115B-AAA0-R01

SPECIFICATION AND PERFORMANCE SERIES: 115B Series FILE: 115B Series_spec DATE: 2012/12/12 Scope: This specification covers the requirements for product performance, test methods and quality assurance provisions of 115B Series. Performance and Descriptions: The product is designed to meet the electrical, mechanical and environmental performance requirements specification. Unless otherwise specified, all tests are performed at ambient environmental conditions. RoHS: All material in according with the RoHS environment related substances list controlled. MATERIAL AND FINISH INSULATOR Material Housing: LCP UL94V-0. Black Cover: LCP UL94V-0. Black CONTACT Material Contact: phosphor bronze C5191 Plating SHELL OR COVER Gold plating on contact area, nickel under plating overall. Material Plating RATING Current Rating: 0.5A per pin Voltage Rating: 30V DC/AC Operating Temperature: -40℃ to +85℃ Storage Temperature: -40℃ to +85℃ The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -1 - SPECIFICATION AND PERFORMANCE SERIES: 115B Series FILE: 115B Series_spec DATE: 2012/12/12 ELECTRICAL Item Requirement Test Condition Contact Resistance Initial: 30 mΩ Maximum After test: 30 mΩ Maximum (EIA 364-23 ) Subject mated contacts assembled in housing to 20mV maximum open circuit at 100 mA maximum The object of this test is to detail a standard method to measure the electrical resistance across a pair of mated contacts such that the insulating films, if present will not be broken or asperity melting will not occur. Insulation Resistance Insulation Resistance: (EIA 364-21 ) 1000MΩMin Apply a 500V DC between adjacent terminals and between terminals to ground Dielectric Withstanding Voltage No flashover or insulation breakdown (EIA 364-20 ) Apply a voltage 500V AC R.M.S for 1 minute between adjacent terminals and between terminals to ground MECHANICAL Item Durability Requirement Test Condition No physical damage. (EIA 364-09 ) Insertion and extraction are repeated 5000 cycles with the actually card at the speed rate of 700 min cycles/hour. Exchange the actually card every 2000cycles. The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -2 - SPECIFICATION Vibration SERIES: 115B Series FILE: 115B Series_spec DATE: 2012/12/12 AND PERFORMANCE No Damage Contact Resistance: 30milliohms MAX Change from initial: 30milliohms Discontinuity: 1microsecond Max. (EIA-364-28) Amplitude:1.52mm P-P or 1.47mm/s^2 Sweep time:10~55~10Hz in 20 minutes Duration:12 time in each (total of 36 times) Electrical: DC 100 mA current Load shall be flowed during the test ENVIRONMENTAL Item Thermal Shock Requirement Test Condition No evidence of damage. (EIA 364-32 I) Subject mated connectors should be tested according to the condition listed below: Temperature: -25 ~ 85℃ Cycles: 5 cycles Exposure time at temp. 30 minutes. Humidity (EIA 364-31) Mate a dummy card and expose to 60±2℃ No appearance damaged for 96 hours Relative humidity 90. Upon completion of the exposure period, the test specimens shall be conditioned at anibient room conditions for 1 to 2hours,after which the specified measurements shall be performed The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -3 - SPECIFICATION Heat Resistance AND PERFORMANCE SERIES: 115B Series FILE: 115B Series_spec DATE: 2012/12/12 (EIA 364-17 ) Mate a dummy card and expose to 70±2℃ No appearance damaged for 96Hr Upon completion of the exposure period,the test specimens shall be conditioned at ambient room conditions for 1 to 2Hr,after which the specified measurements shall be performed. SOLDER ABILITY Item Solderability Requirement Test Condition The surface of the portion to be soldered shall at least 95% covered (EIA 364-52 ) After one hour steam aging. The object of test procedure is to detail a unfirm test methods for determining sim card connector solderability. The test procedure contained here utilizes the solder dip technique. It is not intended to test or evaluate solder cup, solder eyelet, other hand-soldered type or SMT type terminations. Resistance to Soldering Heat 260℃±5℃ 10Sec Peak temperature: 260℃±5℃ 10Sec Soldering temperature: 230℃ Preheating temperature: 150~180℃ The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -4 - SPECIFICATION AND PERFORMANCE SERIES: 115B Series FILE: 115B Series_spec DATE: 2012/12/12 The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -5 -