CD4148WTP

CHIP DIODE Switching Diode CD4148WTP 1:6 Switching Diode CD4148WTP FEATURES „ „ „ „ Silicon epitaxial planar diode SMD chip pattern, available in various dimension included 1206 & 0805 Leadfree and RoHS compliance components For small signal switching and operating ambient temperature less than 55oC and voltage withstand less than 60V; not suitable for AC switching input as rectified circuit and high reverse voltage location MECHANICAL CHARACTERISTICS „ „ „ Size: 0603 Weight: approx. 4mg Marking: Cathode terminal DIMENSIONS Dimension/mm 0603 L W T C 1.55±0.1 0.80±0.1 0.65±0.1 0.35±0.1 THERMAL CHARACTERISTICS1) Parameter at Tamb=25oC1) Symbol Forward Power Dissipation Power derating above 25oC Ptot Junction Temperature Thermal Resistance Junction to Ambient air Operating& Storage Temperature range Tj RθJA Tstg Value Unit 200 mW 1.6 mW/ oC 150 375 -55 to 150 o C C/W o C o 1) Valid provided that electrodes are kept at ambient temperature. www.lizgroup.com Ref No: CD4148WTP V3.2 NOV 25, 2009 CHIP DIODE Switching Diode CD4148WTP 2:6 MAXIMUM RATING1) Parameter at Tamb=25oC1) Symbol Value Unit VRRM 75 V IF(AV) 100 mA IFRM 200 mA 400 mA 800 mA Value Unit 1.0 MAX 1.25 MAX 0.025 MAX 5 MAX 4 MAX 4 MAX V V uA uA pF ns Repetitive Peak Reverse Voltage Average rectified current sin half wave rectification with resistive load Repetitive Peak Forward Current at Tamb=25°C Non-Repetitive Surge Forward Current at t95% area tin covered Resistance to Soldering Heat Sn bath at 260±5oC for 10±2s VF,VR & IR within spec; no mechanical damage Humidity Steady State At 85oC 85%RH for 168hrs VF,VR & IR within spec Continue Forward Operating Life At 25oC IF =1.1IF for 1000hrs VF,VR & IR within spec o o Thermal Shock -55 ±5 C/5min to 150±5 C/5min for 10cycles VF,VR & IR within spec Bending Strength Bending up to 2mm for 1cycle VF,VR & IR within spec; no mechanical damage www.lizgroup.com Ref No: CD4148WTP V3.2 NOV 25, 2009 CHIP DIODE Switching Diode CD4148WTP 4:6 APPLICATIONS „ „ Function: suit for small signal switching application Typical Application circuit: „ Typical Product field: General application except high reverse voltage location „ Soldering Condition: Soldering Condition & Caution ■ Recommended Soldering Condition (Refer to IPC/JEDEC J-STD-020D 4-1&5.2) Recommended Profile Condition Ramp-up rate (from pre-heat stage) Pre-heat Temperature & Time Soldering Temperature & Time Peak Temperature Time within 5oC of peak temperature Ramp-down rate Time 25oC to peak temperature Sn-Pb Soldering o