HX9193-33GB

HX9193 600mA,Ultra-low noise, Ultra-Fast CMOS LDO Regulator General Description Features The HX9193 is designed for portable RF and wireless  Ultra-Low-Noise for RF Application applications with demanding performance and space  2.5V- 6.0V Input Voltage Range requirements. The HX9193 performance is optimized  Low Dropout : 360mV @ 600mA for battery-powered systems to deliver ultra low noise  High PSSR:-65dB at 1KHz and low quiescent current. Regulator ground current  < 0.01uA Standby Current When Shutdown increases only slightly in dropout, further prolonging  Ultra-Fast Response in Line/Load transient the battery life. The HX9193 also works with low-ESR  Current Limiting and Thermal Shutdown ceramic capacitors, reducing the amount of board space necessary for power applications, critical in Protection hand-held wireless devices. The HX9193 consumes Applications less than 0.01µA in shutdown mode and has fast  Portable Media Players/MP3 players turn-on time less than 20µs. The other features include  Cellular and Smart mobile phone ultra low dropout voltage, high output accuracy,  Sensor Module, RF Module current limiting protection, and high ripple rejection ratio. It is available in the 5-lead of SOT23-5 packages. Typical Application Circuit Order Information HX9193 □ □ □ □ □ F: Pb-Free Package Type B5: SOT23-5 Output Type 12: 1.2V 15: 1.5V 18: 1.8V Marking Information 25: 2.5V Device 28: 2.8V HX9193 Marking Package Shipping SOT23-5 3K/REEL 30: 3.0V 33: 3.3V 36: 3.6V Page 1 of 8 HX9193 Functional Pin Description Package Type Pin Configurations Top View / SOT23-5 SOT23-5 VIN 1 GND 2 EN 3 5 4 VOUT NC Pin Description Pin Name Description 1 VIN Power Input Voltage. 2 GND Ground. 3 EN 4 NC No connection. 5 VOUT Output Voltage. Chip Enable (Active High). Note that this pin is high impedance. There is an integrated pull low 1MΩ resistor connected to GND when the control signal is floating. Function Diagram EN VIN SHUTDOWN AND LOGIC CONTROL VREF + ERROR AMPLIFIER MOS DRIVER VOUT CURRENT-LIMIT AND THERMAL PROTECTION GND Page 2 of 8 HX9193 Absolute Maximum Ratings  Input Voltage to GND ------------------------------------------------------------------------------------- -0.3V to 6.5V  Other pin to GND ----------------------------------------------------------------------------------------------- -0.3V to 6V Power Dissipation, PD @ TA = 25°C  Maximum Power Dissipation ( PD,TA=25°C) ------------------------------------------------------------------- 0.5W Package Thermal Resistance  Thermal Resistance (JA) ---------------------------------------------------------------------------------------- 195℃/W  Thermal Resistance (JC ------------------------------------------------------------------------------------------- 60℃/W  Maximum Junction Temperature ---------------------------------------------------------------------------------- 150°C  Maximum Soldering Temperature (at leads, 10 sec) -------------------------------------------------------- 260°C  Storage Temperature Range ------------------------------------------------------------------------------- −65°C to 165°C ESD Susceptibility  HBM (Human Body Mode) --------------------------------------------------------------------------------------------- 2kV  MM(Machine-Mode) --------------------------------------------------------------------------------------------------- 200V Recommended Operating Conditions  Supply Input Voltage ------------------------------------------------------------------------------------------- 2.5V to 6V  Operation Junction Temperature Range ------------------------------------------------------------ -40°C to 125°C  Operation Ambient Temperature Range ------------------------------------------------------------- -40°C to 85°C Page 3 of 8 HX9193 Electrical Characteristics (VIN = VOUT + 0.8V, Cin = Cout = 1µF, TA = 25° C, unless otherwise specified) Parameter Symbol Test Conditions Min Typ. Max Units Output Voltage