WSF12N10
N-Ch MOSFET
Product Summery
General Description
The WSF12N10 is the highest performance
trench N-ch MOSFET with extreme high cell
density , which provide excellent RDSON and
gate charge for most of the synchronous buck
converter applications .
BVDSS
RDSON
ID
100V
175mΩ
12A
Applications
The WSF12N10 meet the RoHS and Green
Product requirement , 100% EAS guaranteed
with full function reliability approved.
z High Frequency Point-of-Load Synchronous
Buck Converter
z Networking DC-DC Power System
z Load Switch
Features
TO-252 Pin Configuration
z Advanced high cell density Trench technology
D
z Super Low Gate Charge
z Excellent Cdv/dt effect decline
G
z Green Device Available
S
Absolute Maximum Ratings
Symbol
Parameter
VDS
VGS
ID@TC=25℃
ID@TC=100℃
IDM
EAS
Rating
Units
Drain-Source Voltage
100
V
Gate-Source Voltage
±20
V
1
10
A
1
7
A
15
A
Single Pulse Avalanche Energy
15
mJ
A
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
2
3
IAS
Avalanche Current
6
PD@TC=25℃
Total Power Dissipation3
60
W
PD@TC=100℃
Total Power Dissipation3
30
W
TSTG
Storage Temperature Range
-55 to 170
℃
TJ
Operating Junction Temperature Range
-55 to 170
℃
Thermal Data
Symbol
Parameter
RθJA
Thermal Resistance Junction-ambient
RθJC
1
www.winsok.tw
Thermal Resistance Junction-Case
Page 1
1
Typ.
Max.
Unit
---
50
℃/W
---
2.5
℃/W
Dec.2014
WSF12N10
N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
Static Drain-Source On-Resistance2
Gate Threshold Voltage
Min.
Typ.
Max.
Unit
100
---
---
V
Reference to 25℃ , ID=1mA
---
0.098
---
V/℃
VGS=10V , ID=5A
---
175
220
mΩ
---
220
310
mΩ
1.0
1.8
2.4
V
---
-4.57
---
mV/℃
VDS=80V , VGS=0V , TJ=25℃
---
---
1
VDS=80V , VGS=0V , TJ=55℃
---
---
5
VGS=0V , ID=250uA
VGS=4.5V , ID=2A
VGS=VDS , ID =250uA
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=5V , ID=5A
---
13
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
2
4
Ω
Qg
Total Gate Charge (10V)
6.0
9.5
13
Qgs
Qgd
Td(on)
1.9
2.5
Gate-Drain Charge
1.0
2.1
3.1
Turn-On Delay Time
---
11
21
VDS=50V , VGS=10V , ID=5A
Gate-Source Charge
1.3
Rise Time
VDD=30V , VGS=10V , RG=6Ω
---
10
19
Turn-Off Delay Time
ID=1A , RL=30Ω
---
21
39
Fall Time
---
13
24
Ciss
Input Capacitance
---
440
---
Coss
Output Capacitance
---
Tr
Td(off)
Tf
Crss
VDS=30V , VGS=0V , f=1MHz
Reverse Transfer Capacitance
uA
nC
ns
36
---
---
20
---
Min.
Typ.
Max.
Unit
10
---
---
mJ
Min.
Typ.
Max.
Unit
---
---
3
A
---
---
9
A
---
---
1.1
V
25
36
47
nS
34
49
64
nC
pF
Guaranteed Avalanche Characteristics
Symbol
EAS
Parameter
Conditions
5
Single Pulse Avalanche Energy
VDD=25V , L=0.5mH , IAS=3A
Diode Characteristics
Symbol
IS
ISM
Parameter
Continuous Source Current
2,6
Pulsed Source Current
2
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Conditions
1,6
Reverse Recovery Charge
VG=VD=0V , Force Current
VGS=0V , IS=3A , TJ=25℃
IF=5A , dI/dt=100A/µs , TJ=25℃
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper,t≦10sec.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.5mH,IAS=3A
4.The power dissipation is limited by 150℃ junction temperature
5.The Min. value is 100% EAS tested guarantee.
6.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
www.winsok.tw
Page 2
Dec.2014
WSF12N10
N-Ch MOSFET
Typical Characteristics
Power Dissipation
Drain Current
70
12
60
10
ID - Drain Current (A)
Ptot - Power (W)
50
40
30
20
8
6
4
2
10
o
0
o
TC=25 C
0
20
40
0
60 80 100 120 140 160 180
TC=25 C,VG=10V
0
20 40
Tj - Junction Temperature (°C)
80 100 120 140 160 180
Tj - Junction Temperature (°C)
Safe Operation Area
Thermal Transient Impedance
2
10
Rd
s(o
n)
Lim
it
1ms
10ms
100ms
1s
1
DC
0.1
O
TC=25 C
0.01
0.01
0.1
1
10
100
Normalized Transient Thermal Resistance
50
ID - Drain Current (A)
60
500
VDS - Drain - Source Voltage (V)
www.winsok.tw
1
Duty = 0.5
0.2
0.1
0.05
0.02
0.1
0.01
Single Pulse
2
0.01
1E-4
Mounted on 1in pad
o
RqJA :50 C/W
1E-3
0.01
0.1
1
10
100
Square Wave Pulse Duration (sec)
Page 3
Dec.2014
WSF12N10
N-Ch MOSFET
Typical Characteristics
Drain-Source On Resistance
Output Characteristics
400
15
5V
ID - Drain Current (A)
12
9
4.5V
6
3
0
4V
350
VGS=4.5V
300
250
200
VGS=10V
150
100
50
3.5V
0
1
2
3
4
0
3
6
9
12
ID - Drain Current (A)
Gate-Source On Resistance
Gate Threshold Voltage
1.6
IDS=5A
Normalized Threshold Voltage
350
300
250
200
150
100
50
0
5
VDS - Drain - Source Voltage (V)
400
RDS(ON) - On - Resistance (mW)
RDS(ON) - On - Resistance (mW)
VGS=6,7,8,9,10V
2
3
4
5
6
7
8
9
VGS - Gate - Source Voltage (V)
www.winsok.tw
IDS=250mA
1.4
1.2
1.0
0.8
0.6
0.4
0.2
-50 -25
10
15
0
25
50
75 100 125 150 175
Tj - Junction Temperature (°C)
Page 4
Dec.2014
WSF12N10
N-Ch MOSFET
Typical Characteristics
Drain-Source On Resistance
Source-Drain Diode Forward
3.0
10
VGS = 10V
IDS = 5A
IS - Source Current (A)
Normalized On Resistance
2.5
2.0
1.5
1.0
o
Tj=175 C
1
o
Tj=25 C
0.5
o
0.0
-50 -25
RON@Tj=25 C: 135mW
0
25
50
0.4
0.6
0.8
1.0
1.2
1.4
VSD - Source - Drain Voltage (V)
Capacitance
Gate Charge
10
Frequency=1MHz
550
VDS=50V
9
VGS - Gate-source Voltage (V)
500
Ciss
450
C - Capacitance (pF)
0.2
Tj - Junction Temperature (°C)
600
400
350
300
250
200
150
100
Crss
0
8
16
24
32
8
7
6
5
4
3
2
0
40
VDS - Drain - Source Voltage (V)
www.winsok.tw
IDS=5A
1
Coss
50
0
0.1
0.0
75 100 125 150 175
0
2
4
6
8
10
QG - Gate Charge (nC)
Page 5
Dec.2014
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