WST2066
Dual N-Ch MOSFET
General Description
Product Summery
The WST2066 is the highest performance
trench N-ch MOSFETs with extreme high cell
density , which provide excellent RDSON and
gate charge for most of the small power
switching and load switch applications.
BVDSS
RDSON
ID
20V
16mΩ
7.2A
Applications
The WST2066 meet the RoHS and Green
Product requirement with full function reliability
approved.
z Power management in portable and battery
operated products
z One cell battery pack protection
Features
z ESD:2KV
z Advanced high cell density Trench technology
SOT-23-6L Pin Configuration
z Super Low Gate Charge
z Excellent Cdv/dt effect decline
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
VDS
VGS
ID@TC=25℃
ID@TC=70℃
IDM
Rating
Units
Drain-Source Voltage
20
V
Gate-Source Voltage
±12
V
1
7.2
A
1
5.8
A
20
A
Continuous Drain Current, VGS @ 4.5V
Continuous Drain Current, VGS @ 4.5V
Pulsed Drain Current
2
3
PD@TA=25℃
Total Power Dissipation
1.4
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Typ.
RθJA
Thermal Resistance Junction-ambient
RθJC
1
www.winsok.tw
1
Thermal Resistance Junction-Case
Page 1
---
Max.
150
Unit
℃/W
---
70
℃/W
Dec.2014
WST2066
Dual N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
Static Drain-Source On-Resistance2
Gate Threshold Voltage
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
gfs
Forward Transconductance
Min.
Typ.
Max.
Unit
VGS=0V , ID=250uA
20
---
---
V
Reference to 25℃ , ID=1mA
---
0.028
---
V/℃
VGS=4.5V , ID=6.7A
---
16
18
VGS=2.5V , ID=5.2A
---
20
25
VGS=1.8V , ID=3A
---
30
40
0.3
0.6
1.5
V
---
-3.21
---
mV/℃
VDS=16V , VGS=0V , TJ=25℃
---
---
1
VDS=16V , VGS=0V , TJ=55℃
---
---
5
VGS=±12V , VDS=0V
---
---
±100
nA
---
8
---
S
---
4
6
Ω
---
13
17
---
1.5
2.5
VGS=VDS , ID =250uA
VDS=5V , ID=5A
Rg
Gate Resistance
Qg
Total Gate Charge (4.5V)
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
---
1.8
2.9
Turn-On Delay Time
---
6.1
---
Td(on)
Tr
Td(off)
Tf
Ciss
Coss
Crss
VDS=0V , VGS=0V , f=1MHz
VDS=10V , VGS=4.5V , ID=6.7A
mΩ
uA
nC
Rise Time
VDD=10V , VGEN=4.5V , RG=6Ω
---
9.7
---
Turn-Off Delay Time
ID=1.0A ,RL=30Ω.
---
26
---
Fall Time
---
5.2
---
Input Capacitance
---
610
---
---
140
---
---
130
---
Min.
Typ.
Max.
Unit
---
---
1.0
A
---
---
20
A
---
---
1.3
V
---
18
---
nS
---
12
---
nC
VDS=10V , VGS=0V , f=1MHz
Output Capacitance
Reverse Transfer Capacitance
ns
pF
Diode Characteristics
Symbol
IS
ISM
Parameter
Continuous Source Current
2,4
Pulsed Source Current
2
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Conditions
1,4
Reverse Recovery Charge
VG=VD=0V , Force Current
VGS=0V , ISD=1.3A , TJ=25℃
IF=6.7A,dI/dt=100A/µs , TJ=25℃
Note :
2
1.The data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The power dissipation is limited by 150℃ junction temperature
4.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
www.winsok.tw
Page 2
Dec.2014
WST2066
Dual N-Ch MOSFET
Typical Characteristics
50
ID=6.7A
RDSON (mΩ)
40
30
20
10
1
Fig.1 Typical Output Characteristics
2
VGS3 (V)
4
5
Fig.2 On-Resistance vs. Gate-Source
6
IS Source Current(A)
VDS=10V
ID=6.7A
4
TJ=150℃
TJ=25℃
2
0
0
0.3
0.6
0.9
VSD , Source-to-Drain Voltage (V)
Fig.3 Forward Characteristics of reverse
Fig.4 Gate-Charge Characteristics
1.8
Normalized On Resistance
1.8
1.4
Normalized VGS(th)
1.4
1.0
1
0.6
0.6
0.2
0.2
-50
0
50
100
150
-50
Fig.5 VGS(th) vs. TJ
www.winsok.tw
0
50
100
150
TJ , Junction Temperature (℃)
TJ ,Junction Temperature (℃ )
