GZ1005U102CTF

Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 1 of 17 S P E C I F I C AT I O N S Customer Product Name Multi-layer Chip Ferrite Bead Sunlord Part Number GZ Series Customer Part Number [ New Released, Revised] SPEC No.: GZ10130000 【This SPEC is total 17 pages including specifications and appendix.】 【ROHS Compliant Parts】 Approved By Checked By Issued By Shenzhen Sunlord Electronics Co., Ltd. Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110 Tel: 0086-755-29832660 Fax: 0086-755-82269029 E-Mail: sunlord@sunlordinc.com 【For Customer approval Only】 Qualification Status: Full Approved By Comments: Verified By Date: Restricted Rejected Re-checked By Checked By Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 2 of 17 【Version change history】 Rev. Effective Date Changed Contents Change Reasons Approved By 01 / New release / Hai Guo Sunlord 1. Specifications for Multi-layer Chip Ferrite Bead Page 3 of 17 Scope This specification applies to GZ Series of multi-layer ferrite chip bead. 2. Product Description and Identification (Part Number) 1) Description: GZ Series of multi-layer ferrite chip bead. 2) Product Identification (Part Number) GZ ※※※※ ① ② 〇 XXX ◎ F ③ ④ ⑤ ⑥ Type ① GZ For General Use Material Code ③ D, U, E Packing ⑤ T External Dimensions ② 0603 [0201] 0.6 X 0.3 1005 [0402] 1.0 X 0.5 1608 [0603] 1.6 X 0.8 2012 [0805] 2.0 X 1.25 3216 [1206] 3.2 X 1.6 Tape Carrier Package Nominal ④ Impedance Example Nominal Value 300 30Ω 121 120Ω HSF Products ⑥ Hazardous Substance Free Products 3. (L X W)[mm] Electrical Characteristics Please refer to Appendix A (Page 9~17). 4. 1) Operating and storage temperature range (individual chip without packing): -55℃ ~ +125℃. 2) Storage temperature range (packaging conditions):-10℃~+40℃ and RH 70% (Max.) Shape and Dimensions 1) Dimensions and recommended PCB pattern for reflow soldering: See Fig.4-1, Fig.4-2 and Table 4-1. 2) Structure: See Fig. 4-3 and Fig. 4-4. Solder-resist Chip Bead C Land pattern B A B Fig. 4-2 Fig. 4-1 Unit: mm [inch] [Table 4-1] Type 0603 [0201] 1005 [0402] L 0.6±0.05 [.024±0.002] 1.0±0.15 [0.039±0.006] W 0.3±0.05 [.012±.002] 0.5±0.15 [0.020±0.006] T 0.3±0.05 [.012±.002] 0.5±0.15 [0.020±0.006] a 0.15±0.05 [.006±.002] 0.25±0.1 [0.010±0.004] 1608 [0603] 1.6±0.15 [0.063±0.006] 0.8±0.15 [0.031±0.006] 0.8±0.15 [0.031±0.006] 0.3±0.2 [0.012±0.008] 1.25±0.2 [0.049±0.008] 1.6±0.2 [0.063±0.008] 0.85±0.2 [0.033±0.008] 0.85±0.2 [0.033±0.008] 0.5±0.3 [0.020±0.012] 0.5±0.3 [0.020±0.012] 2.0 (+0.3, -0.1) [0.079(+0.012,-0.004)] 3.2±0.2 [0.126±0.008] L a ④-2 Ni ④-1 Ag W ② ③ Fig. 4-3 ④ 0.2~0.3 0.2~0.3 0.3~0.35 0.45~0.55 0.40~0.50 0.45~0.55 0.60~0.80 0.60~0.80 0.60~0.80 0.80~1.20 0.80~1.20 0.90~1.60 1.80~2.50 1.00~1.50 1.20~2.00 ① Ferrite for Bead Series Ferrite Sn ① C ② Internal electrode (Ag) T a B Structure of Electro-plating T 2012 [0805] 3216 [1206] A ③ Pull out electrode( Ag) ④-1 Terminal electrode: Inside (Ag) ④-2 Outside (Electro-plating Ni-Sn) Fig. 4-4 Sunlord 3) Specifications for Multi-layer Chip Ferrite Bead Page 4 of 17 Material Information: See Table 4-2. [Table 4-2] Part Name Material Name ① Ferrite Body Ferrite Powder ② Inner Coils Silver Paste ③ Pull-out Electrode (Ag) Silver Paste ④-1 Terminal Electrode: Inside Ag ④-2 Electro-Plating: Ni/Sn plating Termination Silver Composition Plating Chemicals Test and Measurement Procedures 5.1 Test Conditions 5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86kPa to 106kPa 5.1.2 If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86kPa to 106kPa 5.2 Visual Examination a. Inspection Equipment: 20× magnifier 5.3 Electrical Test 5.3.1 DC Resistance (DCR) a. Refer to Appendix A. b. Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent. 5.3.2 Impedance (Z) a. b. Refer to Appendix A. Test equipment: High Accuracy RF Impedance /Material Analyzer-E4991A or equivalent. Test fixture: HP16197A for 0603, HP16192A for 1005/1608/2012/3216. Test signal: -20dBm or 50mV c. Test frequency refers to Appendix A. 5.3.3 Rated Current a. Refer to Appendix A. b. Test equipment (see Fig.5.3.3-1): Electric Power, Electric current meter, Thermometer. c. Measurement method (see Fig. 5.3.3-1): 1. Set test current to be 0 mA. 2. Measure initial temperature of chip surface. 3. Gradually increase voltage and measure chip temperature for corresponding current. d. Definition of Rated Current (Ir): Ir is direct electric current as chip surface temperature rose just 20℃ against chip initial surface temperature (Ta) (see Fig. 5.3.3-2) Thermometer Electric Power Electric Current Meter Temperature (℃) +20 Ta Chip 0 R Rated current Fig. 5.3.3-1 e. When operating temperatures exceeding +85℃, derating of current is necessary for chip ferrite beads for which rated current is 1000mA over. Please apply the derating curve shown in chart according to the operating temperature. Ir (mA) Fig. 5.3.3-2 3 Derated Current [A] 5. Code 2.2 2 1.5 1 0 0 50 85 100 125 Operating Temperature[℃] 150 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 5 of 17 5.4 Reliability Test Items Requirements Test Methods and Remarks 5.4.1 No removal or split of the termination or other Terminal defects shall occur. Strength ① Solder the bead to the testing jig (glass epoxy board shown in Fig. 5.4.1-1) using leadfree solder. Then apply a force in the direction of the arrow. Chip ② F Mounting Pad 2N force for 0603 series, 5N force for 1005 and 1608 series 10N force for 2012 and 3216 series. Glass Epoxy Board ③ Keep time: 10±1s. ④ Speed: 1.0mm/s. ① Solder the bead to the test jig (glass epoxy board shown in Fig. Fig.5.4.1-1 5.4.2 Resistance No visible mechanical damage. to 5.4.2-1) Using a leadfree solder. Then apply a force in the Unit: mm [inch] Flexure Type a b c 0603[0201] 0.25 0.8 0.3 1005[0402] 0.4 1.5 0.5 1608[0603] 1.0 3.0 1.2 2012[0805] 1.2 4.0 1.65 3216[1206] 2.2 5.0 2.0 direction shown Fig. 5.4.2-2. ② Flexure: 2mm. ③ Pressurizing Speed: 0.5mm/sec. ④ Keep time: 30 sec. 20 Φ4.5 b R230 Flexure 40 c a ① No visible mechanical damage. Vibration ② Impedance change: within ±20% Cu pad Solder mask 45[1.772] 45[1.772] 100 Fig. 5.4.2-1 5.4.3 10 Fig. 5.4.2-2 ① Solder the bead to the testing jig (glass epoxy board shown in Fig. 5.4.3-1) using leadfree solder. ② The bead shall be subjected to a simple harmonic motion having total amplitude of 1.5 mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. ③ The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3mutually perpendicular directions (total of 6 hours). Glass Epoxy Board Fig. 5.4.3-1 5.4.4 Dropping ① No visible mechanical damage. ② Impedance change: within ±20%. Drop chip bead 10 times on a concrete floor from a height of 100 cm. 5.4.5 Impedance change should be within ±20% of Temperature range: -55℃ ~ 125℃. Temperature initial value measuring at 20℃. Reference temperature: +20℃. 