WSF40N10A
N-Ch MOSFET
General Description
Product Summery
The WSF40N10A is the highest performance
trench N-Ch MOSFET with extreme high cell
density , which provide excellent RDSON and
gate charge for most of the synchronous buck
converter applications .
BVDSS
RDSON
ID
100V
42mΩ
31A
Applications
The WSF40N10A meet the RoHS and Green
Product requirement , 100% EAS
guaranteed with full function reliability
approved.
z High Frequency Point-of-Load Synchronous
Buck Converter
z Networking DC-DC Power System
Features
z Load Switch
z Advanced high cell density Trench technology
TO-252 Pin Configuration
z Super Low Gate Charge
z Excellent Cdv/dt effect decline
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
100
V
VGS
Gate-Source Voltage
ID@TC=25℃
ID@TC=100℃
IDM
PD@TC=25℃
±20
V
1
31
A
1
22
A
55
A
52.1
W
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
2
4
Total Power Dissipation
4
PD@TA=25℃
Total Power Dissipation
2
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Typ.
RθJA
Thermal Resistance Junction-ambient
RθJC
1
www.winsok.tw
Thermal Resistance Junction-Case
Page 1
1
Max.
Unit
---
62
℃/W
---
2.4
℃/W
Dec.2014
WSF40N10A
N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
Static Drain-Source On-Resistance2
Gate Threshold Voltage
Min.
Typ.
Max.
Unit
100
---
---
V
Reference to 25℃ , ID=1mA
---
0.098
---
V/℃
VGS=10V , ID=12A
---
42
55
---
58
85
0.9
1.5
2.5
V
---
-5.52
---
mV/℃
VDS=80V , VGS=0V , TJ=25℃
---
---
10
VDS=80V , VGS=0V , TJ=55℃
---
---
100
VGS=0V , ID=250uA
VGS=5.0V , ID=8A
VGS=VDS , ID =250uA
mΩ
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=5V , ID=12A
---
14
---
S
Qg
Total Gate Charge (10V)
---
13.5
22
Qgs
Gate-Source Charge
---
3
---
Qgd
Gate-Drain Charge
VDS=80V , VGS=10V , ID=12A
---
9
----
uA
nC
---
6.5
Rise Time
VDD=50V , VGS=10V ,
---
18
---
Turn-Off Delay Time
RG=3.3Ω ID=12A
---
20
---
Fall Time
---
5
---
Ciss
Input Capacitance
---
3840
---
Coss
Output Capacitance
---
115
---
Crss
Reverse Transfer Capacitance
---
80
---
Min.
Typ.
Max.
Unit
VG=VD=0V , Force Current
---
---
12
A
VGS=0V , IS=1A , TJ=25℃
---
---
1.3
V
---
40
---
nS
---
70
---
nC
Td(on)
Tr
Td(off)
Tf
Turn-On Delay Time
VDS=15V , VGS=0V , f=1MHz
ns
pF
Diode Characteristics
Symbol
IS
Parameter
Conditions
1,6
Continuous Source Current
2
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IF=12A,dI/dt=100A/µs,TJ=25℃
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
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Page 2
Dec.2014
WSF40N10A
N-Ch MOSFET
Typical Characteristics
50
40
10V
7.0V
6.0V
5.0V
ID , Drain Current (A)
40
10V
7.0V
6.0V
5.0V
T C = 150 o C
ID , Drain Current (A)
T C = 25 o C
30
V G = 4.0V
20
30
V G = 4.0V
20
10
10
0
0
0
2
4
6
0
4
V DS , Drain-to-Source Voltage (V)
8
12
16
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
70
2.4
I D =8A
I D =12A
V G =10V
o
T C =25 C
Normalized RDS(ON)
RDS(ON) (mΩ)
2.0
60
1.6
1.2
50
0.8
0.4
40
2
4
6
8
-50
10
0
50
100
150
T j , Junction Temperature ( o C)
V GS Gate-to-Source Voltage (V)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
1.6
20
I D =1mA
Normalized VGS(th)
IS(A)
16
12
T j =150 o C
T j =25 o C
8
1.2
0.8
0.4
4
0
0
0
0.2
0.4
0.6
0.8
1
1.2
-50
1.4
V SD , Source-to-Drain Voltage (V)
50
100
150
o
T j ,Junction Temperature ( C)
Fig 5. Forward Characteristic of
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
Reverse Diode
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0
Page 3
Dec.2014
WSF40N10A
N-Ch MOSFET
f=1.0MHz
10
1200
I D = 12 A
V DS = 50 V
V DS = 60 V
V DS = 80 V
6
C iss
800
C (pF)
VGS , Gate to Source Voltage (V)
1000
8
600
4
400
2
200
0
C oss
C rss
0
0
4
8
12
16
20
24
1
5
Q G , Total Gate Charge (nC)
9
13
17
21
25
29
V DS ,Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1
Normalized Thermal Response (Rthjc)
100
Operation
O
peration in
limited by RDS(ON)
100us
ID (A)
10
1ms
10ms
1
100ms
DC
o
T c =25 C
Single Pulse
Duty factor=0.5
0.2
0.1
0.1
0.05
PDM
t
0.02
T
0.01
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01
0.1
0.1
1
10
100
0.00001
1000
0.0001
V DS , Drain-to-Source Voltage (V)
Fig 9. Maximum Safe Operating Area
0.001
0.01
0.1
1
t , Pulse Width (s)
Fig 10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
4.5V
QGS
QGD
10%
VGS
td(on) tr
td(off) tf
Charge
Fig 11. Switching Time Waveform
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Q
Fig 12. Gate Charge Waveform
Page 4
Dec.2014
WSF40N10A
N-Ch MOSFET
TO-252 Package Information
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min.
Max.
Min.
Max.
A
2.200
2.400
0.087
0.094
A1
0.000
0.127
0.000
0.005
b
0.660
0.860
0.026
0.034
c
0.460
0.580
0.018
0.023
D
6.500
6.700
0.256
0.264
D1
5.100
5.460
0.201
0.215
D2
4.830 TYP.
0.190 TYP.
E
6.000
6.200
0.236
0.244
e
2.186
2.386
0.086
0.094
L
9.800
10.400
0.386
0.409
L1
L2
2.900 TYP.
1.400
L3
0.114 TYP.
1.700
0.055
1.600 TYP.
0.067
0.063 TYP.
L4
0.600
1.000
0.024
0.039
Φ
1.100
1.300
0.043
0.051
θ
0°
8°
0°
8°
h
0.000
0.300
0.000
0.012
V
www.winsok.tw
5.350 TYP.
0.211 TYP.
Page 5
Dec.2014
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