SHT30-ARP-B

Preliminary Data Sheet SHT3x-ARP Humidity and Temperature Sensor  Fully calibrated, linearized, and temperature compensated digital output  Wide supply voltage range, from 2.4 to 5.5 V  10 to 90% ratiometric analog voltage output  Typical accuracy of  2%RH and  0.3°C  Parallel measurement of temperature and humidity at separate pins  Tiny 8-Pin DFN package Product Summary SHT3x-ARP is the next generation of Sensirion’s temperature and humidity sensors. It builds on a new CMOSens® sensor chip that is at the heart of Sensirion’s new humidity and temperature platform. The SHT3x-ARP has increased intelligence, reliability and improved accuracy specifications compared to its predecessor. Its functionality includes enhanced signal processing, temperature and humidity can be read out at different pins. The DFN package has a footprint of 2.5 x 2.5 mm while keeping a height of 0.9 mm. This allows for integration of the SHT3x-ARP into a great variety of applications. Additionally, the wide supply voltage range of 2.4 to 5.5 V guarantees compatibility with diverse assembly situations. All in all, the SHT3xARP incorporates 15 years of knowledge of Sensirion, the leader in the humidity sensor industry. Benefits of Sensirion’s CMOSens® Technology  High reliability and long-term stability  Industry-proven technology with a track record of more than 15 years  Designed for mass production  High process capability  Low signal noise Content 1 Sensor Performance.............................................. 2 2 Specifications ........................................................ 4 3 Pin Assignment ..................................................... 5 4 Operation and Communication .............................. 5 5 Packaging.............................................................. 7 6 Shipping Package ................................................. 9 7 Quality ................................................................. 10 8 Ordering Information............................................ 10 9 Further Information .............................................. 10 www.sensirion.com Figure 1 Functional block diagram of the SHT3x-ARP. The sensor signals for humidity and temperature are factory calibrated, linearized and compensated for temperature and supply voltage dependencies. November 2014 - 0.9 1/11 Preliminary Data Sheet SHT3x-ARP 1 Sensor Performance 1.1 Humidity Sensor Performance Parameter SHT30 Accuracy tolerance1 SHT31 Accuracy tolerance1 Repeatability2 Resolution Integrated Non-Linearity3 Hysteresis Specified range4 Response time6 Long-term drift Conditions Value Units Typ. Max. Typ. Max. 3 Figure 2 2 Figure 4 0.2 14 0.2 0.8 0 to 100 8 2 s 80%RH). After returning into the normal temperature and humidity range the sensor will slowly come back to calibration state by itself. Prolonged exposure to extreme conditions may accelerate ageing. To ensure stable operation of the humidity sensor, the conditions described in the document “SHTxx Assembly of SMD Packages”, section “Storage and Handling Instructions” regarding exposure to volatile organic compounds have to be met. Please note as well that this does apply not only to transportation and manufacturing, but also to operation of the SHT3x-ARP. 8 Temperature response times strongly depends on the design-in of the sensor in the final application. Minimal response time can be achieved when the thermalized sensor at T1 is placed on a well conducting surface with temperature T2. www.sensirion.com November 2014 - 0.9 3/11 Preliminary Data Sheet SHT3x-ARP 2 2.1 Specifications Electrical Specifications Parameter Supply voltage Power-up/down level Symbol VDD VPOR Supply current IDD Output current AOIOUT Capacitive load CL Duration of reset pulse Condition Min Typ. Max 2.4 2.22 3.3 2.35 5.5 2.4 Average tRESETN V V A 217 -100 Units Comments 100 A 5 nF 350 ns At a measurement rate of 2 Hz. Depends on the resistive load on the output pins Capacitance that can be driven by the sensor on the signal lines See section 3.3 Table 3 Electrical specifications, Specification are at 25°C and typical VDD 2.2 Timing Specification for the Sensor System Parameter Power-up time Analog output settling time Symbol Conditions tPU