5.4.6 ① No visible mechanical damage. ① Solder temperture:240±2℃ Solderability ② Wetting shall exceed 75% coverage for ② Duration: 3 sec. 0603 series; exceed 95% for others ③ Solder: Sn/3.0Ag/0.5Cu. ④ Flux: 25% Resin and 75% ethanol in weight. 5.4.7 ① No visible mechanical damage. ① Solder temperature :260±3℃ Resistance to ② Wetting shall exceed 75% coverage for ② Duration: 5 sec. 0603 series; exceed 95% for others ③ Solder: Sn/3.0Ag/0.5Cu. Impedance change: within ±20%. ④ Flux: 25% Resin and 75% ethanol in weight. ⑤ The chip shall be stabilized at normal condition for 1~2 hours Soldering Heat ③ before measuring. Sunlord Specifications for Multi-layer Chip Ferrite Bead 5.4.8 ① No mechanical damage. Thermal Shock ② Impedance change: Within ±20%. 30 min. 125℃ Page 6 of 17 ① Temperature, Time: (See Fig.5.4.8-1) ② Transforming interval: Max. 20 sec. ③ Tested cycle: 100 cycles. ④ The chip shall be stabilized at normal condition for 1~2 hours -55℃ for 30±3 min→125℃ for 30±3min. 30 min. Ambient before measuring. Temperature 30 min. -55℃ 20sec. (max.) Fig. 5.4.8-1 5.4.9 ① No mechanical damage. ① Temperature: -55±2℃ Resistance to ② Impedance change: within ±20%. ② Duration: 1000 ③ The chip shall be stabilized at normal condition for 1~2 hours Low +24 hours. before measuring. Temperature 5.4.10 ① No mechanical damage. ① Temperature: 125±2℃ Resistance to ② Impedance change: within ±20%. ② Duration: 1000 ③ The chip shall be stabilized at normal condition for 1~2 hours High +24 hours. before measuring. Temperature 5.4.11 ① No mechanical damage. ① Temperature: 60±2℃ Damp Heat ② Impedance change: Within ±20%. ② Humidity: 90% to 95% RH. ③ Duration: 1000 ④ The chip shall be stabilized at normal condition for 1~2 hours (Steady States) +24 hours. before measuring. 5.4.12 ① No visible mechanical damage. ① Temperature: 60±2℃ Loading Under ② Impedance change: within ±20%. ② Humidity: 90% to 95% RH. ③ Duration: 1000 ④ Applied current: Rated current. ⑤ The chip shall be stabilized at normal condition for 1~2 hours Damp Heat +24 hours. before measuring. 5.4.13 ① No visible mechanical damage. ① Temperature: 125±2℃ Loading at High ② Impedance change: within ±20%. ② Duration: 1000 Temperature ③ Applied current: Rated current. (Life Test) ④ The chip shall be stabilized at normal condition for 1~2 hours +24 hours. before measuring. 6. Packaging, Storage 6.1 Packaging Tape Carrier Packaging: Packaging code: T a. Tape carrier packaging are specified in attached figure Fig.6.1-1~3 b. Tape carrier packaging quantity please see the following table: Type 0603[0201] 1005[0402] 1608[0603] 2012[0805] T(mm) 0.3±0.15 0.5±0.15 0.8±0.15 0.85±0.2 0.85±0.2 Tape Paper Tape Paper Tape Paper Tape Paper Tape Paper Tape Quantity 15K 10K 4K 4K 3K (1) Taping Drawings (Unit: mm) Paper Tape Top Tape Paper Tape Sprocket Hole Bottom Tape Chip Cavity Fig. 6.1-1 Remark: The sprocket holes are to the right as the tape is pulled toward the user. 3216[1206] Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 7 of 17 (2) Taping Dimensions (Unit: mm) Sprocket Hole Φ1.5 (+0.1,0) Chip Cavity Paper Tape 1.75±0.1 Type B P 8.0±0.3 3.5±0.05 A T 4.0±0.1 A B P T max 0603[0201] 0.40±0.1 0.70±0.1 2.0±0.1 0.55 1005[0402] 0.65±0.1 1.15±0.1 2.0±0.05 0.8 1608[0603] 1.0±0.2 1.8±0.2 4.0±0.1 1.1 2012[0805] 1.5±0.2 2.3±0.2 4.0±0.1 1.1 3216[1206] 1.9±0.2 3.5±0.2 4.0±0.1 1.1 Fig. 6.1-2 Direction of Feed (3) Reel Dimensions (Unit: mm) 4.3±0.2mm 8.4+1.5/-0.0mm 2.45±0.2mm 4.0±0.1mm 5.0±0.1mm 58±2.0mm 13.5±0.2mm 3.0±0.1mm max＜14.4mm 178±2.0mm Fig. 6.1-3 6.2 Storage a. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Package must be stored at 40℃ or less and 70% RH or less. b. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H2S). c. d. Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight. Solderability of the product s with external dimensions as 0603[0201] specified in Clause 5.4.6 shall be guaranteed for 6months from the date of delivery on condition that they are stored at the environment specified in Clause 3. For those parts, which passed more than 6 months shall be checked solder-ability before use. e. Solderability of the products, except ones with external dimensions as 0603[0201], specified in Clause 5.4.6 shall be guaranteed for 12 months from the date of delivery on condition that they are stored at the environment specified in Clause 3. For those parts, which passed more than 12 months shall be checked solder-ability before use. 7. Recommended Soldering Technologies 7.1 Re-flowing Profile: △ Preheat condition: 150 ~200℃/60~120sec. △ Allowed time above 217℃: 60~90sec. △ Max temp: 260℃ △ Max time at max temp: 10sec. △ Solder paste: Sn/3.0Ag/0.5Cu △ Allowed Reflow time: 2x max [Note: The reflow profile in the above table is only for 217℃ the customer's specific board design, solder paste and process, and should not exceed the parameters as the Reflow profile shows.] Max Ramp Up Rate=3℃/sec. Max Ramp Down Rate=6℃/sec. 60～90sec. 200℃ 150℃ 60～120sec. qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on Peak 260℃ max 260℃ 25℃ Time 25℃ to Peak =8 min max Sunlord Specifications for Multi-layer Chip Ferrite Bead 7.2 Iron Soldering Profile. 3sec. Max. Iron soldering power: Max.30W △ △ Pre-heating: 150 ℃ / 60sec. △ Soldering Tip temperature: 350℃Max. △ Soldering time: 3sec Max. △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.1 times for iron soldering 350℃ Soldering Iron Power: max. 30W Diameter of Soldering [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] 8. Iron 1.0mm max. Tc ℃ Supplier Information a) Supplier: Shenzhen Sunlord Electronics Co., Ltd. b) Manufacture: Shenzhen Sunlord Electronics Co., Ltd. c) Page 8 of 17 Manufacturing Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 9 of 17 Appendix A: Electrical Characteristics I. GZ0603 Series of Beads Z Test Freq. DCR Ir Thickness (MHz) (Ω) Max. (mA) Max. (mm) [inch] 60±25% 100 0.40 200 80±25% 100 0.60 200 GZ0603D121TF 120±25% 100 0.80 200 GZ0603D241TF 240±25% 100 1.00 200 GZ0603D601TF 600±25% 100 1.70 200 Part Number Impedance (Ω) GZ0603D600TF GZ0603D800TF 0.3±0.05 [.012±.002] I. GZ1005 Series of Beads Z Test Freq. DCR Ir Thickness (MHz) (Ω) Max. (mA) Max. (mm) [inch] 0~15 100 0.05 500 GZ1005D310TF 31±25% 100 0.20 300 GZ1005D600TF 60±25% 100 0.30 200 GZ1005D800TF 80±25% 100 0.35 200 GZ1005D121TF 120±25% 100 0.40 200 GZ1005D221TF 220±25% 100 0.45 150 GZ1005D301TF 300±25% 100 0.50 100 GZ1005D421TF 420±25% 100 0.60 100 