0.108
0.12
e
0.85
1.05
0.033
0.041
e1
1.7
2.1
0.067
0.083
E
1.2
1.75
0.047
0.069
H
2.1
3.00
0.083
0.118
L
S
0.6
0.35
0.024
0.65
0.014
0.026
Figure 18. SOT23 footprint dimensions in mm (inches)
10/15
Max.
DocID5505 Rev 12
BAT54
Package information
Figure 19. SOT-323 dimension definitions
$
(
H
'
E
$
F
ș
/
+
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Package information
BAT54
Table 10. SOT-323 dimension values
Dimensions
Ref.
Millimeters
Min.
Typ.
Inches
Max.
Min.
Typ.
A
0.8
1.1
0.031
0.043
A1
0.0
0.1
0.0
0.004
b
0.25
0.4
0.010
0.016
c
0.1
0.26
0.004
0.010
D
1.8
2.0
2.2
0.071
0.079
0.086
E
1.15
1.25
1.35
0.045
0.049
0.053
e
0.6
0.65
0.7
0.023
0.026
0.027
H
1.8
2.1
2.4
0.071
0.083
0.094
L
0.1
0.2
0.3
0.004
0.008
0.012
q
0
30°
0
30°
Figure 20. SOT-323 footprint dimensions in mm (inches)
12/15
Max.
DocID5505 Rev 12
BAT54
3
Ordering information
Ordering information
Figure 21. Ordering information scheme
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Table 11. Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
BAT54FILM
D86
SOT-23 Single
10 mg
3000
Tape and reel
BAT54SFILM
D88
SOT-23 Serial
10 mg
3000
Tape and reel
BAT54CFILM
D87
SOT-23
Common cathode
10 mg
3000
Tape and reel
BAT54AFILM
D84
SOT-23
Common anode
10 mg
3000
Tape and reel
BAT54WFILM
D73
SOT-323 Single
6 mg
3000
Tape and reel
BAT54SWFILM
D78
SOT-323 Serial
6 mg
3000
Tape and reel
BAT54CWFILM
D77
SOT-323
Common cathode
6 mg
3000
Tape and reel
BAT54AWFILM
D74
SOT-323
Common anode
6 mg
3000
Tape and reel
BAT54JFILM
86
SOD-323
5 mg
3000
Tape and reel
BAT54JFILM-HQ
86
SOD-323
5 mg
10000
Tape and reel
BAT54KFILM
86
SOD-523
1.4 mg
3000
Tape and reel
BAT54ZFILM
D72
SOD-123
10 mg
3000
Tape and reel
DocID5505 Rev 12
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15
Revision history
4
BAT54
Revision history
Table 12. Document revision history
14/15
Date
Revision
Changes
Jun-1999
8
Last update.
24-Jul-2006
9
BAT54, A, C, S and BAT54J / W / AW / CW /SW datasheets merged.
ECOPACK statement added. SOD-123, SOD-523 and SOT-666
packages added.
13-Oct-2009
10
Updated Table 8 quote “L1” from 0.10 to 0.05.
02-Feb-2015
11
Updated Figure 22 for product in end of life. Removed SOT-666
package information and reformatted to current standard.
28-Jun-2016
12
Updated Table 11.
DocID5505 Rev 12
BAT54
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ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2016 STMicroelectronics – All rights reserved
DocID5505 Rev 12
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