Fig.6 Normalized RDSON vs. TJ
Page 3
Dec.2014
WST2066
Dual N-Ch MOSFET
10000
Capacitance (pF)
F=1.0MHz
Ciss
1000
Coss
100
Crss
10
1
5
9
13
17
21
VDS Drain to Source Voltage (V)
Fig.7 Capacitance
Fig.8 Safe Operating Area
Normalized Thermal Response (RθJA)
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.02
0.01
P DM
0.01
T ON
T
SINGLE
D = TON/T
TJpeak = TC+P DMXRθJC
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.10 Switching Time Waveform
www.winsok.tw
Fig.11 Gate Charge Waveform
Page 4
Dec.2014
Attention
1,AnyandallWinsokpowerproductsdescribedorcontainedhereindonothavespecificationsthatcanhandle
applicationsthatrequireextremelyhighlevelsofreliability,suchaslifeͲsupportsystems,aircraft'scontrolsystems,or
otherapplicationswhosefailurecanbereasonablyexpectedtoresultinseriousphysicaland/ormaterialdamage.
ConsultwithyourWinsokpowerrepresentativenearestyoubeforeusinganyWinsokpowerproductsdescribedor
containedhereininsuchapplications.
2,Winsokpowerassumesnoresponsibilityforequipmentfailuresthatresultfromusingproductsatvaluesthatexceed,
evenmomentarily,ratedvalues(suchasmaximumratings,operatingconditionranges,orotherparameters)listedin
productsspecificationsofanyandallWinsokpowerproductsdescribedorcontainedherein.
3,SpecificationsofanyandallWinsokpowerproductsdescribedorcontainedhereinstipulatetheperformance,
characteristics,andfunctionsofthedescribedproductsintheindependentstate,andarenotguaranteesofthe
performance,characteristics,andfunctionsofthedescribedproductsasmountedinthecustomer’sproductsor
equipment.Toverifysymptomsandstatesthatcannotbeevaluatedinanindependentdevice,thecustomershouldalways
evaluateandtestdevicesmountedinthecustomer’sproductsorequipment.
4,WinsokpowerSemiconductorCO.,LTD.strivestosupplyhighͲqualityhighͲreliabilityproducts.However,anyandall
semiconductorproductsfailwithsomeprobability.Itispossiblethattheseprobabilisticfailurescouldgiverisetoaccidents
oreventsthatcouldendangerhumanlivesthatcouldgiverisetosmokeorfire,orthatcouldcausedamagetoother
property.Whendesigningequipment,adoptsafetymeasuressothatthesekindsofaccidentsoreventscannotoccur.Such
measuresincludebutarenotlimitedtoprotectivecircuitsanderrorpreventioncircuitsforsafedesign,redundantdesign,
andstructuraldesign.
5,IntheeventthatanyorallWinsokpowerproducts(includingtechnicaldata,services)describedorcontainedhereinare
controlledunderanyofapplicablelocalexportcontrollawsandregulations,suchproductsmustnotbeexportedwithout
obtainingtheexportlicensefromtheauthoritiesconcernedinaccordancewiththeabovelaw.
6,Nopartofthispublicationmaybereproducedortransmittedinanyformorbyanymeans,electronicormechanical,
includingphotocopyingandrecording,oranyinformationstorageorretrievalsystem,orotherwise,withouttheprior
writtenpermissionofWinsokpowerSemiconductorCO.,LTD.
7,Information(includingcircuitdiagramsandcircuitparameters)hereinisforexampleonly;itisnotguaranteedfor
volumeproduction. Winsokpowerbelievesinformationhereinisaccurateandreliable,butnoguaranteesaremadeor
impliedregardingitsuseoranyinfringementsofintellectualpropertyrightsorotherrightsofthirdparties.
8,Anyandallinformationdescribedorcontainedhereinaresubjecttochangewithoutnoticeduetoproduct/technology
improvement,etc.Whendesigningequipment,refertothe"DeliverySpecification"fortheWinsokpowerproductthatyou
Intendtouse.
9,thiscatalogprovidesinformationasofSep.2014. Specificationsandinformationhereinaresubjecttochangewithout
notice.