Accuracy ΔVOUT IOUT = 1mA −2 -- +2 % Output Current Iout VEN=VIN, VIN>2.5V 600 mA Current Limit ILIM RLOAD = 1Ω 800 mA Quiescent Current IQ VEN≥1.4V,Output floating 110 130 Dropout Voltage VDROP IOUT=100mA,VOUT> 2.8V 60 80 IOUT=600mA,VOUT> 2.8V 360 480 Line Regulation ΔVLINE Load Regulation ΔLOAD 1mA < IOUT < 300mA Standby Current ISTBY VEN = GND, Shutdown EN Input Bias Current IIBSD VEN = 5V Logic-Low EN Threshold Voltage Logic-High Voltage VIL VIH f = 1kHz Rejection Rate f = 10kHz Thermal Shutdown Temperature TSD 2 % 0.01 1 μA 4 6 μA 0.4 Shutdown Start-Up IOUT=200mA, Cout=1µF PSRR % VIN = 3V to 5.5V, VIN = 3V to 5.5V, mV 0.2 IOUT = 1mA 10Hz to 100kHz, Output Noise Voltage Power Supply VIN=(VOUT+1V) to 5.5V, μA VIN+ 1.4 V 0.3 100 Cout = 1µF, -65 IOUT = 10mA -55 150 uVRMS dB °C Page 4 of 8 HX9193 Typical Operating Characteristics Page 5 of 8 HX9193 Applications Information Like any low-dropout regulator, the external capacitors used with the HX9193 must be carefully selected for regulator stability and performance. Using a capacitor whose value is > 1µF on the HX9193 input and the amount of capacitance can be increased without limit. The input capacitor must be located a distance of not more than 0.5 inch from the input pin of the IC and returned to a clean analog ground. There is a special attention which is the input capacitance should not be less than output capacitance. Any good quality ceramic or tantalum can be used for this capacitor. Thermal Considerations Thermal and line-transient response. The output capacitor must meet both requirements for minimum amount of capacitance and ESR in all LDOs application. The HX9193 is designed specifically to work with low ESR ceramic output capacitor in space-saving and performance consideration. Using a ceramic capacitor limits power dissipation in HX9193 . When the operation junction temperature exceeds 150°C, the OTP circuit starts the thermal shutdown function turn the pass element off. The pass element turns on again after the junction temperature cools by 25°C. For continue operation, do not exceed absolute maximum operation junction temperature 125°C. The power dissipation definition in device is : PD = (VIN−VOUT) x IOUT + VIN x IQ The capacitor with larger value and lower ESR (equivalent series resistance) provides better PSRR protection The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : whose value is at least 1µF with ESR is > 25mΩ on the PD(MAX) = ( TJ(MAX) − TA ) /θJA HX9193 output ensures stability. The HX9193 still Where TJ(MAX) is the maximum operation junction works well with output capacitor of other types due to the wide stable ESR range. Output capacitor of larger capacitance can reduce noise and improve load transient response, stability, and PSRR. The output capacitor should be located not more than 0.5 inch from the VOUT pin of the HX9193 and returned to a clean analog ground. temperature 125°C, TA is the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification of HX9193 , where TJ(MAX) is the maximum junction temperature of the die (125°C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance (θJA is layout dependent) for SOT23-5 package is 195°C/W. PD(MAX) = (125°C−25°C) / 195°C = 500mW (SOT23-5) The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. When considering the thermal characteristic of PCB it may be larger than 500mW. Page 6 of 8 HX9193 Start-up Function Enable Function The HX9193 features an LDO regulator enable/disable function. To assure the LDO regulator will switch on, the EN turn on control level must be greater than 1.4 volts. The LDO regulator will go into the shutdown mode when the voltage on the EN pin falls below 0.4 volts. For to protecting the system, the HX9193 have a quick-discharge function. If the enable function is not needed in a specific application, it may be tied to VIN to keep the LDO regulator in a continuously on state. Page 7 of 8 HX9193 Packaging Information SOT23-5 Page 8 of 8