Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 1 of 17
S P E C I F I C AT I O N S
Customer
Product Name
Multi-layer Chip Ferrite Bead
Sunlord Part Number
GZ Series
Customer Part Number
[
New Released,
Revised]
SPEC No.: GZ10130000
【This SPEC is total 17 pages including specifications and appendix.】
【ROHS Compliant Parts】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110
Tel: 0086-755-29832660
Fax: 0086-755-82269029
E-Mail: sunlord@sunlordinc.com
【For Customer approval Only】
Qualification Status:
Full
Approved By
Comments:
Verified By
Date:
Restricted
Rejected
Re-checked By
Checked By
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 2 of 17
【Version change history】
Rev.
Effective Date
Changed Contents
Change Reasons
Approved By
01
/
New release
/
Hai Guo
Sunlord
1.
Specifications for Multi-layer Chip Ferrite Bead
Page 3 of 17
Scope
This specification applies to GZ Series of multi-layer ferrite chip bead.
2.
Product Description and Identification (Part Number)
1)
Description:
GZ Series of multi-layer ferrite chip bead.
2)
Product Identification (Part Number)
GZ
※※※※
①
②
〇
XXX
◎
F
③
④
⑤
⑥
Type
①
GZ
For General Use
Material Code
③
D, U, E
Packing
⑤
T
External Dimensions
②
0603 [0201]
0.6 X 0.3
1005 [0402]
1.0 X 0.5
1608 [0603]
1.6 X 0.8
2012 [0805]
2.0 X 1.25
3216 [1206]
3.2 X 1.6
Tape Carrier Package
Nominal
④
Impedance
Example
Nominal Value
300
30Ω
121
120Ω
HSF Products
⑥
Hazardous Substance Free Products
3.
(L X W)[mm]
Electrical Characteristics
Please refer to Appendix A (Page 9~17).
4.
1)
Operating and storage temperature range (individual chip without packing): -55℃ ~ +125℃.
2)
Storage temperature range (packaging conditions):-10℃~+40℃ and RH 70% (Max.)
Shape and Dimensions
1)
Dimensions and recommended PCB pattern for reflow soldering: See Fig.4-1, Fig.4-2 and Table 4-1.
2)
Structure: See Fig. 4-3 and Fig. 4-4.
Solder-resist
Chip Bead
C
Land pattern
B
A
B
Fig. 4-2
Fig. 4-1
Unit: mm [inch]
[Table 4-1]
Type
0603
[0201]
1005
[0402]
L
0.6±0.05
[.024±0.002]
1.0±0.15
[0.039±0.006]
W
0.3±0.05
[.012±.002]
0.5±0.15
[0.020±0.006]
T
0.3±0.05
[.012±.002]
0.5±0.15
[0.020±0.006]
a
0.15±0.05
[.006±.002]
0.25±0.1
[0.010±0.004]
1608
[0603]
1.6±0.15
[0.063±0.006]
0.8±0.15
[0.031±0.006]
0.8±0.15
[0.031±0.006]
0.3±0.2
[0.012±0.008]
1.25±0.2
[0.049±0.008]
1.6±0.2
[0.063±0.008]
0.85±0.2
[0.033±0.008]
0.85±0.2
[0.033±0.008]
0.5±0.3
[0.020±0.012]
0.5±0.3
[0.020±0.012]
2.0 (+0.3, -0.1)
[0.079(+0.012,-0.004)]
3.2±0.2
[0.126±0.008]
L
a
④-2
Ni
④-1
Ag
W
②
③
Fig. 4-3
④
0.2~0.3
0.2~0.3
0.3~0.35
0.45~0.55
0.40~0.50
0.45~0.55
0.60~0.80
0.60~0.80
0.60~0.80
0.80~1.20
0.80~1.20
0.90~1.60
1.80~2.50
1.00~1.50
1.20~2.00
① Ferrite for Bead Series
Ferrite
Sn
①
C
② Internal electrode (Ag)
T
a
B
Structure of
Electro-plating
T
2012
[0805]
3216
[1206]
A
③ Pull out electrode( Ag)
④-1 Terminal electrode: Inside (Ag)
④-2 Outside (Electro-plating Ni-Sn)
Fig. 4-4
Sunlord
3)
Specifications for Multi-layer Chip Ferrite Bead
Page 4 of 17
Material Information: See Table 4-2.
[Table 4-2]
Part Name
Material Name
①
Ferrite Body
Ferrite Powder
②
Inner Coils
Silver Paste
③
Pull-out Electrode (Ag)
Silver Paste
④-1
Terminal Electrode: Inside Ag
④-2
Electro-Plating: Ni/Sn plating
Termination Silver
Composition
Plating Chemicals
Test and Measurement Procedures
5.1 Test Conditions
5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a.
Ambient Temperature: 20±15℃
b.
Relative Humidity: 65±20%
c.
Air Pressure: 86kPa to 106kPa
5.1.2 If any doubt on the results, measurements/tests should be made within the following limits:
a.
Ambient Temperature: 20±2℃
b.
Relative Humidity: 65±5%
c.