GZ1005D501TF 500±25% 100 0.80 100 GZ1005D601TF 600±25% 100 0.90 100 Part Number Impedance (Ω) GZ1005D100TF GZ1005D751TF 750±25% 100 1.00 100 GZ1005D102TF 1000±25% 100 1.20 100 GZ1005D152TF 1500±25% 100 1.60 100 0.5±0.15 GZ1005E800TF 80±25% 100 0.35 200 [.020±.006] GZ1005E121TF 120±25% 100 0.40 200 GZ1005E241TF 240±25% 100 0.50 200 GZ1005E601TF 600±25% 100 0.90 100 GZ1005U100TF 0~15 100 0.05 500 GZ1005U300TF 30±25% 100 0.20 300 GZ1005U700TF 70±25% 100 0.30 200 GZ1005U121TF 120±25% 100 0.40 200 GZ1005U221TF 220±25% 100 0.50 100 GZ1005U301TF 300±25% 100 0.60 100 GZ1005U421TF 420±25% 100 0.80 100 GZ1005U601TF 600±25% 100 0.90 100 GZ1005U102TF 1000±25% 100 1.20 100 II. GZ1608 Series of Beads Part Number Impedance (Ω) Z Test Freq. DCR Ir Thickness (MHz) (Ω) Max. (mA) Max. (mm) [inch] GZ1608D110TF 0~15 100 0.05 2000 GZ1608D300TF 30±25% 100 0.05 2000 GZ1608D600TF 60±25% 100 0.10 500 GZ1608D800TF 80±25% 100 0.15 400 GZ1608D101TF 100±25% 100 0.20 300 GZ1608D121TF 120±25% 100 0.20 300 GZ1608D221TF 220±25% 100 0.30 300 GZ1608D301TF 300±25% 100 0.35 200 GZ1608D471TF 470±25% 100 0.45 200 GZ1608D601TF 600±25% 100 0.45 200 GZ1608D751TF 750±25% 100 0.50 200 GZ1608D102TF 1000±25% 100 0.60 200 GZ1608D152TF 1500±25% 100 0.70 150 GZ1608D182TF 1800±25% 100 0.90 100 GZ1608D202TF 2000±25% 100 1.20 100 GZ1608D222TF 2200±25% 100 1.20 100 GZ1608E121TF 120±25% 100 0.20 300 0.8±0.15 [.031±.006] Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 10 of 17 Z Test Freq. DCR Ir Thickness (MHz) (Ω) Max. (mA) Max. (mm) [inch] 180±25% 100 0.30 300 600±25% 100 0.45 200 1000±25% 100 0.60 200 GZ1608U100TF 0~15 100 0.05 2000 GZ1608U300TF 30±25% 100 0.05 2000 Part Number Impedance (Ω) GZ1608E181TF GZ1608E601TF GZ1608E102TF GZ1608U600TF 60±25% 100 0.10 500 0.8±0.15 GZ1608U121TF 120±25% 100 0.20 300 [.031±.006] GZ1608U221TF 220±25% 100 0.30 300 GZ1608U301TF 300±25% 100 0.35 200 GZ1608U471TF 470±25% 100 0.40 200 GZ1608U601TF 600±25% 100 0.50 200 GZ1608U102TF 1000±25% 100 0.60 200 III. GZ2012 Series of Beads Part Number Impedance (Ω) Z Test Freq. DCR Ir Thickness (MHz) (Ω) Max. (mA) Max. (mm) [inch] GZ2012D070TF 0~15 100 0.04 2000 GZ2012D190TF 19±25% 100 0.04 2000 GZ2012D300TF 30±25% 100 0.05 1500 GZ2012D800TF 80±25% 100 0.10 1000 GZ2012D121TF 120±25% 100 0.15 800 GZ2012D181TF 180±25% 100 0.18 700 GZ2012D221TF 220±25% 100 0.20 600 GZ2012D301TF 300±25% 100 0.20 500 GZ2012D421TF 420±25% 100 0.30 500 GZ2012D501TF 500±25% 100 0.30 500 GZ2012D601TF 600±25% 100 0.30 500 GZ2012D751TF 750±25% 100 0.35 500 GZ2012D102TF 1000±25% 100 0.35 500 GZ2012D152TF 1500±25% 100 0.40 500 GZ2012D202TF 2000±25% 100 0.50 500 GZ2012E800TF 80±25% 100 0.10 1000 GZ2012E181TF 180±25% 100 0.20 600 GZ2012E301TF 300±25% 100 0.20 500 GZ2012E501TF 500±25% 100 0.30 500 GZ2012E601TF 600±25% 100 0.30 500 GZ2012E102TF 1000±25% 100 0.35 500 GZ2012U100TF 0~15 100 0.04 2200 GZ2012U170TF 17±25% 100 0.04 2000 GZ2012U300TF 30±25% 100 0.05 1500 GZ2012U700TF 70±25% 100 0.10 1000 GZ2012U121TF 120±25% 100 0.15 800 GZ2012U221TF 220±25% 100 0.20 600 GZ2012U301TF 300±25% 100 0.20 500 GZ2012U421TF 420±25% 100 0.25 500 GZ2012U601TF 600±25% 100 0.30 500 GZ2012U102TF 1000±25% 100 0.40 500 0.85±0.2 [.033±.008] IV. GZ 3216 Series of Beads Z Test Freq. DCR Ir Thickness (MHz) (Ω) Max. (mA) Max. (mm) [inch] 0~15 100 0.03 2200 0.85±0.2 GZ3216D310TF 31±25% 100 