After hard reset, VDD ≥ VPOR AOsettle For a step of VDD/2 Min. Typ. Max. 15 0.3 Units Comments Time between VDD reaching ms VPOR and first measurement signal available Time needed for adapting to a changing supply voltage and measurement value. Value ms depends on output load. Typical value is for a load of 1nF. Table 4 System Timing Specification, Specification are at 25°C and typical VDD 2.3 Absolut Minimum and Maximum Ratings Stress levels beyond those listed in Table 5 may cause permanent damage to the device or affect the reliability of the sensor. These are stress ratings only and functional operation of the device at these conditions cannot be guaranteed. Parameter Supply voltage VDD Max Voltage on pins (pin 1 (RH); pin 2 (R); pin 3 (R); pin 4(T); pin 6(nRESET)) Input current on any pin Operating temperature range Storage temperature range ESD HBM (human body model) ESD MM (machine model) ESD CDM (charge device model) Rating Units -0.5 to 6 -0.5 to VDD+0.5 V V ±100 -40 to 125 -40 to 150 4 200 750 mA °C °C kV V V Table 5 Absolut minimum and maximum ratings; values are target specs and not confirmed by measurements yet www.sensirion.com November 2014 - 0.9 4/11 Preliminary Data Sheet SHT3x-ARP 3 VDD Pin Assignment The SHT3x-ARP comes in a tiny 8-pin DFN package – see Table 6. Pin Name Comments 1 RH 2 R 3 R 4 5 T VDD 6 nRESET 7 R 8 VSS Analog voltage out; output No electrical function; recommended to connected to VSS No electrical function; recommended to connected to VSS Analog voltage out; output Supply voltage; input Reset pin active low; Input; if not used it is recommended to connect to VDD No electrical function; recommended to connected to VSS Ground 1 8 2 7 3 6 4 5 Power Pins (VDD, VSS) The electrical specifications of the SHT3x-ARP are shown in Table 3. The power supply pins must be decoupled with a 100 nF capacitor that shall be placed as close to the sensor as possible – see Figure 7 for a typical application circuit. 3.2 Temperature and Humidity Pin The physical output of temperature and humidity can be read out at separated pins, as shown in Table 6. Data is supplied as ratiometric voltage output, ranging from 10 to 90% of VDD. The specification of the Analog voltage signal and its conversion to physical values is explained in Section 4. 3.3 nRESET Pin The nReset pin may be used to generate a reset of the sensor. A minimum pulse duration of 350 ns is required to reliably trigger a reset of the sensor. If not used it is recommended to connect to VDD. www.sensirion.com VDD(5) 100nF T(4) RH(1) 0.1nF 0.1nF die VSS(8) pad R(2,3,7) Figure 7 Typical application circuit. Please note that the positioning of the pins does not reflect the position on the real sensor. This is shown in Table 6. 3.4 Die Pad (center pad) The die pad or center pad is visible from below and located in the center of the package. It is electrically connected to VSS. Hence electrical considerations do not impose constraints on the wiring of the die pad. However, due to mechanical reasons it is recommended to solder the center pad to the PCB. For more information on design-in, please refer to the document “SHTxx Design Guide”. Table 6 SHT3x-ARP pin assignment (Transparent top view). Dashed lines are only visible from the bottom. The die pad is internally connected to VSS. 3.1 nRESET(6) 4 Operation and Communication 4.1 Start-up of the sensor As a first step, the sensor needs to be powered up to VDD (between 2.4 and 5.5 V). After power-up, the sensor needs at most 15 ms for providing data as voltage output on the respective output pins. During that time the temperature and humidity pins have an undefined state. 