WSD3020DN

WSD3020DN Dual N-Ch MOSFET Product Summery General Description The WSD3020DN is the highest performance trench Dual N-Ch MOSFET with extreme high cell density,which provide excellent RDSON and gate charge for most of the synchronous buck converter applications . BVDSS RDSON ID 30V 17mΩ 21A Applications The WSD3020DN meet the RoHS and Green Product requirement 100% EAS guaranteed with full function reliability approved. z High Frequency Point-of-Load Synchronous Buck Converter for MB/NB/UMPC/VGA z Networking DC-DC Power System Features z Load Switch z Advanced high cell density Trench technology DFN3X3-8 Pin Configuration z Super Low Gate Charge z Excellent CdV/dt effect decline z 100% EAS Guaranteed z Green Device Available Absolute Maximum Ratings Symbol Parameter Rating Units VDS Drain-Source Voltage 30 V VGS Gate-Source Voltage ID@TC=25℃ ID@TC=100℃ ID@TA=25℃ ±20 V 1 21 A 1 13 A 1 7.5 A 1 Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V ID@TA=70℃ Continuous Drain Current, VGS @ 10V 6.0 A IDM Pulsed Drain Current2 25 A 3 EAS Single Pulse Avalanche Energy 15 mJ IAS Avalanche Current PD@TC=25℃ 17 A 4 14 W 4 Total Power Dissipation PD@TA=25℃ Total Power Dissipation 2.5 W TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Thermal Data Symbol Parameter RθJA Thermal Resistance Junction-Ambient 1 RθJC Thermal Resistance Junction-Case www.winsok.tw 1 Page 1 Typ. Max. Unit --- 70 ℃/W --- 8.5 ℃/W Dec.2014 WSD3020DN Dual N-Ch MOSFET Electrical Characteristics (TJ=25 ℃, unless otherwise noted) Symbol BVDSS Parameter Conditions Drain-Source Breakdown Voltage △BVDSS/△TJ BVDSS Temperature Coefficient RDS(ON) VGS(th) Static Drain-Source On-Resistance2 Gate Threshold Voltage Min. Typ. Max. Unit VGS=0V , ID=250uA 30 --- --- V Reference to 25℃ , ID=1mA --- 0.0232 --- V/℃ VGS=10V , ID=7.5A --- 17 19 VGS=4.5V , ID=6.8A --- 20 25 1.0 1.5 2.5 V --- -5.08 --- mV/℃ VDS=24V , VGS=0V , TJ=25℃ --- --- 1 VDS=24V , VGS=0V , TJ=55℃ --- --- 5 VGS=VDS , ID =250uA mΩ △VGS(th) VGS(th) Temperature Coefficient IDSS Drain-Source Leakage Current IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- --- ±100 nA gfs Forward Transconductance VDS=5V , ID=7.5A --- 22 --- S Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 2.2 3.0 Ω Qg Total Gate Charge (4.5V) --- 5.9 8 Qgs Gate-Source Charge --- 2.1 2.9 Qgd Gate-Drain Charge --- 2.0 3.2 VDS=15V , VGS=4.5V , ID=7.5A uA nC --- 14 19 Rise Time VDD=15V , VGEN=10V , RG=6Ω --- 10 17 Turn-Off Delay Time ID=1A ,RL=15Ω --- 20 62 Fall Time --- 8 12 Ciss Input Capacitance --- 526 --- Coss Output Capacitance --- 76 --- Crss Reverse Transfer Capacitance --- 62 --- Min. Typ. Max. Unit --- --- mJ Typ. Max. Unit Td(on) Tr Td(off) Tf Turn-On Delay Time VDS=15V , VGS=0V , f=1MHz ns pF Guaranteed Avalanche Characteristics Symbol EAS Parameter Conditions 5 Single Pulse Avalanche Energy VDD=25V , L=0.1mH , IAS=7.5A 15 Diode Characteristics Symbol Parameter Conditions 1,6 IS Continuous Source Current ISM Pulsed Source Current2,6 2 VSD Diode Forward Voltage trr Reverse Recovery Time Qrr Reverse Recovery Charge VG=VD=0V , Force Current VGS=0V , IS=7.5A , TJ=25℃ IF=7.5A,dI/dt=100A/µs,TJ=25℃ Min. --- --- 21 A --- --- 25 A --- --- 1 V --- 12 --- nS --- 3 --- nC Note : 1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper,t