Air Pressure: 86kPa to 106kPa
5.2 Visual Examination
a.
Inspection Equipment: 20× magnifier
5.3 Electrical Test
5.3.1 DC Resistance (DCR)
a.
Refer to Appendix A.
b.
Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent.
5.3.2 Impedance (Z)
a.
b.
Refer to Appendix A.
Test equipment: High Accuracy RF Impedance /Material Analyzer-E4991A or equivalent.
Test fixture: HP16197A for 0603, HP16192A for 1005/1608/2012/3216.
Test signal: -20dBm or 50mV
c.
Test frequency refers to Appendix A.
5.3.3 Rated Current
a.
Refer to Appendix A.
b.
Test equipment (see Fig.5.3.3-1): Electric Power, Electric current meter, Thermometer.
c.
Measurement method (see Fig. 5.3.3-1):
1. Set test current to be 0 mA.
2. Measure initial temperature of chip surface.
3. Gradually increase voltage and measure chip temperature for corresponding current.
d.
Definition of Rated Current (Ir): Ir is direct electric current as chip surface temperature rose just 20℃
against chip initial surface temperature (Ta) (see Fig. 5.3.3-2)
Thermometer
Electric Power
Electric Current
Meter
Temperature (℃)
+20
Ta
Chip
0
R
Rated current
Fig. 5.3.3-1
e. When operating temperatures exceeding +85℃, derating of
current is necessary for chip ferrite beads for which rated
current is 1000mA over. Please apply the derating curve
shown in chart according to the operating temperature.
Ir (mA)
Fig. 5.3.3-2
3
Derated Current [A]
5.
Code
2.2
2
1.5
1
0
0
50
85
100
125
Operating Temperature[℃]
150
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 5 of 17
5.4 Reliability Test
Items
Requirements
Test Methods and Remarks
5.4.1
No removal or split of the termination or other
Terminal
defects shall occur.
Strength
①
Solder the bead to the testing jig (glass epoxy board shown in
Fig. 5.4.1-1) using leadfree solder. Then apply a force in the
direction of the arrow.
Chip
②
F
Mounting Pad
2N force for 0603 series, 5N force for 1005 and 1608 series
10N force for 2012 and 3216 series.
Glass Epoxy Board
③
Keep time: 10±1s.
④
Speed: 1.0mm/s.
①
Solder the bead to the test jig (glass epoxy board shown in Fig.
Fig.5.4.1-1
5.4.2
Resistance
No visible mechanical damage.
to
5.4.2-1) Using a leadfree solder. Then apply a force in the
Unit: mm [inch]
Flexure
Type
a
b
c
0603[0201]
0.25
0.8
0.3
1005[0402]
0.4
1.5
0.5
1608[0603]
1.0
3.0
1.2
2012[0805]
1.2
4.0
1.65
3216[1206]
2.2
5.0
2.0
direction shown Fig. 5.4.2-2.
②
Flexure: 2mm.
③
Pressurizing Speed: 0.5mm/sec.
④
Keep time: 30 sec.
20
Φ4.5
b
R230
Flexure
40
c
a
①
No visible mechanical damage.
Vibration
②
Impedance change: within ±20%
Cu pad
Solder mask
45[1.772]
45[1.772]
100
Fig. 5.4.2-1
5.4.3
10
Fig. 5.4.2-2
①
Solder the bead to the testing jig (glass epoxy board
shown in Fig. 5.4.3-1) using leadfree solder.
②
The bead shall be subjected to a simple harmonic motion
having total amplitude of 1.5 mm, the frequency being varied
uniformly between the approximate limits of 10 and 55 Hz.
③
The frequency range from 10 to 55 Hz and return to 10 Hz shall
be traversed in approximately 1 minute. This motion shall be
applied for a period of 2 hours in each 3mutually perpendicular
directions (total of 6 hours).
Glass Epoxy Board
Fig. 5.4.3-1
5.4.4 Dropping
①
No visible mechanical damage.
②
Impedance change: within ±20%.
Drop chip bead 10 times on a concrete floor from a height of 100 cm.
5.4.5
Impedance change should be within ±20% of
Temperature range: -55℃ ~ 125℃.
Temperature
initial value measuring at 20℃.
Reference temperature: +20℃.
5.4.6
①
No visible mechanical damage.
①
Solder temperture:240±2℃
Solderability
②
Wetting shall exceed 75% coverage for
②
Duration: 3 sec.
0603 series; exceed 95% for others
③
Solder: Sn/3.0Ag/0.5Cu.
④
Flux: 25% Resin and 75% ethanol in weight.
5.4.7
①
No visible mechanical damage.
①
Solder temperature :260±3℃
Resistance to
②
Wetting shall exceed 75% coverage for
②
Duration: 5 sec.
0603 series; exceed 95% for others
③
Solder: Sn/3.0Ag/0.5Cu.
Impedance change: within ±20%.
④
Flux: 25% Resin and 75% ethanol in weight.
⑤
The chip shall be stabilized at normal condition for 1~2 hours
Soldering Heat
③
before measuring.
