WSE3088
N-Ch MOSFET
Product Summery
General Description
The WSE3088 is the highest performance trench
N-Ch MOSFET with extreme high cell density ,
which provide excellent RDSON and gate charge
for most of the synchronous buck converter
applications .
BVDSS
30V
RDSON
ID
23mΩ
7A
Applications
The WSE3088 meet the RoHS and Green
Product requirement with full function reliability
approved.
z High Frequency Point-of-Load Synchronous s
Small power switching for MB/NB/UMPC/VGA
z Networking DC-DC Power System
Features
z Load Switch
z Advanced high cell density Trench technology
SOT-89 Pin Configuration
z Super Low Gate Charge
z Excellent Cdv/dt effect decline
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
VDS
VGS
ID@Tc=25℃
ID@Tc=70℃
IDM
Rating
Units
Drain-Source Voltage
30
V
Gate-Source Voltage
±20
V
1
7.0
A
1
5.5
A
28
A
9
mJ
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
2
3
EAS
Single Pulse Avalanche Energy
IAS
Avalanche Current
6
A
W
PD@TA=25℃
Total Power Dissipation
1.8
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
4
Thermal Data
Symbol
Parameter
Typ.
RθJA
Thermal Resistance Junction-ambient
RθJC
1
www.winsok.tw
Thermal Resistance Junction-Case
Page 1
1
---
Max.
70
Unit
℃/W
---
30
℃/W
Dec.2014
WSE3088
N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
Static Drain-Source On-Resistance2
Gate Threshold Voltage
Min.
Typ.
Max.
Unit
VGS=0V , ID=250uA
30
---
---
V
Reference to 25℃ , ID=1mA
---
0.023
---
V/℃
---
23
28
---
31
38
0.5
1.0
1.5
V
---
-4.2
---
mV/℃
VDS=24V , VGS=0V , TJ=25℃
---
---
1
VDS=24V , VGS=0V , TJ=55℃
---
---
5
VGS=4.5V , ID=7A
VGS=2.5V , ID=6A
VGS=VDS , ID =250uA
mΩ
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=5V , ID=6A
---
7
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
2.5
5.0
Ω
Qg
Total Gate Charge (4.5V)
---
8.0
10.5
---
0.7
---
---
1.5
--7.5
Qgs
Qgd
VDS=10V , VGS=4.5V , ID=7A
Gate-Source Charge
Gate-Drain Charge
uA
nC
---
4
Rise Time
VDD=10V ,VGS=10V,
---
12.5
23
Turn-Off Delay Time
RG=6Ω,ID=1A ,RL=10Ω,
---
13.5
25
Fall Time
---
2
3.5
Ciss
Input Capacitance
---
360
---
Coss
Output Capacitance
---
80
---
Crss
Reverse Transfer Capacitance
---
55
---
Min.
Typ.
Max.
Unit
7
---
---
mJ
Min.
Typ.
Max.
Unit
Td(on)
Tr
Td(off)
Tf
Turn-On Delay Time
VDS=10V , VGS=0V , f=1MHz
ns
pF
Guaranteed Avalanche Characteristics
Symbol
EAS
Parameter
Conditions
5
Single Pulse Avalanche Energy
VDD=25V , L=0.5mH , IAS=6A
Diode Characteristics
Symbol
Parameter
Conditions
1,6
IS
Continuous Source Current
ISM
Pulsed Source Current2,6
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
2
VG=VD=0V , Force Current
VGS=0V , IS=3A , TJ=25℃
IF=7A , dI/dt=100A/µs , TJ=25℃
---
---
2
A
---
---
28
A
---
---
1.3
V
---
8.5
---
nS
---
2.5
---
nC
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper, t≦10sec.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.5mH,IAS=6A
4.The power dissipation is limited by 150℃ junction temperature
5.The Min. value is 100% EAS tested guarantee.
6.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
www.winsok.tw
Page 2
Dec.2014
WSE3088
N-Ch MOSFET
Typical Characteristics
65
25
ID=7A
VGS=10V
20
ID Drain Current (A)
VGS=7V
50
RDSON (mΩ)
VGS=5V
15
VGS=4.5V
VGS=3V
10
35
5
18
0
0
0.5
1
1.5
2
2
2.5
4
VDS , Drain-to-Source Voltage (V)
6
VGS (V)
8
10
Fig.2 On-Resistance vs. Gate-Source
Fig.1 T ypical Output Characteristics
6
IS Source Current(A)
VDS=4.5V
ID=7A
4
TJ=150℃
2
0
0.00
0.25
0.50
TJ=25℃
0.75
1.00
VSD , Source-to-Drain Voltage (V)
Fig.3 Forward Characteristics Of Reverse
Fig.4 Gate-Charge Characteristics
1.8
Normalized On Resistance
1.8
1.4
Normalized VGS(th)
1.4
1.0
1
0.6
0.6
0.2
0.2
-50
0
50
100
150
-50
0
50
100
TJ ,Junction Temperature (℃ )
TJ , Junction Temperature (℃)
Fig.5 Normalized VGS(th) vs. TJ
Fig.6 Normalized RDSON vs. TJ
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Page 3
150
Dec.2014
WSE3088
N-Ch MOSFET
1000
100.00
F=1.0MHz
100us
10.00
100
1ms
10ms
ID (A)
Capacitance (pF)
Ciss
Coss
1.00
100ms
Crss
0.10
o
TA=25 C
Single Pulse
10
1
5
9
13
17
21
25
VDS Drain to Source Voltage (V)
0.01
0.01
Fig.7 Capacitance
DC
0.1
1
10
VDS (V)
100
Fig.8 Safe Operating Area
Normalized Thermal Response (RθJA)
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.01
P DM
0.01
T ON
T
D = TON/T
TJpeak = TA+P DMXRθJA
SINGLE
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.10 Switching Time Waveform
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Fig.11 Unclamped Inductive Switching Waveform
Page 4
Dec.2014
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