WSP8212
Dual N-Channel MOSFET
Product Summery
General Description
The WSP8212 is the highest performance
trench Dual N-ch MOSFET with extreme high
cell density , which provide excellent RDSON
and gate charge for most of the small power
switching and load switch applications.
BVDSS
RDSON
ID
20V
10mΩ
11A
Applications
The WSP8212 meet the RoHS and Green
Product requirement with full function reliability
approved.
z High Frequency Point-of-Load Synchronous
Small power switching for MB/NB/UMPC/VGA
z Networking DC-DC Power System
Features
z ESD:2KV
z Advanced high cell density Trench technology
SOP-8 Pin Configuration
z Super Low Gate Charge
z Excellent Cdv/dt effect decline
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
20
V
VGS
Gate-Source Voltage
ID@Tc=25℃
Continuous Drain Current, VGS @ 4.5V
ID@Tc=70℃
IDM
±12
V
1
11
A
1
9
A
40
A
Continuous Drain Current, VGS @ 4.5V
Pulsed Drain Current
2
PD@TA=25℃
Total Power Dissipation
1.5
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
3
Thermal Data
Symbol
Parameter
Typ.
RθJA
Thermal Resistance Junction-ambient
RθJC
Thermal Resistance Junction-Case
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1
1
Page 1
Max.
Unit
---
100
℃/W
---
70
℃/W
Dec.2014
WSP8212
Dual N-Channel MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
2
RDS(ON)
Static Drain-Source On-Resistance
VGS(th)
Gate Threshold Voltage
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
Min.
Typ.
Max.
Unit
VGS=0V , ID=250uA
20
---
---
V
Reference to 25℃ , ID=1mA
---
0.022
---
V/℃
VGS=4.5V , ID=11A
---
10
13
VGS=2.5V , ID=10A
---
12.5
15
0.5
0.72
1.0
V
---
-2.33
---
mV/℃
VDS=16V , VGS=0V , TJ=25℃
---
---
1
VDS=16V , VGS=0V , TJ=55℃
---
---
5
VGS=±12V , VDS=0V
---
---
±100
nA
VGS=VDS , ID =250uA
mΩ
uA
gfs
Forward Transconductance
VDS=5V , ID=5A
---
40
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
4
---
Ω
Qg
Total Gate Charge (4.5V)
---
4.65
6.2
Qgs
Gate-Source Charge
---
1.12
---
Qgd
Gate-Drain Charge
---
3.72
---
Turn-On Delay Time
---
487
975
---
800
1600
---
1728
3456
Fall Time
---
6180
12360
Ciss
Input Capacitance
---
937
---
Coss
Output Capacitance
---
153
---
Crss
Reverse Transfer Capacitance
---
150
---
Td(on)
Tr
Td(off)
Tf
VDS=10V , VGS=4.5V , ID=7.5A
VDD=10V , VGS=10V , RG=3.0Ω
Rise Time
ID=1A ,RL=10Ω.
Turn-Off Delay Time
VDS=10V , VGS=0V , f=1MHz
nC
ns
pF
Diode Characteristics
Symbol
IS
ISM
VSD
Parameter
Conditions
1,4
Continuous Source Current
2,4
Pulsed Source Current
2
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VG=VD=0V , Force Current
VGS=0V , IS=1A , TJ=25℃
IF=11A,dI/dt=100A/µs , TJ=25℃
Min.
Typ.
Max.
Unit
---
---
11
A
---
---
40
A
---
0.7
1.2
V
---
258
---
nS
---
182
---
nC
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper, t≦10sec.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The power dissipation is limited by 150℃ junction temperature
4.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
www.winsok.tw
Page 2
Dec.2014
WSP8212
Dual N-Channel MOSFET
Typical Characteristics
58
20
ID=11A
VGS=5V
53
16
VGS=4.5V
14
VGS=3V
48
43
RDSON (mΩ)
ID Drain Current (A)
18
VGS=2.5V
12
38
10
8
33
VGS=1.8V
6
28
4
18
2
10
0
0
0.25
0.5
0.75
0
1
2
4
VDS , Drain-to-Source Voltage (V)
VGS (V)
6
8
10
Fig.2 On-Resistance vs. Gate-Source
Fig.1 Typical Output Characteristics
7
VDS=10V
ID=11A
IS Source Current(A)
6
5
4
3
2
TJ=150℃
TJ=25℃
1
0
0
0.2
0.4
0.6
0.8
1
VSD , Source-to-Drain Voltage (V)
Fig.3 Forward Characteristics Of Reverse
1.8
Normalized On Resistance
1.8
1.4
1.4
Normalized VGS(th)
Fig.4 Gate-Charge Characteristics
1.0
1
0.6
0.6
0.2
0.2
-50
0
50
100
150
-50
0
50
100
TJ ,Junction Temperature (℃ )
TJ , Junction Temperature (℃)
Fig.5 Normalized VGS(th) vs. TJ
Fig.6 Normalized RDSON vs. TJ
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Page 3
150
Dec.2014
WSP8212
Dual N-Channel MOSFET
1000
100.00
100us
10.00
1ms
100
ID (A)
Capacitance (pF)
Ciss
1.00
Coss
10ms
Crss
100ms
0.10
DC
o
TA=25 C
Single Pulse
F=1.0MHz
10
0
5
10
15
20
VDS , Drain to Source Voltage (V)
0.01
0.01
Fig.7 Capacitance
0.1
1
10
VDS (V)
100
Fig.8 Safe Operating Area
Normalized Thermal Response (RθJA)
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.02
0.01
P DM
0.01
T ON
T
SINGLE
D = TON/T
TJpeak = TA+P DMXRθJA
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.10 Switching Time Waveform
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Fig.11 Gate Charge Waveform
Page 4
Dec.2014
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