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
5.4.8
①
No mechanical damage.
Thermal Shock
②
Impedance change: Within ±20%.
30 min.
125℃
Page 6 of 17
①
Temperature, Time: (See Fig.5.4.8-1)
②
Transforming interval: Max. 20 sec.
③
Tested cycle: 100 cycles.
④
The chip shall be stabilized at normal condition for 1~2 hours
-55℃ for 30±3 min→125℃ for 30±3min.
30 min.
Ambient
before measuring.
Temperature
30 min.
-55℃
20sec. (max.)
Fig. 5.4.8-1
5.4.9
①
No mechanical damage.
①
Temperature: -55±2℃
Resistance to
②
Impedance change: within ±20%.
②
Duration: 1000
③
The chip shall be stabilized at normal condition for 1~2 hours
Low
+24
hours.
before measuring.
Temperature
5.4.10
①
No mechanical damage.
①
Temperature: 125±2℃
Resistance to
②
Impedance change: within ±20%.
②
Duration: 1000
③
The chip shall be stabilized at normal condition for 1~2 hours
High
+24
hours.
before measuring.
Temperature
5.4.11
①
No mechanical damage.
①
Temperature: 60±2℃
Damp Heat
②
Impedance change: Within ±20%.
②
Humidity: 90% to 95% RH.
③
Duration: 1000
④
The chip shall be stabilized at normal condition for 1~2 hours
(Steady States)
+24
hours.
before measuring.
5.4.12
①
No visible mechanical damage.
①
Temperature: 60±2℃
Loading Under
②
Impedance change: within ±20%.
②
Humidity: 90% to 95% RH.
③
Duration: 1000
④
Applied current: Rated current.
⑤
The chip shall be stabilized at normal condition for 1~2 hours
Damp Heat
+24
hours.
before measuring.
5.4.13
①
No visible mechanical damage.
①
Temperature: 125±2℃
Loading at High
②
Impedance change: within ±20%.
②
Duration: 1000
Temperature
③
Applied current: Rated current.
(Life Test)
④
The chip shall be stabilized at normal condition for 1~2 hours
+24
hours.
before measuring.
6.
Packaging, Storage
6.1 Packaging
Tape Carrier Packaging:
Packaging code: T
a.
Tape carrier packaging are specified in attached figure Fig.6.1-1~3
b.
Tape carrier packaging quantity please see the following table:
Type
0603[0201]
1005[0402]
1608[0603]
2012[0805]
T(mm)
0.3±0.15
0.5±0.15
0.8±0.15
0.85±0.2
0.85±0.2
Tape
Paper Tape
Paper Tape
Paper Tape
Paper Tape
Paper Tape
Quantity
15K
10K
4K
4K
3K
(1) Taping Drawings (Unit: mm)
Paper Tape
Top Tape
Paper Tape
Sprocket Hole
Bottom Tape
Chip Cavity
Fig. 6.1-1
Remark: The sprocket holes are to the right as the tape is pulled toward the user.
3216[1206]
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 7 of 17
(2) Taping Dimensions (Unit: mm)
Sprocket Hole Φ1.5 (+0.1,0)
Chip Cavity
Paper Tape
1.75±0.1
Type
B
P
8.0±0.3
3.5±0.05
A
T
4.0±0.1
A
B
P
T max
0603[0201]
0.40±0.1
0.70±0.1
2.0±0.1
0.55
1005[0402]
0.65±0.1
1.15±0.1
2.0±0.05
0.8
1608[0603]
1.0±0.2
1.8±0.2
4.0±0.1
1.1
2012[0805]
1.5±0.2
2.3±0.2
4.0±0.1
1.1
3216[1206]
1.9±0.2
3.5±0.2
4.0±0.1
1.1
Fig. 6.1-2
Direction of Feed
(3) Reel Dimensions (Unit: mm)
4.3±0.2mm
8.4+1.5/-0.0mm
2.45±0.2mm
4.0±0.1mm
5.0±0.1mm
58±2.0mm
13.5±0.2mm
3.0±0.1mm
max<14.4mm
178±2.0mm
Fig. 6.1-3
6.2 Storage
a.
The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity.
Package must be stored at 40℃ or less and 70% RH or less.
b.
The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas
(e.g. HCl, sulfurous gas of H2S).
c.
d.
Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight.
Solderability of the product s with external dimensions as 0603[0201] specified in Clause 5.4.6 shall be guaranteed for 6months from
the date of delivery on condition that they are stored at the environment specified in Clause 3. For those parts, which passed more
than 6 months shall be checked solder-ability before use.
e.
Solderability of the products, except ones with external dimensions as 0603[0201], specified in Clause 5.4.6 shall be guaranteed for
12 months from the date of delivery on condition that they are stored at the environment specified in Clause 3. For those parts, which
passed more than 12 months shall be checked solder-ability before use.
7.
Recommended Soldering Technologies
7.1 Re-flowing Profile:
△
Preheat condition: 150 ~200℃/60~120sec.
△
Allowed time above 217℃: 60~90sec.
