HG1509-3.3M/TR

HG1509 150KHz, 2A PWM BUCK DC/DC CONVERTER Pin Assignments Description The HG1509 series are monolithic IC designed for a step- (Top View) down DC/DC converter, and own the ability of driving a 2A load without additional transistor. It saves board space. The external shutdown function can be controlled by logic level and then come into standby mode. The internal compensation makes feedback control having good line and load regulation without external design. Regarding protected VIN 1 Output 2 8 GND 7 GND HG1509 function, thermal shutdown is to prevent over temperature operating from damage, and current limit is against over current operating of the output switch. If current limit function occurs and VFB is down below 0.5V, the switching frequency FB 3 6 GND SD 4 5 GND will be reduced. The HG1509 series operates at a switching frequency of 150KHz thus allow smaller sized SOP-8L filter components than what would be needed with lower frequency switching regulators. Other features include a guaranteed +4% tolerance on output voltage under specified input voltage and output load conditions, and +15% on the oscillator frequency. The output version included fixed 3.3V, 5V, 12V, and an adjustable type. The chips are available in a standard 8-lead SOP-8 package. Features • Applications • • • Output Voltage: 3.3V, 5V, 12V and Adjustable Output Version • Adjustable Version Output Voltage Range, 1.23V to Simple High-Efficiency Step-Down Regulator On-Card Switching Regulators Positive to Negative Converter 18V+4% • 150KHz +15% Fixed Switching Frequency • Voltage Mode Non-Synchronous PWM Control • Thermal-Shutdown and Current-Limit Protection • ON/OFF Shutdown Control Input • Operating Voltage can be up to 22V • Output Load Current: 2A • SOP-8L Packages • Low Power Standby Mode • Built-in Switching Transistor On Chip • SOP-8L: Available in “Green” Molding Compound • Lead Free Finish/ RoHS Compliant (Note 1) (No Br, Sb) HTTP://WWW.HGSEMI.NET 1 2018 JUN HG1509 Typical Application Circuit (1) Fixed Type Circuit FB 12V DC Input 3 HG15093.3 1 VIN 4 SD CIN Capacitor 5 6 L1 47uH Output 3.3V/2A Output Load 2 Inductor 7 8 GND GND GND GND (2) Adjustable Type Circuit R2 1K D1 Schottky Diode Co Capacitor R1 1K FB 12V DC Input L1 39uH 3 VIN CIN Capacitor 1 HG1509 2 4 5 8 SD 6 7 Output 2.5V/2A Output Load Inductor D1 Schottky Diode GND GND GND GND VOUT = VFB × (1 + R1 Co Capacitor ) R2 VFB = 1.23V R2 = 1K ~ 3K (3) Delay Start Circuit R2 1K R1 1K FB 12V DC Input 3 VIN CDELAY 0.1uF 1 HG1509 2 4 5 8 SD CIN Capacitor 6 7 Output 2.5V/2A Output Load Inductor GND GND GND GND RDELAY 10K HTTP://WWW.HGSEMI.NET L1 39uH 2 D1 Schottky Diode Co Capacitor 2018 JUN HG1509 Pin Descriptions Pin Name VIN Output GND Description Operating voltage input Switching output Ground FB Output voltage feedback control SD ON/OFF Shutdown Functional Block Diagram SD VIN 200mV Current Source bias 1.235V Reference 2.5V Regulator 220mV Start up + Comp _ _ Comp + Frequecy compensation _ FB + Amp _ Predriver Comp + 2A Switch Output 150kH z OSC. HTTP://WWW.HGSEMI.NET 3 Thermal Shutdown GND 2018 JUN HG1509 Absolute Maximum Ratings Symbol Parameter Rating Unit KV ESD HBM Human Body Model ESD Protection ESD MM Machine Model ESD Protection 2 200 VIN Supply Voltage +24 V VSD ON/OFF Pin Input Voltage -0.3 to +18 V VFB Feedback Pin Voltage -0.3 to +18 V VOUT Output Voltage to Ground -1 V PD TST TJ Power Dissipation V Internally Limited Storage Temperature Operating Junction Temperature W -65 to +150 o -40 to +125 o C C Recommended Operating Conditions Symbol IOUT VOP TA Parameter Min 0 4.5 -20 Output Current Operating Voltage Operating Ambient Temperature HTTP://WWW.HGSEMI.NET 4 Max 2 22 85 Unit A V o C 2018 JUN HG1509 Electrical Characteristics Unless otherwise specified, VIN = 12V for 3.3V, 5V, adjustable version and VIN = 18V for the 12V version. ILOAD = 0.5A Specifications with boldface type are for full operating temperature range, the