WSP16N10
N-Ch MOSFET
General Description
Product Summery
The WSP16N10 is the highest performance
trench N-Ch MOSFET with extreme high
cell density , which provide excellent
RDSON and gate charge for most of the
synchronous buck converter applications .
BVDSS
RDSON
ID
100V
8.9mΩ
16A
Applications
The WSF16N10 meet the RoHS and
Green Product requirement , 100% EAS
guaranteed with full function reliability
approved.
z DC/DC Converter
SOP-8 Pin Configuration
Features
z Advanced high cell density Trench technology
z Super Low Gate Charge
z Excellent Cdv/dt effect decline
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
100
V
VGS
Gate-Source Voltage
ID@TC=25℃
ID@TC=100℃
IDM
±20
V
1
16
A
1
10
A
56
A
mJ
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
2
EAS
Single Pulse Avalanche Energy L=0.1mH
30
IAS
Avalanche Current
28
A
3
4
PD@TA=25℃
Total Power Dissipation
3.1
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Typ.
RθJA
Thermal Resistance Junction-ambient
RθJC
1
www.winsok.tw
Thermal Resistance Junction-Case
Page 1
1
Max.
Unit
---
40
℃/W
---
24
℃/W
Dec.2014
WSP16N10
N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
Static Drain-Source On-Resistance2
Gate Threshold Voltage
Min.
Typ.
Max.
Unit
100
---
---
V
---
0.098
---
V/℃
---
8.9
11
---
9.9
13
1.4
1.7
2.5
V
---
-5.52
---
mV/℃
VDS=100V , VGS=0V , TJ=25℃
---
---
1
VDS=100V , VGS=0V , TJ=55℃
---
---
5
VGS=0V , ID=250uA
Reference to 25℃ , ID=1mA
VGS=10V , ID=11.5A
VGS=4.5V , ID=9.5A
VGS=VDS , ID =250uA
mΩ
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
0.55
1.0
Ω
Qg
Total Gate Charge (10V)
---
15
---
Qgs
Gate-Source Charge
---
7
---
Qgd
Gate-Drain Charge
---
4
---
---
8
---
Td(on)
VDS=50V , VGS=10V , ID=11.5A
Turn-On Delay Time
uA
nC
---
3
---
---
25
---
Fall Time
---
4
---
Ciss
Input Capacitance
---
4000
---
Coss
Output Capacitance
---
898
---
Crss
Reverse Transfer Capacitance
---
39
---
Min.
Typ.
Max.
Unit
---
---
mJ
Min.
Typ.
Max.
Unit
---
---
4
A
---
---
16
A
---
---
1.1
V
---
25
---
nS
---
110
---
nC
Tr
Td(off)
Tf
Rise Time
VDD=50V , VGEN=10V ,
Turn-Off Delay Time
RG=3Ω ID=1A ,RL=4.35Ω
VDS=50V , VGS=0V , f=1MHz
ns
pF
Guaranteed Avalanche Characteristics
Symbol
EAS
Parameter
Conditions
5
Single Pulse Avalanche Energy
VDD=50V , L=0.1mH , IAS=10A
18
Diode Characteristics
Symbol
IS
ISM
VSD
Parameter
Conditions
1,6
Continuous Source Current
2,6
Pulsed Source Current
2
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VG=VD=0V , Force Current
VGS=0V , IS=6A , TJ=25℃
IF=1A , dI/dt=100A/µs , T J=25℃
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper,t or equal to 4.5V
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note F)
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJA=75°C/W
0.1
PDM
0.01
Single Pulse
Ton
T
0.001
1E-05
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
www.winsok.tw
Page 4
Dec.2014
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