△
Max temp: 260℃
△
Max time at max temp: 10sec.
△
Solder paste: Sn/3.0Ag/0.5Cu
△
Allowed Reflow time: 2x max
[Note: The reflow profile in the above table is only for
217℃
the customer's specific board design, solder paste and
process, and should not exceed the parameters as the
Reflow profile shows.]
Max Ramp Up Rate=3℃/sec.
Max Ramp Down Rate=6℃/sec.
60~90sec.
200℃
150℃
60~120sec.
qualification and is not meant to specify board assembly
profiles. Actual board assembly profiles must be based on
Peak 260℃ max
260℃
25℃
Time 25℃ to Peak =8 min max
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
7.2 Iron Soldering Profile.
3sec. Max.
Iron soldering power: Max.30W
△
△
Pre-heating: 150 ℃ / 60sec.
△
Soldering Tip temperature: 350℃Max.
△
Soldering time: 3sec Max.
△
Solder paste: Sn/3.0Ag/0.5Cu
△
Max.1 times for iron soldering
350℃
Soldering Iron
Power: max. 30W
Diameter of Soldering
[Note: Take care not to apply the tip of
the soldering iron to the terminal electrodes.]
8.
Iron 1.0mm max.
Tc ℃
Supplier Information
a) Supplier:
Shenzhen Sunlord Electronics Co., Ltd.
b) Manufacture:
Shenzhen Sunlord Electronics Co., Ltd.
c)
Page 8 of 17
Manufacturing Address:
Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China
518110
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 9 of 17
Appendix A: Electrical Characteristics
I. GZ0603 Series of Beads
Z Test Freq.
DCR
Ir
Thickness
(MHz)
(Ω) Max.
(mA) Max.
(mm) [inch]
60±25%
100
0.40
200
80±25%
100
0.60
200
GZ0603D121TF
120±25%
100
0.80
200
GZ0603D241TF
240±25%
100
1.00
200
GZ0603D601TF
600±25%
100
1.70
200
Part Number
Impedance (Ω)
GZ0603D600TF
GZ0603D800TF
0.3±0.05
[.012±.002]
I. GZ1005 Series of Beads
Z Test Freq.
DCR
Ir
Thickness
(MHz)
(Ω) Max.
(mA) Max.
(mm) [inch]
0~15
100
0.05
500
GZ1005D310TF
31±25%
100
0.20
300
GZ1005D600TF
60±25%
100
0.30
200
GZ1005D800TF
80±25%
100
0.35
200
GZ1005D121TF
120±25%
100
0.40
200
GZ1005D221TF
220±25%
100
0.45
150
GZ1005D301TF
300±25%
100
0.50
100
GZ1005D421TF
420±25%
100
0.60
100
GZ1005D501TF
500±25%
100
0.80
100
GZ1005D601TF
600±25%
100
0.90
100
Part Number
Impedance (Ω)
GZ1005D100TF
GZ1005D751TF
750±25%
100
1.00
100
GZ1005D102TF
1000±25%
100
1.20
100
GZ1005D152TF
1500±25%
100
1.60
100
0.5±0.15
GZ1005E800TF
80±25%
100
0.35
200
[.020±.006]
GZ1005E121TF
120±25%
100
0.40
200
GZ1005E241TF
240±25%
100
0.50
200
GZ1005E601TF
600±25%
100
0.90
100
GZ1005U100TF
0~15
100
0.05
500
GZ1005U300TF
30±25%
100
0.20
300
GZ1005U700TF
70±25%
100
0.30
200
GZ1005U121TF
120±25%
100
0.40
200
GZ1005U221TF
220±25%
100
0.50
100
GZ1005U301TF
300±25%
100
0.60
100
GZ1005U421TF
420±25%
100
0.80
100
GZ1005U601TF
600±25%
100
0.90
100
GZ1005U102TF
1000±25%
100
1.20
100
II. GZ1608 Series of Beads
Part Number
Impedance (Ω)
Z Test Freq.
DCR
Ir
Thickness
(MHz)
(Ω) Max.
(mA) Max.
(mm) [inch]
GZ1608D110TF
0~15
100
0.05
2000
GZ1608D300TF
30±25%
100
0.05
2000
GZ1608D600TF
60±25%
100
0.10
500
GZ1608D800TF
80±25%
100
0.15
400
GZ1608D101TF
100±25%
100
0.20
300
GZ1608D121TF
120±25%
100
0.20
300
GZ1608D221TF
220±25%
100
0.30
300
GZ1608D301TF
300±25%
100
0.35
200
GZ1608D471TF
470±25%
100
0.45
200
GZ1608D601TF
600±25%
100
0.45
200
GZ1608D751TF
750±25%
100
0.50
200
GZ1608D102TF
1000±25%
100
0.60
200
GZ1608D152TF
1500±25%
100
0.70
150
GZ1608D182TF
1800±25%
100
0.90
100
GZ1608D202TF
2000±25%
100
1.20
100
GZ1608D222TF
2200±25%
100
1.20
100
GZ1608E121TF
120±25%
100
0.20
300
0.8±0.15
[.031±.006]
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 10 of 17
Z Test Freq.