other type are for TJ = 25ºC. Symbol IFB Parameter Feedback Bias Current FOSC Oscillator Frequency FSCP Oscillator Frequency of Short Circuit Protect VSAT Saturation Voltage DC Max. Duty Cycle (ON) Min. Duty Cycle (OFF) ICL Current Limit IL IQ ISTBY VIL VIH IH IL θJA θJC Output Leakage Output = -1 Current Quiescent Current Standby Quiescent Current Output = 0 ON/OFF Pin Logic Input Threshold Voltage Conditions VFB = 1.3V (Adjustable version only) When current limit occurred and VFB < 0.5V, Ta = 25 oC IOUT = 2A No outside circuit VFB = 0V force driver on VFB = 0V force driver on VFB = 12V force driver off Peak current No outside circuit VFB = 0V force driver on No outside circuit VFB = 12V force driver off VIN = 22V VFB = 12V force driver off ON/OFF pin = 5V VIN = 22V Low (regulator ON) High (regulator OFF) ON/OFF Pin Logic Input VLOGIC = 2.5V (OFF) Current ON/OFF Pin Input Current VLOGIC = 0.5V (ON) Junction to Thermal Resistance SOP-8L case Thermal Resistance Junction to SOP-8L with a copper area of ambient 2 approximately 3 in HTTP://WWW.HGSEMI.NET 5 Min Typ. -10 127 110 150 10 30 Max -50 -100 173 173 Unit 50 KHz nA KHz 1.4 1.25 V 1.5 100 0 % 3 A -200 -5 5 70 2.0 1.3 uA mA mA 10 150 200 0.6 uA V -0.01 -0.1 uA -1 15 o 70 o C/W C/W 2018 JUN HG1509 Electrical Characteristics (Continued) Specifications with boldface type are for full operating temperature range, the other type are for TJ = 25ºC. Symbol Typ. VMax Unit 1.193 1.18 1.23 1.267 1.28 V 76 76 3.168 3.135 3.3 78 78 4.8 4.75 5 83 83 11.52 11.4 12 90 90 4.5V < VIN < 22V 0.2A < ILOAD < 2A VOUT programmed for 3V η Efficiency VIN = 12V, ILOAD=2A Output Voltage 4.75V < VIN < 22V 0.2A < ILOAD < 2A Efficiency VIN = 12V, ILOAD = 2A Output Voltage 7V < VIN < 22V 0.2A < ILOAD < 2A Efficiency VIN = 12V, ILOAD = 2A Output Voltage 15V < VIN < 22V 0.2A < ILOAD < 2A Efficiency VIN = 15V, ILOAD = 2A η VOUT η VOUT HG1509-12V VMin Output Feedback VOUT HG1509-5V Conditions VFB HG1509-ADJ HG1509-3.3V Parameter η HTTP://WWW.HGSEMI.NET 6 % 3.432 3.465 V % 5.2 5.25 V % 12.48 12.6 V % 2018 JUN HG1509 Typical Performance Characteristics HG1509 Efficiency vs. Temperature (VIN=12V, VOUT=3.3V, Io=2A) 86 85 84 83 82 81 80 79 78 77 76 75 81 80 79 Efficiency (%) Efficiency (%) HG1509 Efficiency vs. Temperature (VIN=12V, VOUT=5V, Io=2A) 78 77 76 75 74 73 -50 -30 -10 10 -50 -30 -10 10 30 50 70 90 110 130 150 Temperature (TA) (°C) 50 70 90 110 130 150 Temperature (TA) (°C) HG1509 Saturation Voltage vs. Temperature (VIN =12V, VFB=0V, VSD=0) HG1509 Switch Current Limit vs. Temperature (VIN=12V, VFB=0V) 1.4 Switch Current Limit (A) 5.5 1.3 Saturation Voltage (V) 30 1.2 2A 1.1 1A 1 0.5A 0.9 0.8 5 4.5 4 3.5 3 0.7 -50 -25 0 25 50 75 100 -50 125 Temperature (TA)　(°C) -30 -10 10 30 50 70 90 Temperature (TA) (°C) 15 14 13 12 11 10 9 8 7 6 5 60 Supply Current (uA) Supply Current (mA) HG1509 Supply Current vs. Temperature (VIN=12V, No Load, Von/off =0V(Switch ON) ,Von/off =5V(Switch OFF)) Switch ON 55 50 45 Switch OFF 40 35 30 -50 -30 -10 10 30 50 70 90 110 130 150 -50 -30 -10 10 50 70 90 110 130 150 Temperature (TA) (°C) Temperature (TA) (°C) HTTP://WWW.HGSEMI.NET 30 7 2018 JUN HG1509 Typical Performance Characteristics (Continued) HG1509 Threshold Voltage vs. Temperature (VIN=12V, Io=100mA) HG1509 ON/OFF Current vs. ON/OFF Voltage (VIN=12V) 1.7 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 1.5 ON/OFF Current (nA) Threshold Voltage (V) 1.6 1.4 1.3 1.2 1.1 1 0.9 0.8 -50 -30 -10 10 30 50 70 0 90 110 130 150 Temperature (TA) (°C) 6 9 12 15 18 21 ON/OFF Voltage (V) HG1509 Frequency vs. Temperature (VIN=12V, Io=500mA, VOUT=5V) HG1509 Feedback Current vs. Temperature (VIN=12V, VOUT=5V, Vfb=1.3V) 170 10 Feedback Current (nA) 165 Frequency (KHz) 3 160 155 150 145 140 0 -10 -20 -30 -40 -50 -50 -30 -10 10 30 50 70 90 110 130 150 -50 -30 -10 10 Temperature (TA) (°C) 30 50 70 90 110 130 150 Temperature (TA) (°C) V OUT (V) HG1509 Output Voltage vs. Temperature (VIN=12V, Io=2A) 