ABS210

ABS22 THRU ABS210 SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIERS Voltage Range - 200 to 1000 Volts Current - 2.0 Ampere FEATURES ABS Ideal for printed circuit board Reliable low cost construction utilizing molded plastic technique High temperature soldering guaranteed: 260 /10 seconds at 5 lbs., (2.3kg) tension Small size, simple installation High surge current capability Glass passivated chip junction MECHANICAL DATA Case: Molded plastic body Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: Polarity symbols marked on case Mounting Position: Any Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load, for capacitive load derate current by 20%. MDD Catalog Number Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current On glass-epoxy P.C.B.(Note1) On aluminum substrate(Note2) Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage drop per leg at 0.4A Maximum DC reverse current TA=25 at rated DC blocking voltage TA=100 Typical thermal resistance(NOTE 3) Operating temperature range storage temperature range SYMBOLS VRRM VRMS VDC ABS22 200 140 200 ABS24 400 280 400 ABS26 ABS28 600 420 600 800 560 800 ABS210 UNITS 1000 700 1000 VOLTS VOLTS VOLTS IF(AV) 2.0 Amps IFSM 60 Amps VF 1.1 Volts R JL 5.0 500 25 R JA 40 IR TJ TSTG uA uA /W -55 to +150 -55 to +150 NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads 2.On aluminum substrate P.C.B. with on area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad 3.Thermal resistance form junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm) copper pads. RATINGS AND CHARACTERISTIC CURVES ABS22 THRU ABS210 The cruve graph is for reference only, can't be the basis for judgment(曲线图仅供参考)!