0.05 2000 [.033±.008] GZ3216D600TF 60±25% 100 0.10 1000 GZ3216D800TF 80±25% 100 0.10 1000 GZ3216D121TF 120±25% 100 0.10 1000 GZ3216D221TF 220±25% 100 0.20 600 GZ3216D301TF 300±25% 100 0.20 600 GZ3216D501TF 500±25% 100 0.30 600 GZ3216D601TF 600±25% 100 0.30 600 Part Number Impedance (Ω) GZ3216D000TF Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 11 of 17 Z Test Freq. DCR Ir (MHz) (Ω) Max. (mA) Max. 1000±25% 100 0.60 500 1200±25% 100 0.60 300 600±25% 100 0.30 600 Part Number Impedance (Ω) GZ3216D102TF GZ3216D122TF GZ3216U601TF Products with other electrical characteristic can be provided upon customer’s request. Please contact your local sales. D, E, U Material Comparison 250 200 Impedance(Ω ) GZ1608E121TF 150 GZ1608D121TF 100 GZ1608U121TF 50 0 1 10 100 1000 3000 Frequency(MHz) Impedance Frequency Characteristics GZ0603 series GZ0603D800TF GZ0603D600TF Impedance(Ω) Impedance(Ω) R 100 Z Z 150 Z Impedance(Ω) 150 R 100 50 50 1 10 100 1000 Frequency(MHz) 0 3000 200 R 100 X X 0 GZ0603D121TF 300 200 200 1 10 100 1000 X 3000 0 Frequency(MHz) GZ0603D241TF 1 10 100 1000 3000 Frequency(MHz) GZ0603D601TF 600 1200 Z Z 900 Impedance(Ω) Impedance(Ω) 450 R 300 150 R 600 300 X 0 1 10 100 X 1000 3000 0 Frequency(MHz) 1 10 100 1000 3000 Frequency(MHz) GZ1005 series GZ1005D310TF GZ1005D100TF GZ1005D600TF 80 30 120 Z R 10 X 90 Impedance(Ω) Impedance(Ω) Impedance(Ω) 60 20 Z 40 R X 20 Z R 60 30 X 1 10 100 1000 3000 1 10 GZ1005D800TF 1000 0 3000 10 Z R 50 1000 3000 1000 3000 GZ1005D221TF 400 Z 180 Impedance(Ω) 150 100 Frequency(MHz) 240 100 1 GZ1005D121TF 200 Impedance(Ω) 100 Frequency(MHz) Frequency(MHz) 300 Impedance(Ω) 0 0 R 120 60 R 200 100 X X Z X 0 1 10 100 Frequency(MHz) 1000 3000 0 1 10 100 Frequency(MHz) 1000 3000 0 1 10 100 Frequency(MHz) Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 12 of 17 GZ1005 series GZ1005D301TF GZ1005D501TF GZ1005D421TF 500 800 800 Z 400 R R 400 200 10 100 1000 0 3000 1 10 Frequency(MHz) 100 1000 GZ1005D601TF 1000 3000 1000 3000 1000 3000 1000 3000 1000 3000 GZ1005D102TF 1200 Z Impedance(Ω) Impedance(Ω) R 100 1500 900 R 600 250 Z 900 R 600 300 1 10 300 X X 100 1000 0 3000 Frequency(MHz) 1 10 100 1000 GZ1005D152TF Impedance(Ω) Impedance(Ω) 500 100 GZ1005E121TF Z Z 150 R 80 R 100 40 50 X X 10 10 200 120 R 1 1 GZ1005E800TF Z 1000 X Frequency(MHz) 160 1500 0 3000 Frequency(MHz) 2000 0 10 GZ1005D751TF Z 500 1 Frequency(MHz) 1200 750 0 3000 Frequency(MHz) 1000 0 X Impedance(Ω) 1 200 X Impedance(Ω) 0 R 400 200 X 100 Impedance(Ω) Z Impedance(Ω) Impedance(Ω) 300 Z 600 600 100 1000 0 3000 Frequency(MHz) 1 10 100 X 1000 0 3000 1 10 Frequency(MHz) GZ1005E241TF GZ1005E601TF 400 100 Frequency(MHz) GZ1005U100TF 1000 12 Z 750 200 R 500 100 250 1 10 R 6 X 3 X X 0 Impedance(Ω) R Z 9 Z Impedance(Ω) Impedance(Ω) 300 100 1000 0 3000 1 10 Frequency(MHz) 100 1000 0 3000 1 10 Frequency(MHz) GZ1005U300TF GZ1005U121TF GZ1005U700TF 50 100 Frequency(MHz) 120 200 90 30 R 20 10 0 10 100 Frequency(MHz) R 60 Z R 100 30 X 1 150 Z Impedance(Ω) Z Impedance(Ω) Impedance(Ω) 40 50 X 1000 3000 0 1 10 100 Frequency(MHz) X 1000 3000 0 1 10 100 Frequency(MHz) Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 13 of 17 GZ1005 series GZ1005U221TF Z 100 450 R 200 R Z Z Impedance(Ω) 300 600 Impedance(Ω) 300 Impedance(Ω) 400 200 GZ1005U421TF GZ1005U301TF 400 100 150 X X 0 1 