3.5 3.45 3.4 3.35 3.3 3.25 3.2 3.15 3.1 3.05 3 2.95 2.9 -40 -20 0 20 40 60 80 100 120 140 160 Temperature (TA) (°C) HTTP://WWW.HGSEMI.NET 8 2018 JUN HG1509 Typical Performance Characteristics (Continued) Feedback Voltage vs. Temperature (VIN=15V, VOUT=5V) 1.26 1000 900 800 700 600 500 400 300 200 100 0 Feedback Voltage (V) Frequency (KHz) Header Frequency vs. Temperature 1.25 1.24 1.23 1.22 -40 10 60 110 -40 o 60 110 Temperature ( C) Supply Current vs. Supply Voltage (VIN=15V, VOUT=5V, lOUT=0A) Supply Current vs. Temperature (VIN=15V, VOUT=5V, lOUT=0A) 3 3 2.5 2.5 Supply Current (mA) Supply Current (mA) 10 o Temperature ( C) 2 1.5 1 0.5 2 1.5 1 0.5 0 0 -40 10 o 60 0 110 5 Temperature ( C) 10 15 Supply Voltage (V) Efficiency vs. Output Current (VIN=15V, VOUT=3.3V) Efficiency vs. Output Current (VIN=15V, VOUT=5V) 90 85 Efficiency (%) Efficiency (%) 85 80 75 75 65 55 70 0 20 40 0 60 Output Current (mA) HTTP://WWW.HGSEMI.NET 20 40 60 Output Current (mA) 9 2018 JUN HG1509 Functions Description Pin Functions +VIN This is the positive input supply for the IC switching regulator. A suitable input bypass capacitor must be presented at this pin to minimize voltage transients and to supply the switching currents needed by the regulator. Ground Circuit ground. Output Internal switch. The voltage at this pin switches between (+VIN – VSAT) and approximately – 0.5V, with a duty cycle of approximately VOUT / VIN. To minimize coupling to sensitive circuitry, the PC board copper area connected to this pin should be minimized. Feedback Senses the regulated output voltage to complete the feedback loop. SD Allows the switching regulator circuit to be shutdown using logic level signals thus dropping the total input supply current to approximately 150uA. Pulling this pin below a threshold voltage of approximately 1.3V turns the regulator on, and pulling this pin above 1.3V (up to a maximum of 18V) shuts the regulator down. If this shutdown feature is not needed, the SD pin can be wired to the ground pin. Thermal Considerations The SOP-8L package needs a heat sink under most conditions. The size of the heat sink depends on the input voltage, the output voltage, the load current and the ambient temperature. The HG1509 junction temperature rises above ambient temperature for a 2A load and different input and output voltages. The data for these curves was taken with the HG1509 (SOP-8L package) operating as a buck-switching regulator in an ambient temperature of 25oC (still air). These temperature increments are all approximate and are affected by many factors. Higher ambient temperatures require more heat sinker. For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper should be used in the board layout (One exception is the output (switch) pin, which should not have large areas of copper). Large areas of copper provide the best transfer of heat (lower thermal resistance) to the surrounding air, and moving air lowers the thermal resistance even further. Package thermal resistance and junction temperature increments are all approximate. The increments are affected by a lot of factors. Some of these factors include board size, shape, thickness, position, location, and even board temperature. Other factors are, trace width, total printed circuit copper area, copper thickness, single or double-sided, multi-layer board and the amount of solder on the board. The effectiveness of the PC board to dissipate heat also depends on the size, quantity and spacing of other components on the board, as well as whether the surrounding air is still or moving. Furthermore, some of these components such as the catch diode will add heat to the PC board and the heat can vary as the input voltage changes. For the inductor, depending on the physical size, type of core material and the DC resistance, it could either act as a heat sink taking heat away from the board, or it could add heat to the board. HTTP://WWW.HGSEMI.NET 10 2018 JUN