74HC00-Q100; 74HCT00-Q100
Quad 2-input NAND gate
Rev. 2 — 24 November 2015
Product data sheet
1. General description
The 74HC00-Q100; 74HCT00-Q100 is a quad 2-input NAND gate. Inputs include clamp
diodes. This enables the use of current limiting resistors to interface inputs to voltages in
excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from 40 C to +85 C and from 40 C to +125 C
Input levels:
For 74HC00-Q100: CMOS level
For 74HCT00-Q100: TTL level
Complies with JEDEC standard no. 7A
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pf, R = 0 )
Multiple package options
74HC00-Q100; 74HCT00-Q100
NXP Semiconductors
Quad 2-input NAND gate
3. Ordering information
Table 1.
Ordering information
Type number
74HC00D-Q100
Package
Temperature range Name
Description
Version
40 C to +125 C
SO14
plastic small outline package; 14 leads; body width
3.9 mm
SOT108-1
40 C to +125 C
TSSOP14
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
SOT402-1
40 C to +125 C
DHVQFN14 plastic dual in-line compatible thermal enhanced very SOT762-1
thin quad flat package; no leads; 14 terminals;
body 2.5 3 0.85 mm
74HCT00D-Q100
74HC00PW-Q100
74HCT00PW-Q100
74HC00BQ-Q100
74HCT00BQ-Q100
4. Functional diagram
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PQD
Fig 1.
Logic symbol
74HC_HCT00_Q100
Product data sheet
PQD
Fig 2.
IEC logic symbol
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 24 November 2015
PQD
Fig 3.
Logic diagram (one gate)
© NXP Semiconductors N.V. 2015. All rights reserved.
2 of 15
74HC00-Q100; 74HCT00-Q100
NXP Semiconductors
Quad 2-input NAND gate
5. Pinning information
5.1 Pinning
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DDD
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Fig 4.
Pin configuration SO14 and TSSOP14
Fig 5.
Pin configuration DHVQFN14
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
1A to 4A
1, 4, 9, 12
data input
1B to 4B
2, 5, 10, 13
data input
1Y to 4Y
3, 6, 8, 11
data output
GND
7
ground (0 V)
VCC
14
supply voltage
6. Functional description
Table 3.
Function table[1]
Input
Output
nA
nB
nY
L
X
H
X
L
H
H
H
L
[1]
H = HIGH voltage level; L = LOW voltage level; X = don’t care.
74HC_HCT00_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 24 November 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
3 of 15
74HC00-Q100; 74HCT00-Q100
NXP Semiconductors
Quad 2-input NAND gate
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
Conditions
Min
Max
Unit
0.5
+7
V
-
20
mA
-
20
mA
-
25
mA
50
mA
IIK
input clamping current
VI < 0.5 V or VI > VCC + 0.5 V
[1]
IOK
output clamping current
VO < 0.5 V or VO > VCC + 0.5 V
[1]
IO
output current
0.5 V < VO < VCC + 0.5 V
ICC
supply current
-
IGND
ground current
50
-
mA
Tstg
storage temperature
65
+150
C
-
500
mW
[2]
total power dissipation
Ptot
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
For SO14 package: Ptot derates linearly with 8 mW/K above 70 C.
For TSSOP14 packages: Ptot derates linearly with 5.5 mW/K above 60 C.
For DHVQFN14 packages: Ptot derates linearly with 4.5 mW/K above 60 C.
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter
VCC
supply voltage
Conditions
74HC00-Q100
74HCT00-Q100
Unit
Min
Typ
Max
Min
Typ
Max
2.0
5.0
6.0
4.5
5.0
5.5
V
VI
input voltage
0
-
VCC
0
-
VCC
V
VO
output voltage
0
-
VCC
0
-
VCC
V
Tamb
ambient temperature
40
+25
+125
40
+25
+125
C
t/V
input transition rise and fall rate
-
-
625
-
-
-
VCC = 4.5 V
-
1.67
139
-
1.67
139
ns/V
VCC = 6.0 V
-
-
83
-
-
-
ns/V
74HC_HCT00_Q100
Product data sheet
VCC = 2.0 V
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 24 November 2015
ns/V
© NXP Semiconductors N.V. 2015. All rights reserved.