4.2 Conversion of the Signal Output The physical values as measured by the sensor are mapped to a ratiometric voltage output (VX, x=T, RH as 10 to 90% of VDD). Prior to conversion into a voltage signal, the physical values are linearized and compensated for temperature and supply voltage effects by the sensor. Additionally, the voltage output is calibrated for each sensor. Hence the relationship between temperature and humidity and the voltage output is the same for each sensor, within the limits given by the accuracy. This allows to describe the relationship between physical values (RH and T) and the voltage output for temperature and humidity (VX, x=T, RH) through a generic linear formula shown in Equation 1 (for RH) and Equation 2 (for T), its graphical representation can be found in Figure 8 & Figure 9. November 2014 - 0.9 5/11 Relative Humidity (%) Preliminary Data Sheet SHT3x-ARP 100 90 80 70 60 50 40 30 20 10 0 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% Voltage out (VRH/VDD) Figure 8 Relationship between the ratiometric analog voltage output and the measured relative humidity RH  12.5  125  VRH 10 100 VRH    VDD 0.8 0.8 VDD 251 115 95 201 75 151 55 35 101 15 51 Temperature (°F) Temperature (°C) Equation 1 Relative humidity conversion formula (result in %RH): -5 1 -25 -45 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% -49 100% Voltage out (VT/VDD) Figure 9 Relationship between the ratiometric analog voltage output and the measured temperature T C   66.875  218.75  VT 17.5 175 VT   45    VDD 0.8 0.8 VDD T F    88.375  393.75  VT 31.5 315 VT   49    VDD 0.8 0.8 VDD Equation 2 Temperature conversion formula (result in °C and °F respectively) www.sensirion.com November 2014 - 0.9 6/11 Preliminary Data Sheet SHT3x-ARP 5 Packaging SHT3x-ARP sensors are provided in a DFN package. DFN stands for dual flat no leads. The humidity sensor opening is centered on the top side of the package. The sensor chip is made of silicon and is mounted to a lead frame. The latter is made of Cu plated with Ni/Pd/Au. Chip and lead frame are overmolded by an epoxy-based mold compound leaving the central die pad and I/O pins exposed for mechanical and electrical connection. Please note that the side walls of the sensor are diced and therefore these diced lead frame surfaces are not covered with the respective plating. 5.1 etc). The last three digits (BCD) represent an alphanumeric tracking code. That code can be decoded by Sensirion only and allows for tracking on batch level through production, calibration and testing – and will be provided upon justified request. If viewed from below pin 1 is indicated by triangular shaped cut in the otherwise rectangular die pad. The dimension of the triangular cut are shown in Figure 11 through the labels T1 & T2. SHT 3 x Traceability All SHT3x-ARP sensors are laser marked for easy identification and traceability. The marking on the sensor top side consists of a pin-1 indicator and two lines of text. The top line consist of the pin-1 indicator which is located in the top left corner and the product name. The small letter x stands for the accuracy class. The bottom line consists of 6 letters. The first two digits XY (=AR) describe the output mode. The third letter (A) represents the manufacturing year (4 = 2014, 5 = 2015, www.sensirion.com XYABCD Figure 10 Top View of the SHT3x-ARP illustrating the laser marking. . November 2014 - 0.9 7/11 Preliminary Data Sheet SHT3x-ARP 5.2 Package Outline T1 x T2 b E E2 e S D A L D2 Figure 11 Dimensional drawing of SHT3x-ARP sensor package Parameter Package height Leadframe height Pad width Package width Center pad length Package length Center pad width Pad pitch Pad length Symbol Min Nom. A A3 0.8 0.9 0.2 1 b D D2 E E2 e L S 0.2 2.4 1 2.4 1.7 0.25 2.5 1.1 2.5 1.8 0.5 0.35 0.3 2.6 1.2 2.6 1.9 0.3 Max Units Comments 0.4 1.5 mm mm mm mm mm mm mm mm mm mm Max cavity Center pad marking T1xT2 0.3x45° mm Not shown in the drawing Only as guidance. This value includes all tolerances, including displacement tolerances. Typically the opening will be smaller. indicates the position of pin 1 Table 7 Package outline 5.3 Land Pattern Figure 12 shows the land pattern. The land pattern is understood to be the metal layer on the PCB, onto which the DFN pads are soldered. The solder mask is understood to be the insulating layer on top of the PCB covering the copper traces. It is recommended to design the solder mask as a NonSolder Mask Defined (NSMD) type. For NSMD pads, the solder mask opening should provide a 60 μm to 75 μm design clearance between any copper pad and solder mask. As the pad pitch is only 0.5 mm we recommend to have one solder mask opening for all 4 I/O pads on one side. www.sensirion.com For solder paste printing it is recommended to use a laser-cut, stainless steel