DCR
Ir
Thickness
(MHz)
(Ω) Max.
(mA) Max.
(mm) [inch]
180±25%
100
0.30
300
600±25%
100
0.45
200
1000±25%
100
0.60
200
GZ1608U100TF
0~15
100
0.05
2000
GZ1608U300TF
30±25%
100
0.05
2000
Part Number
Impedance (Ω)
GZ1608E181TF
GZ1608E601TF
GZ1608E102TF
GZ1608U600TF
60±25%
100
0.10
500
0.8±0.15
GZ1608U121TF
120±25%
100
0.20
300
[.031±.006]
GZ1608U221TF
220±25%
100
0.30
300
GZ1608U301TF
300±25%
100
0.35
200
GZ1608U471TF
470±25%
100
0.40
200
GZ1608U601TF
600±25%
100
0.50
200
GZ1608U102TF
1000±25%
100
0.60
200
III. GZ2012 Series of Beads
Part Number
Impedance (Ω)
Z Test Freq.
DCR
Ir
Thickness
(MHz)
(Ω) Max.
(mA) Max.
(mm) [inch]
GZ2012D070TF
0~15
100
0.04
2000
GZ2012D190TF
19±25%
100
0.04
2000
GZ2012D300TF
30±25%
100
0.05
1500
GZ2012D800TF
80±25%
100
0.10
1000
GZ2012D121TF
120±25%
100
0.15
800
GZ2012D181TF
180±25%
100
0.18
700
GZ2012D221TF
220±25%
100
0.20
600
GZ2012D301TF
300±25%
100
0.20
500
GZ2012D421TF
420±25%
100
0.30
500
GZ2012D501TF
500±25%
100
0.30
500
GZ2012D601TF
600±25%
100
0.30
500
GZ2012D751TF
750±25%
100
0.35
500
GZ2012D102TF
1000±25%
100
0.35
500
GZ2012D152TF
1500±25%
100
0.40
500
GZ2012D202TF
2000±25%
100
0.50
500
GZ2012E800TF
80±25%
100
0.10
1000
GZ2012E181TF
180±25%
100
0.20
600
GZ2012E301TF
300±25%
100
0.20
500
GZ2012E501TF
500±25%
100
0.30
500
GZ2012E601TF
600±25%
100
0.30
500
GZ2012E102TF
1000±25%
100
0.35
500
GZ2012U100TF
0~15
100
0.04
2200
GZ2012U170TF
17±25%
100
0.04
2000
GZ2012U300TF
30±25%
100
0.05
1500
GZ2012U700TF
70±25%
100
0.10
1000
GZ2012U121TF
120±25%
100
0.15
800
GZ2012U221TF
220±25%
100
0.20
600
GZ2012U301TF
300±25%
100
0.20
500
GZ2012U421TF
420±25%
100
0.25
500
GZ2012U601TF
600±25%
100
0.30
500
GZ2012U102TF
1000±25%
100
0.40
500
0.85±0.2
[.033±.008]
IV. GZ 3216 Series of Beads
Z Test Freq.
DCR
Ir
Thickness
(MHz)
(Ω) Max.
(mA) Max.
(mm) [inch]
0~15
100
0.03
2200
0.85±0.2
GZ3216D310TF
31±25%
100
0.05
2000
[.033±.008]
GZ3216D600TF
60±25%
100
0.10
1000
GZ3216D800TF
80±25%
100
0.10
1000
GZ3216D121TF
120±25%
100
0.10
1000
GZ3216D221TF
220±25%
100
0.20
600
GZ3216D301TF
300±25%
100
0.20
600
GZ3216D501TF
500±25%
100
0.30
600
GZ3216D601TF
600±25%
100
0.30
600
Part Number
Impedance (Ω)
GZ3216D000TF
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 11 of 17
Z Test Freq.
DCR
Ir
(MHz)
(Ω) Max.
(mA) Max.
1000±25%
100
0.60
500
1200±25%
100
0.60
300
600±25%
100
0.30
600
Part Number
Impedance (Ω)
GZ3216D102TF
GZ3216D122TF
GZ3216U601TF
Products with other electrical characteristic can be provided upon customer’s request. Please contact your local sales.