4 of 15
74HC00-Q100; 74HCT00-Q100
NXP Semiconductors
Quad 2-input NAND gate
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
-
1.2
-
1.5
-
1.5
-
V
VCC = 4.5 V
-
2.4
-
3.15
-
3.15
-
V
VCC = 6.0 V
-
3.2
-
4.2
-
4.2
-
V
74HC00-Q100
VIH
VIL
VOH
VOL
HIGH-level
input voltage
LOW-level
input voltage
HIGH-level
output voltage
LOW-level
output voltage
VCC = 2.0 V
-
0.8
-
-
0.5
-
0.5
V
VCC = 4.5 V
-
2.1
-
-
1.35
-
1.35
V
VCC = 6.0 V
-
2.8
-
-
1.8
-
1.8
V
VI = VIH or VIL
IO = 20 A; VCC = 2.0 V
-
2.0
-
1.9
-
1.9
-
V
IO = 20 A; VCC = 4.5 V
-
4.5
-
4.4
-
4.4
-
V
IO = 20 A; VCC = 6.0 V
-
6.0
-
5.9
-
5.9
-
V
IO = 4.0 mA; VCC = 4.5 V
-
4.32
-
3.84
-
3.7
-
V
IO = 5.2 mA; VCC = 6.0 V
-
5.81
-
5.34
-
5.2
-
V
IO = 20 A; VCC = 2.0 V
-
0
-
-
0.1
-
0.1
V
IO = 20 A; VCC = 4.5 V
-
0
-
-
0.1
-
0.1
V
VI = VIH or VIL
IO = 20 A; VCC = 6.0 V
-
0
-
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 4.5 V
-
0.15
-
-
0.33
-
0.4
V
IO = 5.2 mA; VCC = 6.0 V
-
0.16
-
-
0.33
-
0.4
V
II
input leakage
current
VI = VCC or GND;
VCC = 6.0 V
-
-
-
-
1
-
1
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
-
-
-
20
-
40
A
CI
input
capacitance
-
3.5
-
-
-
-
-
pF
74HC_HCT00_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 24 November 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
5 of 15
74HC00-Q100; 74HCT00-Q100
NXP Semiconductors
Quad 2-input NAND gate
Table 6.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
74HCT00-Q100
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
-
1.6
-
2.0
-
2.0
-
V
VIL
LOW-level
input voltage
VCC = 4.5 V to 5.5 V
-
1.2
-
-
0.8
-
0.8
V
VOH
HIGH-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = 20 A
-
4.5
-
4.4
-
4.4
-
V
IO = 4.0 mA
-
4.32
-
3.84
-
3.7
-
V
VOL
LOW-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = 20 A; VCC = 4.5 V
-
0
-
-
0.1
-
0.1
V
IO = 5.2 mA; VCC = 6.0 V
-
0.15
-
-
0.33
-
0.4
V
II
input leakage
current
VI = VCC or GND;
VCC = 6.0 V
-
-
-
-
1
-
1
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
-
-
-
20
-
40
A
ICC
additional
supply current
per input pin;
VI = VCC 2.1 V; IO = 0 A;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V
-
150
-
-
675
-
735
A
CI
input
capacitance
-
3.5
-
-
-
-
-
pF
10. Dynamic characteristics
Table 7.
Dynamic characteristics
GND = 0 V; CL = 50 pF; for load circuit see Figure 7.
Symbol Parameter
25 C
Conditions
40 C to +125 C Unit
Min
Typ
Max
Max
(85 C)
Max
(125 C)
VCC = 2.0 V
-
25
-
115
135
ns
VCC = 4.5 V
-
9
-
23
27
ns
VCC = 5.0 V; CL = 15 pF
-
7
-
-
-
ns
-
7
-
20
23
ns
VCC = 2.0 V
-
19
-
95
110
ns
VCC = 4.5 V
-
7
-
19
22
ns
74HC00-Q100
tpd
propagation delay nA, nB to nY; see Figure 6
[1]
VCC = 6.0 V
tt
transition time
[2]
see Figure 6
VCC = 6.0 V
CPD
power dissipation
capacitance
74HC_HCT00_Q100
Product data sheet
per package; VI = GND to VCC
[3]
-
6
-
16
19
ns
-
22
-
-
-
pF
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 24 November 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
6 of 15
74HC00-Q100; 74HCT00-Q100
NXP Semiconductors
Quad 2-input NAND gate
Table 7.
Dynamic characteristics …continued
GND = 0 V; CL = 50 pF; for load circuit see Figure 7.
Symbol Parameter
25 C
Conditions
40 C to +125 C Unit
Min
Typ
Max
Max
(85 C)
Max
(125 C)
-
12
-
24
29
ns
-
10
-
-
-
ns
74HCT00-Q100
[1]
propagation delay nA, nB to nY; see Figure 6
tpd
VCC = 4.5 V
VCC = 5.0 V; CL = 15 pF
tt
transition time
VCC = 4.5 V; see Figure 6
[2]
CPD
power dissipation
capacitance
per package;
VI = GND to VCC 1.5 V
[3]
[1]
-
-
-
29
22
ns
-
22
-
-
-
pF
tpd is the same as tPHL and tPLH.
[2]
tt is the same as tTHL and tTLH.
[3]
CPD is used to determine the dynamic power dissipation (PD in W):
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL VCC2 fo) = sum of outputs.
11. Waveforms
9,
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