stencil with electro-polished trapezoidal walls and with 0.1 or 0.125 mm stencil thickness. The length of the stencil apertures for the I/O pads should be the same as the PCB pads. However, the position of the stencil apertures should have an offset of 0.1 mm away from the center of the package. The die pad aperture should cover about 70 – 90 % of the die pad area –thus it should have a size of about 0.9 mm x 1.6 mm. For information on the soldering process and further recommendation on the assembly process please consult the Application Note HT_AN_SHTxx_Assembly_of_SMD_Packages , which can be found on the Sensirion webpage. November 2014 - 0.9 8/11 Preliminary Data Sheet SHT3x-ARP land pattern stencil aperture sensor outline 0.25 1.6 0.5 0.4 0.45 0.5 0.375 1.7 0.5 0.375 0.5 0.25 0.5 0.5 0.3x45° 0.3 0.2 0.55 1 0.55 0.75 0.55 0.9 0.8 Figure 12 Recommended metal land pattern and stencil apertures for the SHT3x-ARP. The dashed lines represent the outer dimension of the DFN package. The PCB pads and stencil apertures are indicated through the shaded areas. 6 Shipping Package Ø1.5 +.1 /-0.0 4.00 2.00 ±.05 SEE Note 2 0.30 ±.05 Ø1.00 MIN 1.75 ±.1 4.00 SEE Note 1 A 5.50 ±.05 SEE NOTE 2 R 0.2 MAX. B0 B 12.0 +0.3/-0.1 A R 0.25 TYP. K0 A0 SECTION A - A A0 = 2.75 B0 = 2.75 K0 = 1.20 TOLERANCES - UNLESS NOTED 1PL ±.2 2PL ±.10 NOTES: 1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ±0.2 2. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED AS TRUE POSITION OF POCKET, NOT POCKET HOLE 3. A0 AND B0 ARE CALCULATED ON A PLANE AT A DISTANCE "R" ABOVE THE BOTTOM OF THE POCKET DETAIL B Figure 13 Technical drawing of the packaging tape with sensor orientation in tape. Header tape is to the right and trailer tape to the left on this drawing. Dimensions are given in millimeters. www.sensirion.com November 2014 - 0.9 9/11 Preliminary Data Sheet SHT3x-ARP 7 8 Quality Qualification of the SHT3x-ARP is performed based on the AEC Q 100 qualification test method. 7.1 This sensor cannot be ordered so far. Samples are available upon request. Please contact Sensirion. 9 Material Contents The device is fully RoHS and WEEE compliant, e.g. free of Pb, Cd, and Hg. Ordering Information Further Information For more in-depth information on the SHT3x-ARP and its application please consult the following documents: Document Name Description Source SHT3x Shipping Package Information on Tape, Reel and shipping bags (technical drawing and dimensions) Available upon request SHTxx Assembly of SMD Packages Assembly Guide (Soldering Instruction,) SHTxx Design Guide Design guidelines for designing SHTxx humidity sensors into applications SHTxx Handling Instructions Available for download at the Sensirion Guidelines for proper handling of SHTxx humidity humidity sensors download center: sensors (Reconditioning Procedure) www.sensirion.com/humidity-download Sensirion Humidity Sensor Specification Statement Definition of sensor specifications. Available for download at the Sensirion humidity sensors download center: www.sensirion.com/humidity-download Available for download at the Sensirion humidity sensors download center: www.sensirion.com/humidity-download Available for download at the Sensirion humidity sensors download center: www.sensirion.com/humidity-download Table 8 Documents containing further information relevant for theSHT3x-ARP. Revision History Date Version 0.9 www.sensirion.com Page(s) Changes Initial release November 2014 - 0.9 10/11 Preliminary Data Sheet SHT3x-ARP Headquarters and Subsidiaries SENSIRION AG Laubisruetistr. 50 CH-8712 Staefa ZH Switzerland Sensirion Inc., USA phone: +1 805 409 4900 info_us@sensirion.com www.sensirion.com Sensirion Korea Co. Ltd. phone: +82 31 337 7700 3 info@sensirion.co.kr www.sensirion.co.kr phone: +41 44 306 40 00 fax: +41 44 306 40 30 info@sensirion.com www.sensirion.com Sensirion Japan Co. Ltd. phone: +81 3 3444 4940 info@sensirion.co.jp www.sensirion.co.jp Sensirion China Co. Ltd. phone: +86 755 8252 1501 info@sensirion.com.cn www.sensirion.com.cn Sensirion AG (Germany) phone: +41 44 927 11 66 info@sensirion.com www.sensirion.com To find your local representative, please visit http://www.sensirion.com/contact www.sensirion.com November 2014 - 0.9 11/11