WSG02N20
N-Ch MOSFET
General Description
Product Summery
The WSG02N20 is the highest performance trench
N-Ch MOSFET with extreme high cell density,
which provide excellent RDSON and gate charge
for most of the small power switching and load
switch applications.
BVDSS
RDSON
ID
200V
310mΩ
2A
Applications
The WSG02N20 meet the RoHS and Green
Product requirement with full function reliability
approved.
Power Management in TV Inverter.
SOT-223 Pin Configuration
Features
z Advanced high cell density Trench technology
z Super Low Gate Charge
z Excellent Cdv/dt effect decline
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
VDS
VGS
ID@Tc=25℃
ID@Tc=70℃
IDM
Rating
Units
Drain-Source Voltage
200
V
Gate-Source Voltage
±20
V
1
2.0
A
1
1.5
A
10
A
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
2
3
PD@TA=25℃
Total Power Dissipation
18
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Typ.
RθJA
Thermal Resistance Junction-ambient
RθJC
1
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Thermal Resistance Junction-Case
Page 1
1
Max.
Unit
---
70
℃/W
---
30
℃/W
Dec.2014
WSG02N20
N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
Static Drain-Source On-Resistance2
Gate Threshold Voltage
Min.
Typ.
Max.
Unit
200
---
---
V
---
0.098
---
V/℃
---
310
410
mΩ
---
314
820
mΩ
2.0
2.8
4.0
V
---
-4.57
---
mV/℃
VDS=80V , VGS=0V , TJ=25℃
---
---
1
VDS=80V , VGS=0V , TJ=55℃
---
---
5
VGS=0V , ID=250uA
Reference to 25℃ , ID=1mA
VGS=10V , ID=2A
VGS=6V , ID=1A
VGS=VDS , ID =250uA
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=5V , ID=2A
---
15
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
2.5
---
Ω
Qg
Total Gate Charge (10V)
---
51.7
---
Qgs
Gate-Source Charge
---
12.7
---
---
16.3
--50
Qgd
VDS=30V , VGS=10V , ID=2A
Gate-Drain Charge
uA
nC
---
32
Rise Time
VDD=30V , VGEN=10V ,
---
32.1
51
Turn-Off Delay Time
RG=4.7Ω ID=1A ,RL=17.7Ω
---
60.9
79
Fall Time
---
5.2
10
Ciss
Input Capacitance
---
645
---
Coss
Output Capacitance
---
68
---
Crss
Reverse Transfer Capacitance
---
21
---
Min.
Typ.
Max.
---
---
2
A
---
---
10
A
---
---
1.15
V
---
38
---
nS
---
56
---
nC
Td(on)
Tr
Td(off)
Tf
Turn-On Delay Time
VDS=30V , VGS=0V , f=1MHz
ns
pF
Diode Characteristics
Symbol
Parameter
Conditions
1,4
IS
Continuous Source Current
ISM
Pulsed Source Current2,4
VSD
Diode Forward Voltage2
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VG=VD=0V , Force Current
VGS=0V , IS=1A , TJ=25℃
IF=2A,dI/dt=100A/µs , TJ=25℃
Unit
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper, t≦10sec.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The power dissipation is limited by 150℃ junction temperature
4.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
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Page 2
Dec.2014
WSG02N20
N-Ch MOSFET
Typical Characteristics
1000
15
VGS=10V
VGS=7V
12
800
VGS=6V
VGS=4.5V
RDSON (mΩ)
ID Drain Current (A)
ID=2A
9
VGS=3.8V
6
600
400
3
250
0
0
0.5
1
1.5
2
2
2.5
6
VDS , Drain-to-Source Voltage (V)
VGS (V)
8
10
Fig.2 On-Resistance vs. Gate-Source
Fig.1 Typical Output Characteristics
10
ID=2A
IS Source Current(A)
8
6
TJ=150℃
4
TJ=25℃
2
0
0.00
0.25
0.50
0.75
1.00
VSD , Source-to-Drain Voltage (V)
Fig.4 Gate-Charge Characteristics
Fig.3 Forward Characteristics Of Reverse
2.5
Normalized On Resistance
1.8
Normalized VGS(th)
1.4
1
0.6
0.2
2.0
1.5
1.0
0.5
-50
0
50
100
150
-50
TJ ,Junction Temperature (℃ )
Fig.5 Normalized VGS(th) vs. TJ
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0
50
100
TJ , Junction Temperature (℃)
150
Fig.6 Normalized RDSON vs. TJ
Page 3
Dec.2014
WSG02N20
N-Ch MOSFET
10000
10.00
F=1.0MHz
100us
1ms
1000
1.00
10ms
ID (A)
Capacitance (pF)
Ciss
100
o
Crss
TA=25 C
Single Pulse
10
1
5
9
13
17
21
100ms
0.10
Coss
25
VDS , Drain to Source Voltage (V)
0.01
0.01
0.1
Fig.7 Capacitance
DC
1
VDS (V)
10
100
1000
Fig.8 Safe Operating Area
Normalized Thermal Response (RθJA)
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.01
P DM
0.01
T ON
T
D = TON/T
TJpeak = TC+P DMXRθJC
SINGLE
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.10 Switching Time Waveform
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Fig.11 Gate Charge Waveform
Page 4
Dec.2014
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