D, E, U Material Comparison
250
200
Impedance(Ω )
GZ1608E121TF
150
GZ1608D121TF
100
GZ1608U121TF
50
0
1
10
100
1000
3000
Frequency(MHz)
Impedance Frequency Characteristics
GZ0603 series
GZ0603D800TF
GZ0603D600TF
Impedance(Ω)
Impedance(Ω)
R
100
Z
Z
150
Z
Impedance(Ω)
150
R
100
50
50
1
10
100
1000
Frequency(MHz)
0
3000
200
R
100
X
X
0
GZ0603D121TF
300
200
200
1
10
100
1000
X
3000
0
Frequency(MHz)
GZ0603D241TF
1
10
100
1000
3000
Frequency(MHz)
GZ0603D601TF
600
1200
Z
Z
900
Impedance(Ω)
Impedance(Ω)
450
R
300
150
R
600
300
X
0
1
10
100
X
1000
3000
0
Frequency(MHz)
1
10
100
1000
3000
Frequency(MHz)
GZ1005 series
GZ1005D310TF
GZ1005D100TF
GZ1005D600TF
80
30
120
Z
R
10
X
90
Impedance(Ω)
Impedance(Ω)
Impedance(Ω)
60
20
Z
40
R
X
20
Z
R
60
30
X
1
10
100
1000
3000
1
10
GZ1005D800TF
1000
0
3000
10
Z
R
50
1000
3000
1000
3000
GZ1005D221TF
400
Z
180
Impedance(Ω)
150
100
Frequency(MHz)
240
100
1
GZ1005D121TF
200
Impedance(Ω)
100
Frequency(MHz)
Frequency(MHz)
300
Impedance(Ω)
0
0
R
120
60
R
200
100
X
X
Z
X
0
1
10
100
Frequency(MHz)
1000
3000
0
1
10
100
Frequency(MHz)
1000
3000
0
1
10
100
Frequency(MHz)
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 12 of 17
GZ1005 series
GZ1005D301TF
GZ1005D501TF
GZ1005D421TF
500
800
800
Z
400
R
R
400
200
10
100
1000
0
3000
1
10
Frequency(MHz)
100
1000
GZ1005D601TF
1000
3000
1000
3000
1000
3000
1000
3000
1000
3000
GZ1005D102TF
1200
Z
Impedance(Ω)
Impedance(Ω)
R
100
1500
900
R
600
250
Z
900
R
600
300
1
10
300
X
X
100
1000
0
3000
Frequency(MHz)
1
10
100
1000
GZ1005D152TF
Impedance(Ω)
Impedance(Ω)
500
100
GZ1005E121TF
Z
Z
150
R
80
R
100
40
50
X
X
10
10
200
120
R
1
1
GZ1005E800TF
Z
1000
X
Frequency(MHz)
160
1500
0
3000
Frequency(MHz)
2000
0
10
GZ1005D751TF
Z
500
1
Frequency(MHz)
1200
750
0
3000
Frequency(MHz)
1000
0
X
Impedance(Ω)
1
200
X
Impedance(Ω)
0
R
400
200
X
100
Impedance(Ω)
Z
Impedance(Ω)
Impedance(Ω)
300
Z
600
600
100
1000
0
3000
Frequency(MHz)
1
10
100
X
1000
0
3000
1
10
Frequency(MHz)
GZ1005E241TF
GZ1005E601TF
400
100
Frequency(MHz)
GZ1005U100TF
1000
12
Z
750
200
R
500
100
250
1
10
R
6
X
3
X
X
0
Impedance(Ω)
R
Z
9
Z
Impedance(Ω)
Impedance(Ω)
300
100
1000
0
3000
1
10
Frequency(MHz)
100
1000
0
3000
1
10
Frequency(MHz)
GZ1005U300TF
GZ1005U121TF
GZ1005U700TF
50
100
Frequency(MHz)
120
200
90
30
R
20
10
0
10
100
Frequency(MHz)
R
60
Z
R
100
30
X
1
150
Z
Impedance(Ω)
Z
Impedance(Ω)
Impedance(Ω)
40
50
X
1000
3000
0
1
10
100
Frequency(MHz)
X
1000
3000
0
1
10
100
Frequency(MHz)
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 13 of 17
GZ1005 series
GZ1005U221TF
Z
100
450
R
200
R
Z
Z
Impedance(Ω)
300
600
Impedance(Ω)
300
Impedance(Ω)
400
200
GZ1005U421TF
GZ1005U301TF
400
100
150
X
X
0
1
10
R
300
100
1000
0
3000
1
10
X
100
Frequency(MHz)
1000
0
3000
1
10
Frequency(MHz)
GZ1005U601TF
100
1000
3000
Frequency(MHz)
GZ1005U102TF
800
1200
600
R
400
Z
900
Impedance(Ω)
Impedance(Ω)
Z
R
600
200
300
X
0
1
10
X
100
1000
3000
0
Frequency(MHz)
1
10
100
1000
3000
Frequency(MHz)
GZ1608 series
GZ1608D110TF
Z
R
5
X
80
120
60
90
Impedance(Ω)
10
Impedance(Ω)
Impedance(Ω)
GZ1608D600TF
GZ1608D300TF
15
Z
R
40
20
Z
R
60
30
X
1
10
100
1000
0
3000
1
10
Frequency(MHz)