10 R 300 100 1000 0 3000 1 10 X 100 Frequency(MHz) 1000 0 3000 1 10 Frequency(MHz) GZ1005U601TF 100 1000 3000 Frequency(MHz) GZ1005U102TF 800 1200 600 R 400 Z 900 Impedance(Ω) Impedance(Ω) Z R 600 200 300 X 0 1 10 X 100 1000 3000 0 Frequency(MHz) 1 10 100 1000 3000 Frequency(MHz) GZ1608 series GZ1608D110TF Z R 5 X 80 120 60 90 Impedance(Ω) 10 Impedance(Ω) Impedance(Ω) GZ1608D600TF GZ1608D300TF 15 Z R 40 20 Z R 60 30 X 1 10 100 1000 0 3000 1 10 Frequency(MHz) GZ1608D800TF 1000 10 100 3000 1000 3000 1000 3000 GZ1608D121TF 250 150 Z Impedance(Ω) R Z 150 R 100 40 R 100 50 50 X 10 100 1000 0 3000 1 10 GZ1608D221TF 0 3000 1 10 375 Z 100 600 Z R 250 R GZ1608D471TF 800 Impedance(Ω) 300 100 Frequency(MHz) GZ1608D301TF 500 Impedance(Ω) X 1000 Frequency(MHz) 400 200 100 Z Impedance(Ω) 1 X Frequency(MHz) R 400 125 200 X X X 0 1000 200 Z 80 1 Frequency(MHz) 200 120 0 0 3000 GZ1608D101TF 160 Impedance(Ω) 100 Frequency(MHz) Impedance(Ω) 0 X 1 10 100 Frequency(MHz) 1000 3000 0 1 10 100 Frequency(MHz) 1000 3000 0 1 10 100 Frequency(MHz) Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 14 of 17 GZ1608 series GZ1608D751TF GZ1608D601TF 600 1200 750 R R 500 200 250 10 300 X X 100 1000 0 1 3000 10 Frequency(MHz) 100 3000 1800 Impedance(Ω) Impedance(Ω) 500 R 600 100 1000 3000 1 10 X 100 0 3000 1000 Frequency(MHz) GZ1608D222TF R 600 X Frequency(MHz) Z 1200 X 0 1 10 100 1000 3000 1000 3000 1000 3000 300 Z 240 180 Impedance(Ω) R Z Z Impedance(Ω) Impedance(Ω) 3000 GZ1608E181TF 240 1500 1000 Frequency(MHz) GZ1608E121TF 2500 3000 GZ1608D202TF Z 1200 R 1000 2400 1800 Z 2000 100 Impedance(Ω) 1500 10 10 Frequency(MHz) 2400 1 1 GZ1608D182TF GZ1608D152TF 0 0 1000 Frequency(MHz) 2000 1000 R 600 X 1 Z 900 Z Impedance(Ω) Impedance(Ω) Z 400 0 GZ1608D102TF 1000 Impedance(Ω) 800 R 180 120 1000 R 120 60 500 1 10 100 1000 0 3000 1 10 Frequency(MHz) 100 3000 Z 900 R GZ1608U100TF Z Z R 600 200 100 15 Impedance(Ω) Impedance(Ω) 10 Frequency(MHz) 1200 400 1 GZ1608E102TF GZ1608E601TF 600 X Frequency(MHz) 800 10 R 5 300 X X 0 1000 0 Impedance(Ω) 0 60 X X 1 10 X 100 1000 0 3000 1 10 Frequency(MHz) 100 1000 0 3000 1 10 Frequency(MHz) GZ1608U300TF GZ1608U121TF GZ1608U600TF 60 80 45 60 100 Frequency(MHz) 200 Z 30 R 15 R 40 20 1 10 100 50 X 1000 0 3000 1 10 Frequency(MHz) 100 X 1000 0 3000 GZ1608U221TF GZ1608U301TF GZ1608U471TF Impedance(Ω) Impedance(Ω) Z 300 R 450 R Frequency(MHz) R 150 100 X 100 Z 300 200 100 100 600 Impedance(Ω) Z 200 10 10 Frequency(MHz) 400 1 1 Frequency(MHz) 300 0 R 100 X 0 Z 150 Impedance(Ω) Impedance(Ω) Impedance(Ω) Z X 1000 3000 0 1 10 100 Frequency(MHz) X 1000 3000 0 1 10 100 Frequency(MHz) 1000 3000 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 15 of 17 GZ1608 series GZ1608U102TF GZ1608U601TF 800 1200 600 900 Z Impedance(Ω) Impedance(Ω) Z R 400 R 600 200 300 X X 0 1 10 100 1000 0 3000 1 10 Frequency(MHz) 100 1000 3000 Frequency(MHz) GZ2012 series 60 60 45 Impedance(Ω) 10 R 5 X 30 R 15 1 10 100 1000 0 3000 10 100 1000 10 100 3000 1000 3000 1000 3000 300 R 120 Z 200 60 40 1000 GZ2012D181TF Z Impedance(Ω) R 3000 400 180 Z 1000 Frequency(MHz) 240 80 1 GZ2012D121TF GZ2012D800TF 160 120 0 3000 X Frequency(MHz) Frequency(MHz) Impedance(Ω) 15 X 1 R 30 Impedance(Ω) 0 Z 45 Z Impedance(Ω) Z Impedance(Ω) GZ2012D300TF GZ2012D190TF GZ2012D070TF 15 R 100 X X X 0 1 10 100 1000 3000 1 