CD40106BMTR

CD40106BMTR

  • 厂商:

    HGSEMI(华冠)

  • 封装:

    TSSOP-14

  • 描述:

    通用逻辑门芯片 TSSOP-14 -0.5V 18V

  • 数据手册
  • 价格&库存
CD40106BMTR 数据手册
CD40106B The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright http://www.hgsemi.com.cn 1 2018 AUG CD40106B http://www.hgsemi.com.cn 2 2018 AUG CD40106B http://www.hgsemi.com.cn 3 2018 AUG
CD40106BMTR 价格&库存

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