GZ1608D800TF
1000
10
100
3000
1000
3000
1000
3000
GZ1608D121TF
250
150
Z
Impedance(Ω)
R
Z
150
R
100
40
R
100
50
50
X
10
100
1000
0
3000
1
10
GZ1608D221TF
0
3000
1
10
375
Z
100
600
Z
R
250
R
GZ1608D471TF
800
Impedance(Ω)
300
100
Frequency(MHz)
GZ1608D301TF
500
Impedance(Ω)
X
1000
Frequency(MHz)
400
200
100
Z
Impedance(Ω)
1
X
Frequency(MHz)
R
400
125
200
X
X
X
0
1000
200
Z
80
1
Frequency(MHz)
200
120
0
0
3000
GZ1608D101TF
160
Impedance(Ω)
100
Frequency(MHz)
Impedance(Ω)
0
X
1
10
100
Frequency(MHz)
1000
3000
0
1
10
100
Frequency(MHz)
1000
3000
0
1
10
100
Frequency(MHz)
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 14 of 17
GZ1608 series
GZ1608D751TF
GZ1608D601TF
600
1200
750
R
R
500
200
250
10
300
X
X
100
1000
0
1
3000
10
Frequency(MHz)
100
3000
1800
Impedance(Ω)
Impedance(Ω)
500
R
600
100
1000
3000
1
10
X
100
0
3000
1000
Frequency(MHz)
GZ1608D222TF
R
600
X
Frequency(MHz)
Z
1200
X
0
1
10
100
1000
3000
1000
3000
1000
3000
300
Z
240
180
Impedance(Ω)
R
Z
Z
Impedance(Ω)
Impedance(Ω)
3000
GZ1608E181TF
240
1500
1000
Frequency(MHz)
GZ1608E121TF
2500
3000
GZ1608D202TF
Z
1200
R
1000
2400
1800
Z
2000
100
Impedance(Ω)
1500
10
10
Frequency(MHz)
2400
1
1
GZ1608D182TF
GZ1608D152TF
0
0
1000
Frequency(MHz)
2000
1000
R
600
X
1
Z
900
Z
Impedance(Ω)
Impedance(Ω)
Z
400
0
GZ1608D102TF
1000
Impedance(Ω)
800
R
180
120
1000
R
120
60
500
1
10
100
1000
0
3000
1
10
Frequency(MHz)
100
3000
Z
900
R
GZ1608U100TF
Z
Z
R
600
200
100
15
Impedance(Ω)
Impedance(Ω)
10
Frequency(MHz)
1200
400
1
GZ1608E102TF
GZ1608E601TF
600
X
Frequency(MHz)
800
10
R
5
300
X
X
0
1000
0
Impedance(Ω)
0
60
X
X
1
10
X
100
1000
0
3000
1
10
Frequency(MHz)
100
1000
0
3000
1
10
Frequency(MHz)
GZ1608U300TF
GZ1608U121TF
GZ1608U600TF
60
80
45
60
100
Frequency(MHz)
200
Z
30
R
15
R
40
20
1
10
100
50
X
1000
0
3000
1
10
Frequency(MHz)
100
X
1000
0
3000
GZ1608U221TF
GZ1608U301TF
GZ1608U471TF
Impedance(Ω)
Impedance(Ω)
Z
300
R
450
R
Frequency(MHz)
R
150
100
X
100
Z
300
200
100
100
600
Impedance(Ω)
Z
200
10
10
Frequency(MHz)
400
1
1
Frequency(MHz)
300
0
R
100
X
0
Z
150
Impedance(Ω)
Impedance(Ω)
Impedance(Ω)
Z
X
1000
3000
0
1
10
100
Frequency(MHz)
X
1000
3000
0
1
10
100
Frequency(MHz)
1000
3000
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 15 of 17
GZ1608 series
GZ1608U102TF
GZ1608U601TF
800
1200
600
900
Z
Impedance(Ω)
Impedance(Ω)
Z
R
400
R
600
200
300
X
X
0
1
10
100
1000
0
3000
1
10
Frequency(MHz)
100
1000
3000
Frequency(MHz)
GZ2012 series
60
60
45
Impedance(Ω)
10
R
5
X
30
R
15
1
10
100
1000
0
3000
10
100
1000
10
100
3000
1000
3000
1000
3000
300
R
120
Z
200
60
40
1000
GZ2012D181TF
Z
Impedance(Ω)
R
3000
400
180
Z
1000
Frequency(MHz)
240
80
1
GZ2012D121TF
GZ2012D800TF
160
120
0
3000
X
Frequency(MHz)
Frequency(MHz)
Impedance(Ω)
15
X
1
R
30
Impedance(Ω)
0
Z
45
Z
Impedance(Ω)
Z
Impedance(Ω)
GZ2012D300TF
GZ2012D190TF
GZ2012D070TF
15
R
100
X
X
X
0
1
10
100
1000
3000
1
10
100
1000
300
450
Z
Impedance(Ω)
Impedance(Ω)
R
250
100
125
10
100
X
X
1000
0
3000
1
10
100
1000
GZ2012D501TF
GZ2012D751TF
750
R
400
150
R
500
200
250
X
X
X
1000
0
3000
1
10
Frequency(MHz)
100
1000
0
3000
1
10
Frequency(MHz)
GZ2012D102TF
GZ2012D202TF