10 100 1000 300 450 Z Impedance(Ω) Impedance(Ω) R 250 100 125 10 100 X X 1000 0 3000 1 10 100 1000 GZ2012D501TF GZ2012D751TF 750 R 400 150 R 500 200 250 X X X 1000 0 3000 1 10 Frequency(MHz) 100 1000 0 3000 1 10 Frequency(MHz) GZ2012D102TF GZ2012D202TF 2000 Z 2500 2000 1500 1500 R 1000 300 Z Impedance(Ω) Z Impedance(Ω) R 600 R 1000 500 500 X X X 0 100 Frequency(MHz) GZ2012D152TF 1200 Impedance(Ω) Z Impedance(Ω) Z Impedance(Ω) Impedance(Ω) 300 100 1000 600 R 900 10 GZ2012D601TF Z 100 1 Frequency(MHz) 800 10 0 3000 Frequency(MHz) 600 1 R 150 Frequency(MHz) 450 Z 300 R X 0 GZ2012D421TF 600 375 Z 100 Frequency(MHz) 500 1 10 GZ2012D301TF GZ2012D221TF 400 0 1 Frequency(MHz) Frequency(MHz) 200 0 3000 Impedance(Ω) 0 1 10 100 Frequency(MHz) 1000 3000 0 1 10 100 Frequency(MHz) 1000 3000 0 1 10 100 Frequency(MHz) 1000 3000 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 16 of 17 GZ2012 series GZ2012E800TF 500 300 250 400 Z Z Impedance(Ω) 200 R 80 Z Impedance(Ω) 120 Impedance(Ω) GZ2012E301TF GZ2012E181TF 160 R 300 150 R 200 100 40 X 0 1 10 100 1000 0 3000 0 1 10 Frequency(MHz) 100 R 1 10 300 X 100 1000 3000 1 10 100 1000 3000 5 20 R 10 0 100 1000 3000 1 10 100 1000 0 3000 3000 1000 3000 1000 3000 R X 1 10 GZ2012U221TF GZ2012U121TF 400 Z Impedance(Ω) 120 R 60 30 300 Impedance(Ω) Z R 80 Z 200 40 R 100 X 100 100 Frequency(MHz) 160 10 30 Frequency(MHz) GZ2012U700TF 120 1 1000 Z 15 X Frequency(MHz) 90 3000 GZ2012U300TF Z X 10 1000 60 Impedance(Ω) Impedance(Ω) R 1 100 45 Z 10 10 Frequency(MHz) 30 15 1 GZ2012U170TF GZ2012U100TF 0 X 0 Frequency(MHz) Frequency(MHz) 20 3000 R 600 X 0 1000 Z Impedance(Ω) Impedance(Ω) Impedance(Ω) 900 200 200 100 GZ2012E102TF Z 400 R 0 10 1200 600 Z 400 1 Frequency(MHz) 800 600 Impedance(Ω) 3000 GZ2012E601TF GZ2012E501TF Impedance(Ω) 1000 X Frequency(MHz) 800 0 100 X 50 X 1000 0 3000 1 10 Frequency(MHz) 100 X 1000 0 3000 1 10 Frequency(MHz) 100 Frequency(MHz) GZ2012U301TF GZ2012U421TF 400 GZ2012U601TF 600 800 Z 300 Impedance(Ω) 200 R 300 100 600 Z Impedance(Ω) Impedance(Ω) 450 R 150 X Z R 400 200 X 0 1 10 100 1000 3000 Frequency(MHz) 1200 Z Impedance(Ω) R 600 300 X 0 1 10 100 Frequency(MHz) 1 10 100 Frequency(MHz) GZ2012U102TF 900 0 1000 3000 X 1000 3000 0 1 10 100 Frequency(MHz) Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 17 of 17 GZ3216 series GZ3216D310TF 30 60 Z 20 R 10 GZ3216D600TF 160 120 Z R 40 20 X Impedance(Ω) 80 Impedance(Ω) Impedance(Ω) GZ3216D000TF 40 Z R 80 40 X X 1 10 100 1000 0 3000 1 10 Frequency(MHz) 1000 3000 GZ3216D800TF 100 1000 3000 1000 3000 1000 3000 1000 3000 GZ3216D221TF GZ3216D121TF 400 200 300 Z Impedance(Ω) Z R 150 80 R Z R 200 100 40 100 50 X 0 1 10 100 1000 0 3000 X 1 10 100 X 1000 3000 Z GZ3216D601TF 600 Z 400 400 R 200 X 1000 0 3000 1 10 Frequency(MHz) 750 R 800 R 250 X X 0 Frequency(MHz) Z 500 400 400 1000 3000 100 GZ3216U601TF Z Impedance(Ω) R 100 10 1000 1200 Z 10 1 Frequency(MHz) 1600 1200 1 0 3000 GZ3216D122TF GZ3216D102TF Impedance(Ω) X 1000 Frequency(MHz) 1600 800 100 Impedance(Ω) 100 R 200 X 10 Z Impedance(Ω) Impedance(Ω) Impedance(Ω) 100 100 800 600 R 1 10 Frequency(MHz) 800 200 1 GZ3216D501TF GZ3216D301TF 400 300 0 Frequency(MHz) Frequency(MHz) 0 10 Frequency(MHz) 250 120 0 1 Frequency(MHz) 160 Impedance(Ω) 100 0 Impedance(Ω) 0 1 10 100 Frequency(MHz) X 1000 3000 0 1 10 100 Frequency(MHz)