WSD40120DN56
N-Ch MOSFET
General Description
Product Summery
The WSD40120DN is the highest performance
trench N-Ch MOSFET with extreme high cell
density , which provide excellent RDSON and
gate charge for most of the synchronous buck
converter applications .
The WSD40120DN meet the RoHS and Green
Product requirement , 100% EAS guaranteed
with full function reliability approved.
BVDSS
RDSON
ID
40V
1.85mΩ
120A
Applications
z High Frequency Point-of-Load Synchronous
Buck Converter
z Networking DC-DC Power System
Features
z Power Tool Application
z Advanced high cell density Trench technology
DFN5X6-8 Pin Configuration
z Super Low Gate Charge
z Excellent CdV/dt effect decline
z 100% EAS Guaranteed
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
VDS
VGS
ID@TC=25℃
ID@TC=100℃
IDM
Rating
Units
Drain-Source Voltage
40
V
Gate-Source Voltage
±20
V
1,7
120
A
1,7
100
A
400
A
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
2
3
EAS
Single Pulse Avalanche Energy
240
mJ
IAS
Avalanche Current
31
A
4
PD@TC=25℃
Total Power Dissipation
104
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Typ.
RθJA
Thermal Resistance Junction-Ambient
RθJC
1
www.winsok.tw
Thermal Resistance Junction-Case
Page 1
1
Max.
Unit
---
55
℃/W
---
1.2
℃/W
Dec.2014
WSD40120DN56
N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
RDS(ON)
VGS(th)
△VGS(th)
2
Static Drain-Source On-Resistance
2
Static Drain-Source On-Resistance
Gate Threshold Voltage
Min.
Typ.
Max.
Unit
VGS=0V , ID=250uA
40
---
---
V
Reference to 25℃ , ID=1mA
---
0.043
---
V/℃
VGS=10V , ID=30A
---
1.85
2.4
mΩ
---
2.5
3.3
mΩ
1.5
1.8
2.5
V
mV/℃
VGS=4.5V , ID=20A
VGS=VDS , ID =250uA
VGS(th) Temperature Coefficient
---
-6.94
---
VDS=48V , VGS=0V , TJ=25℃
---
---
2
VDS=48V , VGS=0V , TJ=55℃
---
---
10
uA
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=5V , ID=20A
---
55
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
1.1
2
Ω
Qg
Total Gate Charge (10V)
---
76
91
Qgs
Gate-Source Charge
---
12
14.4
Qgd
Gate-Drain Charge
---
15.5
18.6
VDS=20V , VGS=10V , ID=40A
nC
---
20
24
Rise Time
VDD=30V , VGEN=10V , RG=1Ω,
---
10
12
Turn-Off Delay Time
ID=1A ,RL=15Ω.
---
58
69
Fall Time
---
34
40
Ciss
Input Capacitance
---
4350
---
Coss
Output Capacitance
---
690
---
Crss
Reverse Transfer Capacitance
---
370
---
Min.
Typ.
Max.
Unit
198
---
---
mJ
Min.
Typ.
Max.
Unit
Td(on)
Tr
Td(off)
Tf
Turn-On Delay Time
VDS=20V , VGS=0V , f=1MHz
ns
pF
Guaranteed Avalanche Characteristics
Symbol
EAS
Parameter
Conditions
5
Single Pulse Avalanche Energy
VDD=25V , L=0.5mH , IAS=31A
Diode Characteristics
Symbol
Parameter
Conditions
1,6
IS
Continuous Source Current
ISM
Pulsed Source Current
VSD
Diode Forward Voltage2
2,6
VG=VD=0V , Force Current
VGS=0V , IS=20A , TJ=25℃
---
---
100
A
---
---
400
A
---
---
1.1
V
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper,t
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