2000
Z
2500
2000
1500
1500
R
1000
300
Z
Impedance(Ω)
Z
Impedance(Ω)
R
600
R
1000
500
500
X
X
X
0
100
Frequency(MHz)
GZ2012D152TF
1200
Impedance(Ω)
Z
Impedance(Ω)
Z
Impedance(Ω)
Impedance(Ω)
300
100
1000
600
R
900
10
GZ2012D601TF
Z
100
1
Frequency(MHz)
800
10
0
3000
Frequency(MHz)
600
1
R
150
Frequency(MHz)
450
Z
300
R
X
0
GZ2012D421TF
600
375
Z
100
Frequency(MHz)
500
1
10
GZ2012D301TF
GZ2012D221TF
400
0
1
Frequency(MHz)
Frequency(MHz)
200
0
3000
Impedance(Ω)
0
1
10
100
Frequency(MHz)
1000
3000
0
1
10
100
Frequency(MHz)
1000
3000
0
1
10
100
Frequency(MHz)
1000
3000
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 16 of 17
GZ2012 series
GZ2012E800TF
500
300
250
400
Z
Z
Impedance(Ω)
200
R
80
Z
Impedance(Ω)
120
Impedance(Ω)
GZ2012E301TF
GZ2012E181TF
160
R
300
150
R
200
100
40
X
0
1
10
100
1000
0
3000
0
1
10
Frequency(MHz)
100
R
1
10
300
X
100
1000
3000
1
10
100
1000
3000
5
20
R
10
0
100
1000
3000
1
10
100
1000
0
3000
3000
1000
3000
1000
3000
R
X
1
10
GZ2012U221TF
GZ2012U121TF
400
Z
Impedance(Ω)
120
R
60
30
300
Impedance(Ω)
Z
R
80
Z
200
40
R
100
X
100
100
Frequency(MHz)
160
10
30
Frequency(MHz)
GZ2012U700TF
120
1
1000
Z
15
X
Frequency(MHz)
90
3000
GZ2012U300TF
Z
X
10
1000
60
Impedance(Ω)
Impedance(Ω)
R
1
100
45
Z
10
10
Frequency(MHz)
30
15
1
GZ2012U170TF
GZ2012U100TF
0
X
0
Frequency(MHz)
Frequency(MHz)
20
3000
R
600
X
0
1000
Z
Impedance(Ω)
Impedance(Ω)
Impedance(Ω)
900
200
200
100
GZ2012E102TF
Z
400
R
0
10
1200
600
Z
400
1
Frequency(MHz)
800
600
Impedance(Ω)
3000
GZ2012E601TF
GZ2012E501TF
Impedance(Ω)
1000
X
Frequency(MHz)
800
0
100
X
50
X
1000
0
3000
1
10
Frequency(MHz)
100
X
1000
0
3000
1
10
Frequency(MHz)
100
Frequency(MHz)
GZ2012U301TF
GZ2012U421TF
400
GZ2012U601TF
600
800
Z
300
Impedance(Ω)
200
R
300
100
600
Z
Impedance(Ω)
Impedance(Ω)
450
R
150
X
Z
R
400
200
X
0
1
10
100
1000
3000
Frequency(MHz)
1200
Z
Impedance(Ω)
R
600
300
X
0
1
10
100
Frequency(MHz)
1
10
100
Frequency(MHz)
GZ2012U102TF
900
0
1000
3000
X
1000
3000
0
1
10
100
Frequency(MHz)
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 17 of 17
GZ3216 series
GZ3216D310TF
30
60
Z
20
R
10
GZ3216D600TF
160
120
Z
R
40
20
X
Impedance(Ω)
80
Impedance(Ω)
Impedance(Ω)
GZ3216D000TF
40
Z
R
80
40
X
X
1
10
100
1000
0
3000
1
10
Frequency(MHz)
1000
3000
GZ3216D800TF
100
1000
3000
1000
3000
1000
3000
1000
3000
GZ3216D221TF
GZ3216D121TF
400
200
300
Z
Impedance(Ω)
Z
R
150
80
R
Z
R
200
100
40
100
50
X
0
1
10
100
1000
0
3000
X
1
10
100
X
1000
3000
Z
GZ3216D601TF
600
Z
400
400
R
200
X
1000
0
3000
1
10
Frequency(MHz)
750
R
800
R
250
X
X
0
Frequency(MHz)
Z
500
400
400
1000
3000
100
GZ3216U601TF
Z
Impedance(Ω)
R
100
10
1000
1200
Z
10
1
Frequency(MHz)
1600
1200
1
0
3000
GZ3216D122TF
GZ3216D102TF
Impedance(Ω)
X
1000
Frequency(MHz)
1600
800
100
Impedance(Ω)
100
R
200
X
10
Z
Impedance(Ω)
Impedance(Ω)
Impedance(Ω)
100
100
800
600
R
1
10
Frequency(MHz)
800
200
1
GZ3216D501TF
GZ3216D301TF
400
300
0
Frequency(MHz)
Frequency(MHz)
0
10
Frequency(MHz)
250
120
0
1
Frequency(MHz)
160
Impedance(Ω)
100
0
Impedance(Ω)
0
1
10
100
Frequency(MHz)
X
1000
3000
0
1
10
100
Frequency(MHz)
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