UDD32C03L01

UDD32CXXL01 SERIES Electrostatic Discharged Protection Devices (ESD) Data Sheet Description The series are an ultra low capacitance TVS array designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to data an trans-mission lines from overvoltage caused by electrostatic discharge (ESD), cable discharge events (CDE) and lightning. The unique design incorporates surge rated, low capacitance steering diodes and a TVS diode in a single package. During transient conditions, the steering diodes direct the transient current to ground. The internal TVS diode clamps the transient voltage to a safe level. The ultra low capacitance array configuration allows the user to protect up to the high speed data lines. These devices are in a signal package, RoHS/WEEE compliant, SOD-323 package. It measures 2.5×1.25×1.0mm. The series devices may be used to meet the immunity requirements of IEC61000-4-2 (ESD), IEC61000-4-4 (EFT) and IEC61000-4-5 (Surge). Features ● ● ● ● ● ● ● ● ● ● ● ● IEC61000-4-2 ESD 15KV Air, 8KV contact compliance SOD-323 surface mount package Protects one I/O line Peak power dissipation of 350W under 8/20μs waveform Working voltage: 3.3V, 5V, 12V and 15V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology Lead Free/RoHS compliant Solder reflow temperature: Pure Tin-Sn, 260~270℃ Flammability rating UL 94V-0 Meets MSL level 1, per J-STD-020 Pin Configuration Applications ● ● ● ● ● USB 2.0 and USB 3.0 interface 10/100/1000 Ethernet Personal digital assistants (PDA) Serial ATA protection Digital visual interface (DVI) Revision：16-Jul-15 ● ● ● ● Wireless system devices Handhelds and notebooks Digital cameras RF interface www.brightking.com UDD32CXXL01 SERIES Maximum Ratings Rating Peak pulse power (tp=8/20μs waveform) Symbol Value Unit PPP 350 W ESD voltage (Contact discharge) ±8 VESD kV ESD voltage (Air discharge) ±15 Lead soldering temperature Storage & operating temperature range TL 260 ℃ TSTG ,TJ -55~+150 ℃ Electrical Characteristics (TJ=25℃) UDD32C03L01 (Marking: AC) Parameter Reverse stand-off voltage Reverse breakdown voltage Symbol Condition Min. Typ. VRWM Max. Unit 3.3 V VBR IBR=1mA 4 V Reverse leakage current IR VR=3.3V 5 μA Clamping voltage (tp=8/20μs) VC IPP=1A 7 V Clamping voltage (tp=8/20μs) VC IPP=5A 15 V Peak Pulse Current (tp=8/20μs) IPP 19 A Off state junction capacitance CJ 0Vdc,f=1MHz Symbol Condition 0.8 pF UDD32C05L01 (Marking: BC) Parameter Reverse stand-off voltage Reverse breakdown voltage Min. Typ. VRWM Max. Unit 5 V VBR IBR=1mA Reverse leakage current IR VR=5V 5 μA Clamping voltage (tp=8/20μs) VC IPP=1A 9.8 V Clamping voltage (tp=8/20μs) VC IPP=5A 18.3 V Peak Pulse Current (tp=8/20μs) IPP 17 A Off state junction capacitance CJ Revision：16-Jul-15 0Vdc,f=1MHz 6 V 0.8 pF www.brightking.com UDD32CXXL01 SERIES Electrical Characteristics (TJ=25℃) UDD32C12L01 (Marking: DC) Parameter Reverse stand-off voltage Reverse breakdown voltage Symbol Condition Min. Typ. VRWM Max. Unit 12 V VBR IBR=1mA 13.3 V Reverse leakage current IR VR=12V 1 μA Clamping voltage (tp=8/20μs) VC IPP=1A 19 V Clamping voltage (tp=8/20μs) VC IPP=5A 28.6 V Peak Pulse Current (tp=8/20μs) IPP 7 A Off state junction capacitance CJ 0Vdc,f=1MHz Symbol Condition 0.8 pF UDD32C15L01 (Marking: EC) Parameter Reverse stand-off voltage Reverse breakdown voltage Min. Typ. VRWM Max. Unit 15 V VBR IBR=1mA Reverse leakage current IR VR=15V 1 μA Clamping voltage (tp=8/20μs) VC IPP=1A 24 V Clamping voltage (tp=8/20μs) VC IPP=5A 35 V Off state junction capacitance CJ 0Vdc,f=1MHz Revision：16-Jul-15 16.7 V 0.8 pF www.brightking.com UDD32CXXL01 SERIES Typical Characteristics Curves Figure 1. Power Derating Curve Figure 2. Pulse Waveform 110 100 tr Peak value Ipp Waveform Parameters: tr=8µs td=20µs 90 80 70 60 50 40 td=t|PP/2 30 20 10 0 0 5 10 15 20 25 30 t-Time (μs) Figure 3. Non-Repetitive Peak Pulse vs Pulse Time Figure 4. ESD Clamping (8kV Contact IEC61000-4-2) PPP-Peak Pusle Power (W) 10000 1000 100 10 0.1 1 10 100 1000 10000 tp-Pulse Duration (μs) Revision：16-Jul-15 www.brightking.com UDD32CXXL01 SERIES Recommended Soldering Conditions Reflow Soldering Recommended Condition Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3℃/second max. Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (ts) 150℃ 200℃ 60-180 seconds TS max to TL -Ramp-up Rate 3℃/second max. Time maintained above: -Temperature (TL) -Time (tL) 217℃ 60-150 seconds Peak Temperature (TP) 260℃ Time within 5℃ of actual Peak Temperature (tP) Ramp-down Rate Time 25℃ to Peak Temperature Revision：16-Jul-15 20-40 seconds 6℃/second max. 8 minutes max. www.brightking.com UDD32CXXL01 SERIES Dimensions (SOD-323) G E Dimension Symbol X H 1 2 F A D B C detail X Millimeters Inches Min. Max. Min. Max. A 0.80 1.10 0.031 0.043 B - 0.10 - 0.004 C 0.20 - 0.008 - D 0.11 0.20 0.004 0.008 E 1.15 1.35 0.045 0.053 F - 0.35 - 0.014 G 1.60 1.80 0.063 0.071 H 2.40 2.60 0.094 0.102 Packaging F B0 B Reel W E Tape Symbol Dimension (mm) W 8.00±0.30 P0 4.00±0.10 P1 4.00±0.10 P2 2.00±0.10 D0 Φ1.55±0.10 D1 Φ1.00±0.05 E 1.75±0.10 F 3.50±0.10 A 1.48±0.10 A0 0.80±0.10 B 3.00±0.10 B0 1.80±0.10 K 1.05±0.10 t 0.25±0.05 D Φ178.0±2.0 D2 Φ13.0 W1 9.5 Quantity: 3000PCS Revision：16-Jul-15 www.brightking.com