WSD30L120DN56
P-Ch MOSFET
Product Summery
General Description
The WSD30L120DN56 is the highest performance
trench P-Ch MOSFET with extreme high cell
density,which provide excellent RDSON and gate
charge for most of the synchronous buck converter
applications .
BVDSS
RDSON
ID
-30V
3.6mΩ
-120A
Applications
The WSD30L120DN56 meet the RoHS and Green
Product requirement 100% EAS guaranteed with
full function reliability approved.
z High Frequency Point-of-Load Synchronous
Buck Converter for MB/NB/UMPC/VGA
z Networking DC-DC Power System
Features
z Load Switch
z Advanced high cell density Trench technology
DFN5X6-8 Pin Configuration
z Super Low Gate Charge
z Excellent CdV/dt effect decline
z 100% EAS Guaranteed
z Green Device Available
Absolute Maximum Ratings
Rating
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
ID@TC=25℃
ID@TC=100℃
ID@TA=25℃
10s
Steady State
Units
-30
V
±20
V
1
-120
A
1
-76
A
Continuous Drain Current, VGS @ -10V
Continuous Drain Current, VGS @ -10V
1
-27
1
-24
Continuous Drain Current, VGS @ -10V
ID@TA=70℃
Continuous Drain Current, VGS @ -10V
IDM
Pulsed Drain Current2
-22
A
-19
A
-400
A
3
EAS
Single Pulse Avalanche Energy
324
mJ
IAS
Avalanche Current
-36
A
78
W
PD@TC=25℃
4
Total Power Dissipation
4
6.8
6.25
PD@TA=25℃
Total Power Dissipation
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Max.
Unit
RθJA
Thermal Resistance Junction-Ambient 1
---
55
℃/W
RθJA
Thermal Resistance Junction-Ambient 1 (t ≤10s)
---
20
℃/W
---
1.6
℃/W
RθJC
www.winsok.tw
Typ.
1
Thermal Resistance Junction-Case
Page 1
Dec.2014
WSD30L120DN56
P-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
Static Drain-Source On-Resistance2
Gate Threshold Voltage
Min.
Typ.
Max.
Unit
VGS=0V , ID=-250uA
-30
---
---
V
Reference to 25℃ , ID=-1mA
---
-0.0232
---
V/℃
VGS=-10V , ID=-30A
---
2.9
3.6
VGS=-4.5V , ID=-10A
---
5.0
6.8
-1.2
-1.5
-2.5
V
---
4.6
---
mV/℃
VDS=-24V , VGS=0V , TJ=25℃
---
---
-1
VDS=-24V , VGS=0V , TJ=55℃
---
---
-5
VGS=VDS , ID =-250uA
mΩ
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=-5V , ID=-30A
---
28
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
2
5
Ω
Qg
Total Gate Charge (-4.5V)
---
135
---
---
12
-----
Qgs
Qgd
Td(on)
VDS=-15V , VGS=-10V , ID=-30A
Gate-Source Charge
Gate-Drain Charge
---
36
Turn-On Delay Time
---
22
---
uA
nC
Rise Time
VDD=-15V , VGEN=-10V , RG=6Ω
---
25
---
Turn-Off Delay Time
ID=-1A ,RL=15Ω
---
163
---
Fall Time
---
104
---
Ciss
Input Capacitance
---
6100
---
Coss
Output Capacitance
---
1130
---
Crss
Reverse Transfer Capacitance
---
1110
---
Min.
Typ.
Max.
Unit
300
---
---
mJ
Min.
Typ.
Unit
Tr
Td(off)
Tf
VDS=-15V , VGS=0V , f=1MHz
ns
pF
Guaranteed Avalanche Characteristics
Symbol
EAS
Parameter
Conditions
5
Single Pulse Avalanche Energy
VDD=-25V , L=0.5mH , IAS=-36A
Diode Characteristics
Symbol
Parameter
Conditions
---
---
Max.
-40
---
---
-400
A
VGS=0V , IS=-1A , TJ=25℃
---
---
-1
V
Reverse Recovery Time
IF=-15A , dI/dt=100A/µs ,
---
32
---
nS
Reverse Recovery Charge
TJ=25℃
---
16
---
nC
1,6
IS
Continuous Source Current
ISM
Pulsed Source Current2,6
VSD
Diode Forward Voltage2
trr
Qrr
VG=VD=0V , Force Current
A
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper,t
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